公开(公告)号：US20240183796A1

公开(公告)日：2024-06-06

申请号：US18385480

申请日：2023-10-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YASUHIRO HIDAKA ,  INGI KIM

IPC: G01N21/95 ,  G01N21/88 ,  G02F1/35 ,  G02F1/355 ,  G02F1/37 ,  H01L21/66

CPC classification number: G01N21/9505 ,  G01N21/8806 ,  G02F1/3546 ,  G02F1/3551 ,  G02F1/37 ,  H01L22/12 ,  G01N2021/8848

Abstract: In semiconductor inspection using second-harmonic generation within an object, a weak second-harmonic is detected at high sensitivity. In a semiconductor inspecting apparatus which irradiates a pulsed laser with a very short pulse width to a surface of a semiconductor device as the object, and measures the second-harmonic generated within the semiconductor device, a second-harmonic generation element is disposed between a light source and the object to generate a first second-harmonic. Further, the apparatus modulates a phase of only the first second-harmonic using an electric optical crystal, and then, a fundamental wave is irradiated onto the object. When the fundamental wave is irradiated onto the semiconductor device, the second-harmonic is generated therefrom. The first second-harmonic interferes with the second second-harmonic on a detector, and an intensity of the light obtained by the interfering is modulated at the same period as that of the phase modulation of the first second-harmonic. An amplitude of the second second-harmonic may be obtained from a modulated amplitude thereof, and a phase of the second second-harmonic may be measured from a modulated phase thereof.

公开(公告)号：US20210305106A1

公开(公告)日：2021-09-30

申请号：US17021087

申请日：2020-09-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： EUNHEE JEANG ,  BORIS AFINOGENOV ,  SANGWOO BAE ,  WONDON JOO ,  MAKSIM RIABKO ,  ANTON MEDVEDEV ,  ALEKSANDR SHOROKHOV ,  ANTON SOFRONOV ,  INGI KIM ,  TAEHYUN KIM ,  MINHWAN SEO ,  SANGMIN LEE ,  SEULGI LEE

IPC: H01L21/66 ,  H01L21/67 ,  G01N21/64 ,  G01N21/95

Abstract: A substrate inspection apparatus includes a light source unit, a pulsed beam matching unit, a substrate support unit, an incidence angle adjusting unit, and a detecting unit. The light source unit emits a first laser beam having a first wavelength and a second laser beam having a second wavelength. The pulsed beam matching unit matches the first laser beam and the second laser beam to superimpose a pulse of the first laser beam on a pulse of the second laser beam in time and space. The substrate support unit supports a substrate to be inspected. The incidence angle adjusting unit adjusts angles of incidence of the matched first laser beam and second laser beams to irradiate the first laser beam and the second laser beam on the substrate, and mixes the first laser beam and the second laser beam to generate an evanescent wave on the substrate. The evanescent wave generates scattered light due to a defect of the substrate. The detecting unit detects the scattered light generated due to the defect of the substrate.

公开(公告)号：US20240145315A1

公开(公告)日：2024-05-02

申请号：US18495618

申请日：2023-10-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： EUNHEE JEANG ,  BORIS AFINOGENOV ,  SANGWOO BAE ,  WONDON JOO ,  MAKSIM RIABKO ,  ANTON MEDVEDEV ,  ALEKSANDR SHOROKHOV ,  ANTON SOFRONOV ,  INGI KIM ,  TAEHYUN KIM ,  MINHWAN SEO ,  SANGMIN LEE ,  SEULGI LEE

IPC: H01L21/66 ,  G01N21/64 ,  G01N21/95 ,  H01L21/67

CPC classification number: H01L22/12 ,  G01N21/648 ,  G01N21/9505 ,  H01L21/67288 ,  G01N2201/06113

Abstract: A substrate inspection apparatus includes a light source unit, a pulsed beam matching unit, a substrate support unit, an incidence angle adjusting unit, and a detecting unit. The light source unit emits a first laser beam having a first wavelength and a second laser beam having a second wavelength. The pulsed beam matching unit matches the first laser beam and the second laser beam to superimpose a pulse of the first laser beam on a pulse of the second laser beam in time and space. The substrate support unit supports a substrate to be inspected. The incidence angle adjusting unit adjusts angles of incidence of the matched first laser beam and second laser beams to irradiate the first laser beam and the second laser beam on the substrate, and mixes the first laser beam and the second laser beam to generate an evanescent wave on the substrate. The evanescent wave generates scattered light due to a defect of the substrate. The detecting unit detects the scattered light generated due to the defect of the substrate.

公开(公告)号：US20210098261A1

公开(公告)日：2021-04-01

申请号：US17121233

申请日：2020-12-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chae Lyoung KIM ,  Tae-Hong KIM ,  Jung-Min OH ,  YUNGJUN KIM ,  INGI KIM ,  BOUN YOON ,  HYOSAN LEE ,  Sol HAN

IPC: H01L21/306 ,  H01L21/02 ,  H01L21/67 ,  B24B37/20 ,  B24B53/017

Abstract: A cleaning method includes supplying, to a substrate by a dual nozzle, a first chemical liquid and a first spray, the first spray including a first liquid dissolving the first chemical liquid, and moving the dual nozzle in a first direction. The the dual nozzle comprises a first nozzle and a second nozzle, the first nozzle supplies the first spray to the substrate and the second nozzle supplies the first chemical liquid to the substrate while the dual nozzle moves in the first direction, the first nozzle proceeds ahead of the second nozzle in the first direction while the dual nozzle moves in the first direction, and the first nozzle has a distance 3 cm to 7 cm from the second nozzle.

