公开(公告)号：US20230213867A1

公开(公告)日：2023-07-06

申请号：US18147469

申请日：2022-12-28

Applicant: SEMES CO., LTD.

Inventor： Tae Hee KIM ,  Ji Hoon JEONG ,  Tae Shin KIM ,  Young Dae CHUNG ,  Young Eun JEON

IPC: G03F7/20

CPC classification number: G03F7/70191 ,  G03F7/70025

Abstract: The inventive concept provides a mask treatment apparatus. The mask treatment may include a support unit that supports the mask, and a light irradiation unit that irradiate the mask with a light to adjust a critical dimension of a pattern formed in the mask, wherein the light irradiation unit includes a light source that generates the light, and a light modulation element that modulates the light generated by the light source and forms an irradiation pattern.

公开(公告)号：US20230084076A1

公开(公告)日：2023-03-16

申请号：US17943452

申请日：2022-09-13

Applicant: SEMES CO., LTD.

Inventor： Hyun YOON ,  Ki Hoon CHOI ,  Tae Hee KIM ,  Hyo Won YANG ,  Young Dae CHUNG ,  Ji Hoon JEONG

IPC: H01L21/268 ,  H01L21/67 ,  G03F1/70

Abstract: The inventive concept provides a mask treating apparatus. The mask treating apparatus includes a support unit configured to support and rotate a mask, the mask having a first pattern within a plurality of cells thereof and a second pattern outside regions of the plurality of cells; a heating unit including a laser irradiation module and a moving module, the laser irradiation module having a laser irradiator for irradiating a laser light to the second pattern, the moving module configured to change a position of the laser irradiation module; and a controller configured to control the support unit and the heating unit, and wherein when a treating position is divided into four equal parts from a first quadrant to a fourth quadrant based on a center of the mask, the laser irradiator is positioned at the fourth quadrant and the first quadrant in a direction linearly moving from a standby position to the treating position, positioned at the third quadrant in a direction which is perpendicular to the fourth quadrant, and positioned at the second quadrant in a direction which is perpendicular to the first quadrant, and wherein the controller controls a rotation of the support unit so the second pattern is positioned at the fourth quadrant.

公开(公告)号：US20220290921A1

公开(公告)日：2022-09-15

申请号：US17692395

申请日：2022-03-11

Applicant: SEMES CO., LTD.

Inventor： Hae-Won CHOI ,  Anton KORIAKIN ,  Joon Ho WON ,  Min Woo KIM ,  Ki Hoon CHOI ,  Eung Su KIM ,  Tae Hee KIM ,  Pil Kyun HEO ,  Jang Jin LEE ,  Jin Yeong SUNG

IPC: F26B5/00

Abstract: The inventive concept provides a method for treating a substrate. The method for treating a substrate comprises: a pressurization step for increasing a pressure of an inner space of a chamber by supplying a treating fluid to the inner space, after taking the substrate into the inner space; a flow step for generating a flow of the treating fluid by combination of supplying and discharging the treating fluid to and from the inner space; and a depressurization step of decreasing the pressure of the inner space by discharging the treating fluid from the inner space, and wherein the pressurization step comprises: a bottom side supply process for increasing the pressure of the inner space by supplying the treating fluid to a backside of the substrate taken into the inner space;
and a top side supply process of increasing the pressure of the inner space by supplying the treating fluid to a top side of the substrate taken into the inner space.

公开(公告)号：US20230204414A1

公开(公告)日：2023-06-29

申请号：US17979149

申请日：2022-11-02

Applicant: SEMES CO., LTD.

Inventor： Hyun YOON ,  Ki Hoon CHOI ,  Tae Hee KIM ,  Ji Hoon JEONG

IPC: G01J1/42 ,  G01J1/02 ,  G03F7/20

CPC classification number: G01J1/4257 ,  G01J1/0271 ,  G03F7/2053

Abstract: The present invention provides a substrate treating apparatus including: support unit is configured to support and rotate a substrate in a treatment space; a liquid supply unit is configured to supply a liquid to the substrate supported by the support unit; a laser unit including a laser irradiation unit which irradiates laser light to the substrate supported by the support unit; a home port providing a standby position in which the laser unit waits; and a moving unit for moving the laser unit between a process position in which the laser light is irradiated to the substrate and the standby position, in which the home port detects a characteristic of the laser light from the laser light irradiated by the laser unit.