公开(公告)号：US20250105032A1

公开(公告)日：2025-03-27

申请号：US18442548

申请日：2024-02-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hyun PARK ,  Min Suk KANG ,  Young-Hoo KIM ,  Jin Seon YOU ,  Tae-Hong KIM ,  Woo Gwan SHIM

IPC: H01L21/67

Abstract: A chemical liquid supply apparatus is provided and includes an additive supply, a chemical liquid supply, and a controller that controls the additive supply and the chemical liquid supply. The additive supply includes a first tank that receives an additive from an additive container, and a first circulating pipe connected to the first tank. The chemical liquid supply includes an auxiliary tank that receives an etching liquid from another container and receives the additive, and a second circulating pipe connected to the auxiliary tank. The controller provides control so as to: circulate the additive in the first tank; heat the etching liquid in the auxiliary tank using a heater such that a temperature of the etching liquid is increased to a first temperature; supply the additive to the auxiliary tank; and produce a chemical liquid by circulating the etching liquid and the additive at the first temperature.

公开(公告)号：US20210060625A1

公开(公告)日：2021-03-04

申请号：US16890490

申请日：2020-06-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Min SHIN ,  Hun Jae JANG ,  Seok Hoon KIM ,  Young-Hoo KIM ,  In Gi KIM ,  Tae-Hong KIM ,  Kun Tack LEE ,  Ji Hoon CHA ,  Yong Jun CHOI

IPC: B08B7/00 ,  B08B3/10 ,  H01L21/67 ,  H01L21/687 ,  H01L21/311

Abstract: A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.

公开(公告)号：US20180315613A1

公开(公告)日：2018-11-01

申请号：US16020585

申请日：2018-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chae Lyoung KIM ,  Tae-Hong KIM ,  Jung-Min OH ,  YUNGJUN KIM ,  INGI KIM ,  BOUN YOON ,  HYOSAN LEE ,  Sol HAN

IPC: H01L21/306 ,  H01L21/67 ,  B24B37/20 ,  H01L21/02 ,  B24B53/017

CPC classification number: H01L21/30625 ,  B24B37/20 ,  B24B53/017 ,  H01L21/02057 ,  H01L21/02065 ,  H01L21/02074 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67219

Abstract: A cleaning apparatus for removing particles from a substrate is provided. The cleaning apparatus includes a first cleaning unit including a first dual nozzle supplying, to a substrate, a first chemical liquid and a first spray including a first liquid dissolving the first chemical liquid, and a second cleaning unit including a second dual nozzle supplying, to the substrate, a second chemical liquid different from the first chemical liquid and a second spray including a second liquid dissolving the second chemical liquid and being the same as the first liquid.

公开(公告)号：US20170301553A1

公开(公告)日：2017-10-19

申请号：US15428963

申请日：2017-02-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chae Lyoung KIM ,  Tae-Hong KIM ,  Jung-Min OH ,  YUNGJUN KIM ,  INGI KIM ,  BOUN YOON ,  HYOSAN LEE ,  Sol HAN

IPC: H01L21/306 ,  H01L21/67 ,  H01L21/02 ,  B24B53/017 ,  B24B37/20

CPC classification number: H01L21/30625 ,  B24B37/20 ,  B24B53/017 ,  H01L21/02057 ,  H01L21/02065 ,  H01L21/02074 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67219

Abstract: A cleaning apparatus for removing particles from a substrate is provided. The cleaning apparatus includes a first cleaning unit including a first dual nozzle supplying, to a substrate, a first chemical liquid and a first spray including a first liquid dissolving the first chemical liquid, and a second cleaning unit including a second dual nozzle supplying, to the substrate, a second chemical liquid different from the first chemical liquid and a second spray including a second liquid dissolving the second chemical liquid and being the same as the first liquid.