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    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    11.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权

    公开(公告)号：US20250125160A1

    公开(公告)日：2025-04-17

    申请号：US18908049

    申请日：2024-10-07

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Taeheon KIM ,  Junho LEE ,  Younghoo KIM ,  Junho YOON ,  Jongwon LEE ,  Jiwoong JUNG ,  Jihoon JEONG

    IPC: H01L21/67

    Abstract: A substrate processing apparatus includes a process chamber including a processing space, a substrate support configured to support a substrate in the process chamber, a fluid supply tube arranged in a lower portion of the process chamber, and a fluid supply device configured to supply a supercritical fluid to the processing space through the fluid supply tube, wherein the substrate support includes a plate structure, which is arranged in a central region of the substrate support, and on which the substrate is settled, a turbulence reduction body having a ring shape and joined to an outer portion of the plate structure, and a turbulence reduction wing joined to an outer portion of the turbulence reduction body and tilted at a certain angle toward the lower portion of the process chamber.

    ELECTRONIC DEVICE FOR PERFORMING BEAM MANAGEMENT ACCORDING TO CHANNEL STATE AND METHOD OF OPERATING THE SAME
    12.
    发明申请
    ELECTRONIC DEVICE FOR PERFORMING BEAM MANAGEMENT ACCORDING TO CHANNEL STATE AND METHOD OF OPERATING THE SAME 有权

    公开(公告)号：US20250038822A1

    公开(公告)日：2025-01-30

    申请号：US18784441

    申请日：2024-07-25

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Doyeon KIM ,  Junho LEE ,  Dahae CHONG ,  Yoojin CHOI

    IPC: H04B7/06 ,  H04B7/0408

    Abstract: An electronic device includes memory; a communication module comprising an antenna array configured to form a plurality of candidate beams; and a processor connected to the communication module and the memory, the processor comprising a channel state classifier based on a neural network, wherein the processor is configured to: generate channel characteristic data based on information measured from the plurality of candidate beams for a signal received from a base station, input the channel characteristic data to the channel state classifier to infer a channel state between the electronic device and the base station, and reform the plurality of candidate beams based on the inferred channel state.

    SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW
    13.
    发明申请
    SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW 有权

    公开(公告)号：US20250022772A1

    公开(公告)日：2025-01-16

    申请号：US18425010

    申请日：2024-01-29

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Insik HAN ,  Shle-Ge LEE ,  Junho LEE ,  WanSun KIM

    IPC: H01L23/40 ,  H01L23/00 ,  H01L23/522 ,  H01L25/18 ,  H10B80/00 ,  H01L23/31 ,  H01L23/498

    Abstract: A semiconductor package includes a package substrate. A chip structure is on the package substrate. A stiffener covers the chip structure and the package substrate. Screws fix the stiffener to the package substrate. The stiffener includes a main portion that covers an upper surface of the chip structure. A vertical portion that covers lateral side surfaces of the chip structure. The vertical portion extends from an end of the main portion. An edge portion extending laterally from the vertical portion and covering the upper surface of the package substrate. The screws penetrate the edge portion and the package substrate and couple the edge portion to the package substrate.

    WIRELESS COMMUNICATION APPARATUS FOR RECEIVING DATA FROM MULTIPLE
    14.
    发明公开
    WIRELESS COMMUNICATION APPARATUS FOR RECEIVING DATA FROM MULTIPLE 审中-公开

    公开(公告)号：US20230170974A1

    公开(公告)日：2023-06-01

    申请号：US18058547

    申请日：2022-11-23

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hongsik YOON ,  Jungmin PARK ,  Junho LEE

    IPC: H04B7/08 ,  H04B7/06 ,  H04L25/02 ,  H04B7/022

    CPC classification number: H04B7/086 ,  H04B7/0617 ,  H04L25/0224 ,  H04B7/022

    Abstract: A wireless communication apparatus for supporting communication with multiple transmission and reception points (TRPs) includes a radio frequency integrated circuit (RFIC) configured to receive a first reference signal from a first TRP and a second reference signal from a second TRP, and processing circuitry configured to estimate channels of a plurality of subcarriers based on at least one of the first reference signal or the second reference signal, determine a beamforming parameter based on the estimated channels, the beamforming parameter being determined based on a capacity of an effective channel between the wireless communication apparatus and both the first TRP and the second TRP, and adjust a reception beam based on the beamforming parameter, and the RFIC being configured to receive a first physical downlink shared channel (PDSCH) from the first TRP through the adjusted reception beam, and receive a second PDSCH from the second TRP.

