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公开(公告)号：US20170185215A1
公开(公告)日：2017-06-29
申请号：US15375805
申请日：2016-12-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jiwon KIM , Sungyoun AN
CPC classification number: G06F3/0416 , G06F1/1643 , G06F1/1652 , G06F1/1694 , G06F3/0346 , G06F3/0487 , G06F3/04883 , G06F2203/04102 , G06F2203/04803 , G06F2203/04806
Abstract: An electronic device is provided. The electronic device includes a display, a sensor and at least one processor configured to display content on the display, detect rotation information of the electronic device upon detecting shape change information of the display through the sensor, determine control information based on the rotation information of the electronic device, generate additional content corresponding to the content based on the control information, and display the content and the additional content on different display areas of the display.
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公开(公告)号：US20240203943A1
公开(公告)日：2024-06-20
申请号：US18346921
申请日：2023-07-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junhyoung KIM , Jiwon KIM , Minyong LEE , Dohyung KIM , Sukkang SUNG
IPC: H01L25/065 , H01L23/00 , H01L23/528 , H10B80/00
CPC classification number: H01L25/0657 , H01L23/528 , H01L24/08 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H10B80/00 , H01L2224/08145 , H01L2224/16145 , H01L2224/32145 , H01L2224/48227 , H01L2224/73215 , H01L2224/80379 , H01L2225/0651 , H01L2225/06562
Abstract: The inventive concept provides a chip stack structure including a first semiconductor chip and a second semiconductor chip bonded to each other, and a semiconductor package including a plurality of chip stack structures stacked in a vertical direction.
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公开(公告)号：US20230376188A1
公开(公告)日：2023-11-23
申请号：US18364228
申请日：2023-08-02
Applicant: Samsung Electronics Co., Ltd.
IPC: G06F3/04845 , G06F1/16
CPC classification number: G06F3/04845 , G06F1/1652 , G06F1/1624
Abstract: An electronic device is provided. The electronic device includes a camera, a flexible display having a display region with a changeable size, and a processor configured to display an image obtained via the camera in a first region of the display region, display at least a part of control objects related to the camera in a second region different from the first region, in case that reduction of the display region is detected, compare a size of the reduced display region to a size of the image, and display the image in the reduced display region while maintaining an aspect ratio and the size of the image such that at least a part of the control objects related to the camera overlaps the image displayed in the reduced display region.
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公开(公告)号：US20230217088A1
公开(公告)日：2023-07-06
申请号：US18091054
申请日：2022-12-29
Inventor： Woo-Shik KIM , Jewon KANG , Jiwon KIM , Yungkyung PARK , Hyejin OH , Byunguk LEE
IPC: H04N23/12 , H04N23/84 , G06V10/143 , G06V10/75 , H04N23/10
CPC classification number: H04N23/12 , H04N23/843 , G06V10/143 , G06V10/758 , H04N23/125
Abstract: An image acquisition apparatus includes: a multispectral image sensor configured to acquire images in at least four channels based on a second wavelength band of about 10 nm to about 1,000 nm; and a processor configured to estimate illumination information of the images by inputting the images of at least four channels to a deep learning network trained in advance, and convert colors of the acquired images using the estimated illumination information.
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公开(公告)号：US20230076650A1
公开(公告)日：2023-03-09
申请号：US17987738
申请日：2022-11-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seohyang KIM , Jiwon KIM
IPC: G06F3/01 , A63F13/525
Abstract: An example image content transmission method, performed by an edge data network, includes: transmitting, to an electronic device, user field-of-view image packets including user field-of-view frame packets including information about a first user field-of-view frame, and first transmission error control packets; and transmitting, to the electronic device, extra field-of-view image packets including extra field-of-view frame packets including information about the first extra field-of-view frame, and second transmission error control packets.
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Patent Agency Ranking
公开(公告)号：US20220392829A1
公开(公告)日：2022-12-08
申请号：US17888727
申请日：2022-08-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Woosung YANG , Jiyoung KIM , Jiwon KIM
IPC: H01L23/48 , H01L27/11582
Abstract: A semiconductor device includes a substrate including a cell region and a connection region. The connection region includes a plurality of pad regions and a through electrode region. A horizontal conductive layer is on the substrate. A supporter is on the horizontal conductive layer. The supporter includes a first portion in the cell region, a second portion in the plurality of pad regions, and a third portion in the through electrode region. A connection conductive layer is between the first portion and the horizontal conductive layer. A connection mold layer is between the third portion and the horizontal conductive layer. A first buried insulation layer passing through the third portion, the connection mold layer, and the horizontal conductive layer is provided. A stacked structure is on the substrate. A through electrode passing through the first buried insulation layer is provided.
