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公开(公告)号：US20230179170A1
公开(公告)日：2023-06-08
申请号：US17859534
申请日：2022-07-07
发明人： Seung Wook PARK , Seong Hun NA , Jae Hyun JUNG , Sung HAN , Jang Ho PARK
CPC分类号： H03H9/105 , H03H3/02 , H03H9/173 , H03H2003/021
摘要： An acoustic wave resonator package includes an acoustic resonator comprising an acoustic wave generator on a surface of a substrate, a cover member disposed over the acoustic wave generator, a bonding member, disposed between the substrate and the cover member, to bond the substrate and the cover member to each other, and a wiring layer, disposed along surfaces of the cover member, connected to the acoustic resonator. Among the surfaces of the cover member, bonding surfaces to which the bonding member and the wiring layer are bonded at least partially have a roughness Rz in a range of 70 nm to 3.5 µm.
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公开(公告)号：US20210313954A1
公开(公告)日：2021-10-07
申请号：US16936807
申请日：2020-07-23
发明人： Seung Wook PARK , Jae Hyun JUNG , Jae Chang LEE , Dae Hun JEONG , Sang Uk SON , Seong Hun NA
摘要： A bulk-acoustic wave resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the first electrode; a second electrode disposed to cover at least a portion of the piezoelectric layer; a metal pad connected to the first electrode and the second electrode; and a connection member connected an upper surface of the metal pad. A lower end portion of the connection member includes a tapered portion decreasing in a diameter in a direction toward a lower end of the connection member, and an angle between an inclined surface of the tapered portion and the upper surface of the metal pad is 45° to 80°.
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公开(公告)号：US20190140616A1
公开(公告)日：2019-05-09
申请号：US15996790
申请日：2018-06-04
发明人： Seung Wook PARK , Jae Hyun JUNG , Seong Hun NA
摘要： An acoustic wave device includes a substrate, a support portion and a protective member. The substrate has an acoustic wave generator formed on a surface thereof. The support portion is disposed on the surface of the substrate, and includes an accommodating space configured to accommodate the acoustic wave generator. The protective member is coupled to the support portion and disposed to be spaced apart from the acoustic wave generator by a predetermined interval. The protective member is disposed in a seating groove formed in the support portion.
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公开(公告)号：US20180159505A1
公开(公告)日：2018-06-07
申请号：US15675137
申请日：2017-08-11
发明人： Jae Hyun JUNG , Seung Wook PARK , Seong Hun NA
CPC分类号： H03H9/1092 , H01L41/047 , H01L41/053 , H03H9/02228 , H03H9/0576 , H03H9/059 , H03H9/1071 , H03H9/172 , H03H9/25 , H03H9/6426
摘要： An acoustic wave filter device includes a filter disposed on a substrate, a wall member disposed on the substrate and surrounding the filter, a cap member disposed on the wall member and bounding an internal space with the wall member; and a support member disposed on the cap member. The support member is disposed above the internal space and includes a bump disposed on the cap member.
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公开(公告)号：US20170059395A1
公开(公告)日：2017-03-02
申请号：US15095490
申请日：2016-04-11
发明人： Seung Wook PARK , No Il PARK , Tae Sung JEONG
IPC分类号： G01J1/04 , H01L27/146 , B60R1/02
CPC分类号： G01J1/0407 , H01L27/14618 , H01L27/14634 , H01L27/1469 , H01L2224/48091 , H01L2224/8592 , H01L2924/16195 , H01L2924/00014
摘要： A sensor package and a method of manufacturing the same are provided. A sensor package includes a substrate on which an image sensor is mounted, an electronic component mounted on the substrate, and a transparent member coupled to the electronic component and covering the image sensor.
摘要翻译： 提供传感器封装及其制造方法。 传感器封装包括其上安装有图像传感器的基板，安装在基板上的电子部件和耦合到电子部件并覆盖图像传感器的透明部件。
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6.发明申请COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION, WIRELESS POWER TRANSMISSION DEVICE, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION 有权用于无线电力传输的线圈类型单元，无线电力传输设备，电子设备和用于无线电力传输的线圈类型单元的制造方法公开(公告)号：US20150061400A1
公开(公告)日：2015-03-05
申请号：US14332082
申请日：2014-07-15
发明人： No Il PARK , Seung Wook PARK , Chang Bae LEE , Chang Ryul JUNG
CPC分类号： H01F38/14 , H01F5/00 , H01F27/2804 , H01F41/041 , H02J7/025 , H02J50/10 , H04B5/0037 , H04B5/0075 , Y10T29/4902
摘要： The present invention relates to a coil type unit for wireless power transmission, a wireless power transmission device, an electronic device, and a manufacturing method of a coil type unit for wireless power transmission. A coil type unit for wireless power transmission of the present invention includes a coil portion having a coil pattern on a substrate; a magnetic portion having the coil portion attached to one surface thereof and a conductive pattern formed thereon; an adhesive portion interposed between the magnetic portion and the coil portion to mutually bond the magnetic portion and the coil portion; and a conductive hole for electrically connecting the coil pattern and the conductive pattern, wherein the adhesive portion is formed on one surface of the magnetic portion having the conductive pattern thereon while being formed in an area other than the area in which the conductive pattern is formed.