    ELECTRONIC DEVICE INCLUDING FERROELECTRIC THIN FILM STRUCTURE
    17.
    发明申请
    ELECTRONIC DEVICE INCLUDING FERROELECTRIC THIN FILM STRUCTURE 有权

    公开(公告)号：US20230062878A1

    公开(公告)日：2023-03-02

    申请号：US17894504

    申请日：2022-08-24

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jinseong HEO ,  Yunseong LEE ,  Hyangsook LEE ,  Sanghyun JO ,  Seunggeol NAM ,  Taehwan MOON ,  Hagyoul BAE ,  Eunha LEE ,  Junho LEE

    IPC: H01L29/78 ,  H01L29/51

    Abstract: An electronic device includes: a substrate including a source, a drain, and a channel between the source and the drain; a gate electrode arranged above the substrate and facing the channel, the gate electrode being apart from the channel in a first direction; and a ferroelectric thin film structure between the channel and the gate electrode, the ferroelectric thin film structure including a first ferroelectric layer, a crystallization barrier layer including a dielectric material, and a second ferroelectric layer, which are sequentially arranged from the channel in the first direction. The average of sizes of crystal grains of the first ferroelectric layer may be less than or equal to the average of sizes of crystal grains of the second ferroelectric layer, and owing to small crystal grains, dispersion of performance may be improved.

    IMAGE SENSOR INCLUDING META PATTERN LAYER HAVING LIGHT RESONANCE FUNCTION
    18.
    发明申请
    IMAGE SENSOR INCLUDING META PATTERN LAYER HAVING LIGHT RESONANCE FUNCTION 有权

    公开(公告)号：US20230031010A1

    公开(公告)日：2023-02-02

    申请号：US17841777

    申请日：2022-06-16

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Junho LEE ,  Sangeun Mun ,  Sookyoung Roh ,  Sungmo Ahn ,  Seokho Yun

    IPC: H01L27/146 ,  G02B1/00

    Abstract: Provided is an image sensor including a metasurface having a light resonance function. The image sensor includes a photoelectric conversion layer, an interlayer material layer on the photoelectric conversion layer, and a single meta pattern layer on the interlayer material layer, wherein the meta pattern layer includes a metasurface, the metasurface having a same phase profile as that of a lens, and the meta pattern layer has a height that causes a resonance at a given wavelength of incident light to block transmission of the given wavelength through the meta pattern layer.

    STRUCTURE FOR BLOCKING NOISE IN AT LEAST ONE DESIGNATED BAND AND ELECTRONIC DEVICE COMPRISING SAME
    20.
    发明申请
    STRUCTURE FOR BLOCKING NOISE IN AT LEAST ONE DESIGNATED BAND AND ELECTRONIC DEVICE COMPRISING SAME 审中-公开

    公开(公告)号：US20200373647A1

    公开(公告)日：2020-11-26

    申请号：US16957158

    申请日：2018-12-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Junho LEE

    IPC: H01Q1/22 ,  H01Q1/24 ,  H05K1/02

    Abstract: An electronic device according to various embodiments may comprise: a housing; an antenna structure positioned in the housing; and a wireless communication circuit. The antenna structure may comprise: a first conductive layer comprising a first opening; a second conductive layer positioned in parallel with the first conductive layer, the second conductive layer comprising a second opening which at least partially overlaps with the first opening when the first conductive layer is seen from above; a third conductive layer positioned in parallel with the first conductive layer and interposed between the first conductive layer and the second conductive layer; a first insulating layer interposed between the first conductive layer and the third conductive layer; a second insulating layer interposed between the second conductive layer and the third conductive layer; a first conductive plate in the first opening, which is electrically separated from the first conductive layer; a second conductive plate in the second opening, which is electrically separated from the second conductive layer; a first conductive via electrically connected between the first conductive plate and the third conductive layer through the first insulating layer; and a second conductive via electrically connected between the second conductive plate and the third conductive layer through the second insulating layer. The wireless communication circuit may be configured to transmit or receive a signal having a frequency between 3 giga hertz (GHz) and 100 GHz and may be electrically connected to the antenna structure. Various embodiments may be possible.

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