公开(公告)号：US20250035563A1

公开(公告)日：2025-01-30

申请号：US18764677

申请日：2024-07-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ryuju Sato ,  INGI KIM

IPC: G01N21/95 ,  G01N21/88

Abstract: A semiconductor measurement device includes a laser light source generating a fundamental wave having a first wavelength, an objective lens focusing the fundamental wave on a sample surface of a sample, a wavelength filter blocking reflected light corresponding to the fundamental wave that is reflected from the sample surface and transmitting signal light generated by irradiating the fundamental wave to the sample surface, and a first detection unit detecting the signal light passing through the wavelength filter. The first detection unit is located to detect the signal light generated from the sample surface and measures an intensity distribution of the signal light emitted in two or more different emission directions from the sample surface of the sample placed at a fixed position. The signal light includes nonlinear light generated from the sample surface irradiated by the fundamental wave and having a second wavelength which is different from the first wavelength.

公开(公告)号：US20180315613A1

公开(公告)日：2018-11-01

申请号：US16020585

申请日：2018-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chae Lyoung KIM ,  Tae-Hong KIM ,  Jung-Min OH ,  YUNGJUN KIM ,  INGI KIM ,  BOUN YOON ,  HYOSAN LEE ,  Sol HAN

IPC: H01L21/306 ,  H01L21/67 ,  B24B37/20 ,  H01L21/02 ,  B24B53/017

CPC classification number: H01L21/30625 ,  B24B37/20 ,  B24B53/017 ,  H01L21/02057 ,  H01L21/02065 ,  H01L21/02074 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67219

Abstract: A cleaning apparatus for removing particles from a substrate is provided. The cleaning apparatus includes a first cleaning unit including a first dual nozzle supplying, to a substrate, a first chemical liquid and a first spray including a first liquid dissolving the first chemical liquid, and a second cleaning unit including a second dual nozzle supplying, to the substrate, a second chemical liquid different from the first chemical liquid and a second spray including a second liquid dissolving the second chemical liquid and being the same as the first liquid.

公开(公告)号：US20180151395A1

公开(公告)日：2018-05-31

申请号：US15819550

申请日：2017-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： MIHYUN PARK ,  JUNG-MIN OH ,  INGI KIM ,  SEOHYUN KIM ,  TAE-HONG KIM ,  HYOSAN LEE

IPC: H01L21/67 ,  H01L21/02 ,  H01L29/66 ,  H01L21/28 ,  H01L21/3105 ,  C11D1/12 ,  C11D3/43

CPC classification number: H01L21/67051 ,  C11D1/12 ,  C11D1/146 ,  C11D1/29 ,  C11D3/201 ,  C11D3/2017 ,  C11D3/2044 ,  C11D3/2068 ,  C11D3/28 ,  C11D3/32 ,  C11D3/3445 ,  C11D3/43 ,  C11D11/0047 ,  H01L21/02065 ,  H01L21/02074 ,  H01L21/28123 ,  H01L21/31053 ,  H01L21/67017 ,  H01L29/66545 ,  H01L29/66803 ,  H01L29/66818

Abstract: A cleaning composition includes a surfactant, deionized (DI) water, and an organic solvent. The surfactant has a concentration of from about 0.03 M to about 0.003 M. A cleaning apparatus includes a chuck that receives a substrate, a nozzle for providing the cleaning composition onto the substrate. The cleaning apparatus further includes a chemical solution supply unit supplying the cleaning composition to the nozzle. The chemical solution supply unit mixes the cleaning composition to generate cleaning particles. The cleaning composition includes a surfactant, deionized (DI) water, and an organic solvent. The surfactant has a concentration of from about 0.03 M to about 0.003 M. A method for manufacturing a semiconductor device includes processing a substrate, forming an interlayer insulating layer, polishing an interlayer insulating layer, and providing a cleaning composition onto the interlayer insulating layer to remove first particles.

公开(公告)号：US20170301553A1

公开(公告)日：2017-10-19

申请号：US15428963

申请日：2017-02-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chae Lyoung KIM ,  Tae-Hong KIM ,  Jung-Min OH ,  YUNGJUN KIM ,  INGI KIM ,  BOUN YOON ,  HYOSAN LEE ,  Sol HAN

IPC: H01L21/306 ,  H01L21/67 ,  H01L21/02 ,  B24B53/017 ,  B24B37/20

CPC classification number: H01L21/30625 ,  B24B37/20 ,  B24B53/017 ,  H01L21/02057 ,  H01L21/02065 ,  H01L21/02074 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67219

Abstract: A cleaning apparatus for removing particles from a substrate is provided. The cleaning apparatus includes a first cleaning unit including a first dual nozzle supplying, to a substrate, a first chemical liquid and a first spray including a first liquid dissolving the first chemical liquid, and a second cleaning unit including a second dual nozzle supplying, to the substrate, a second chemical liquid different from the first chemical liquid and a second spray including a second liquid dissolving the second chemical liquid and being the same as the first liquid.