摘要翻译： 本发明涉及一种用于无线电力传输的线圈类型单元，无线电力传输装置，电子设备以及用于无线电力传输的线圈型单元的制造方法。 本发明的无线电力传输线圈型单元包括在基板上具有线圈图案的线圈部分; 具有安装在其一个表面上的线圈部分和形成在其上的导电图案的磁性部分; 插入在所述磁性部分和所述线圈部分之间以将所述磁性部分和所述线圈部分相互粘合的粘合部分; 以及用于电连接线圈图案和导电图案的导电孔，其中粘合部分形成在具有导电图案的磁性部分的一个表面上，同时形成在除了形成导电图案的区域之外的区域中 。
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公开(公告)号：US20140176278A1
公开(公告)日：2014-06-26
申请号：US13841107
申请日：2013-03-15
发明人： Dong Hwan LEE , Seung Wook PARK , Christian ROMERO , Young Do KWEON , Jin Gu KIM
CPC分类号： H01F27/2828 , H01F27/292 , H01F41/10 , H01F2017/048 , Y10T29/49073
摘要： There is provided an inductor, including a circuit board having an input and output terminal formed on a lower surface thereof, a connection pad formed on an upper surface thereof, and a via electrically connecting the input and output terminal and the connection pad, a coil having both ends joined to the connection pad and wound in a circular or a polygonal spiral shape in a longitudinal direction of the circuit board so as to have one or more turns, and a body stacked on the circuit board such that the coil and the connection pad are embedded therein.
摘要翻译： 提供一种电感器，包括电路板，其电路板具有形成在其下表面上的输入和输出端子，形成在其上表面上的连接焊盘和将输入和输出端子与连接焊盘电连接的通孔，线圈 其两端连接到连接焊盘，并沿着电路板的纵向缠绕成圆形或多边形螺旋形，以便具有一个或多个匝，以及堆叠在电路板上的主体，使得线圈和连接 垫嵌入其中。
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公开(公告)号：US20240128136A1
公开(公告)日：2024-04-18
申请号：US18110478
申请日：2023-02-16
发明人： Seung Wook PARK , Seong Hun NA , Jae Hyun JUNG , Kwang Su KIM , Sung Jun LEE , Yong Suk KIM , Dong Hyun PARK
IPC分类号： H01L23/10 , H01L21/48 , H01L23/043
CPC分类号： H01L23/10 , H01L21/4817 , H01L23/043
摘要： A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.
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公开(公告)号：US20240076181A1
公开(公告)日：2024-03-07
申请号：US18340408
申请日：2023-06-23
发明人： Seung Wook PARK , Jang Ho PARK
CPC分类号： B81B7/0077 , B81C1/00333 , H03H9/105 , B81B2207/096 , B81C2203/019
摘要： A micro electro-mechanical systems (MEMS) package includes a first substrate on which at least one connection pad is disposed; a second substrate disposed adjacent to the first substrate; an element unit disposed on one surface of the second substrate; a connecting member connected to the connection pad and a metal pad included in the element unit; a sealing layer which encloses the second substrate; an insulating layer which covers the sealing layer; a redistribution layer connected to the connection pad; and an external connection terminal connected to the redistribution layer and exposed externally from the insulating layer. The element unit is spaced apart from the first substrate, the external connection terminal is exposed externally from the insulating layer disposed on a surface of the package that is opposite to a surface thereof on which the first substrate is disposed.
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公开(公告)号：US20200177155A1
公开(公告)日：2020-06-04
申请号：US16540480
申请日：2019-08-14
发明人： Seung Wook PARK , Tae Kyung LEE , Seong Hun NA , Jae Chang LEE , Jae Hyun JUNG
IPC分类号： H03H9/10 , H03H9/05 , H01L41/09 , H01L41/053 , H03H3/02 , H03H9/60 , H03H9/58 , H01L41/047 , H03H9/17
摘要： A bulk-acoustic resonator module includes: a module substrate; a bulk-acoustic resonator connected to the module substrate by a connection terminal and disposed spaced apart from the module substrate; and a sealing portion sealing the bulk-acoustic resonator. The bulk-acoustic resonator includes a resonating portion disposed opposite to an upper surface of the module substrate. A space is disposed between the resonating portion and the upper surface of the module substrate.
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