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公开(公告)号：US20220130846A1
公开(公告)日：2022-04-28
申请号：US17239829
申请日：2021-04-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jiwon KIM , Jaeho AHN , Sungmin HWANG , Joonsung LIM , Sukkang SUNG
IPC: H01L27/11556 , H01L23/522 , H01L27/11582 , G11C5/06 , H01L29/78
Abstract: A semiconductor device including a cell area including a first substrate, gate electrodes on the first substrate, a channel structure extending through the gate electrodes, cell contact plugs, a through contact plug, and first bonding pads, the first peripheral circuit area including second bonding pads on the first bonding pads; a second peripheral circuit area connected to the first peripheral circuit area; and a second substrate between the first peripheral circuit area and the second peripheral circuit area, the second substrate including a first surface in the first peripheral circuit area and a second surface in the second peripheral circuit area, wherein the second peripheral circuit area includes a device on the second surface, and a through electrode extending vertically through the second substrate and connected to the first peripheral circuit area.
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公开(公告)号：US20210143683A1
公开(公告)日：2021-05-13
申请号：US17057234
申请日：2019-07-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Mincheol HA , Kwangseob KIM , Kihyun KIM , Dongzo KIM , Jiwon KIM , Jihye KIM , Yunjeong NOH , Keumsu SONG , Changhak O , Kyungmin LEE , Hyungkoo CHUNG , Jongchul HONG , Yongsang YUN
Abstract: Various embodiments relating to an electronic device are disclosed, and according to an embodiment, the electronic device may comprise: a plurality of coils; a first power generation circuit electrically connected to at least one of the plurality of coils; a second power generation circuit electrically connected to at least one of the plurality of coils; and a control circuit, wherein when the approach of a second external electronic device is detected while first power is provided to a first external electronic device by using a first frequency via the first power generation circuit, the control circuit allows the frequency of the second power generation circuit to be configured to a second frequency different from a first frequency in order to provide second power to the second external electronic device. Other embodiments may be possible.
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19.发明申请公开(公告)号：US20200036227A1
公开(公告)日：2020-01-30
申请号：US16447113
申请日：2019-06-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwangseob KIM , Keumsu SONG , Changhak O , Dongzo KIM , Jihye KIM , Mincheol HA , Kihyun KIM , Jiwon KIM , Yunjeong NOH , Kyungmin LEE , Hyungkoo CHUNG , Jongchul HONG , Yongsang YUN
Abstract: An electronic device including a wireless charging coils, and an operating method thereof are provided. The electronic device includes a housing including a concave portion couplable to a protrusion of one or more external electronic devices, a first coil stored inside the housing, a second coil stored inside the housing, and disposed between the first coil and the concave portion, a power transmission circuit including a first connecting terminal electrically coupled to the first coil and a second connecting terminal electrically coupled to the second coil, and a control circuit. The control circuit configured to check a data packet received from the external electronic device which is in proximity to the electronic device, control to transmit first designated power to the external electronic device through the first coil wirelessly, and second designated power to the external electronic device through the second coil wirelessly by using the power transmission circuit.
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公开(公告)号：US20150334380A1
公开(公告)日：2015-11-19
申请号：US14711193
申请日：2015-05-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jiwon KIM , Dongkyung NAM , Hyoseok HWANG
IPC: H04N13/04
CPC classification number: H04N13/327 , G06T7/85 , G06T2207/10021 , G06T2207/10024 , H04N13/324 , H04N13/349 , H04N13/398 , H04N2013/0077 , H04N2013/0081
Abstract: An image processing apparatus and a method implemented by the image process apparatus generates a vertical disparity map through regression analysis, based on a difference between vertical coordinate values from feature correspondence information of left and right source images. A geometric difference through image warping is calibrated before depth information is restored through depth estimation. Thus, a process of optimizing a camera model may not have to be performed, and occurrence of black areas that may be caused by image rotation may be reduced.
Abstract translation: 图像处理装置和由图像处理装置实施的方法基于来自左右源图像的特征对应信息的垂直坐标值之间的差异，通过回归分析生成垂直视差图。 在通过深度估计恢复深度信息之前，校正通过图像翘曲的几何差异。 因此，可以不必执行优化相机模型的处理，并且可能减少可能由图像旋转引起的黑色区域的发生。
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