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11.
公开(公告)号:US11424224B2
公开(公告)日:2022-08-23
申请号:US16855258
申请日:2020-04-22
Applicant: Seoul Viosys Co., Ltd
Inventor: Seong Kyu Jang , Seom Geun Lee , Chan Seob Shin , Ho Joon Lee
IPC: H01L25/075 , H01L33/58 , H01L33/00 , H01L33/62
Abstract: A display panel including a circuit board having pads, light emitting devices electrically connected to the pads and arranged on the circuit board, each light emitting device having a first surface facing the circuit board, and a buffer material layer disposed between the circuit board and the light emitting devices to fill a space between the circuit board and the light emitting devices, in which the buffer material layer is disposed under the first surfaces of the light emitting devices.
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公开(公告)号:US20200373348A1
公开(公告)日:2020-11-26
申请号:US15930979
申请日:2020-05-13
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Seom Geun LEE , Seong Kyu Jang , Chan Seob Shin , Ho Joon Lee
Abstract: A light emitting device for a display including a first LED stack, a second LED stack disposed thereunder, a third LED stack disposed thereunder and including first and second conductivity type semiconductor layers, a first bonding layer between the second and third LED stacks, a second bonding layer between the first and second LED stacks, an insulation layer between the second bonding layer and the second LED stack, lower buried layers passing through the second LED stack and the insulation layer and electrically connected to the first and second conductivity type semiconductor layers of the third LED stack, respectively, upper buried layers passing through the first LED stack and the second bonding layer and electrically connected to the lower buried layers, and upper connectors disposed on the first LED stack and including upper connectors covering and electrically connected to the upper buried layers, respectively.
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13.
公开(公告)号:US20170005231A1
公开(公告)日:2017-01-05
申请号:US15264420
申请日:2016-09-13
Applicant: Seoul Viosys Co., Ltd.
Inventor: Hyoung Jin Lim , Chan Seob Shin , Kyu Ho Lee , Tae Gyun Kim , Sung Won Tae
CPC classification number: H01L33/38 , H01L33/22 , H01L33/42 , H01L2933/0016 , H01L2933/0091
Abstract: Disclosed herein are a light emitting diode including a plurality of protrusions including zinc oxide and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, the light emitting diode includes: a substrate; a nitride light emitting structure disposed on the substrate; and a transparent electrode layer disposed on the nitride light emitting structure, wherein the transparent electrode layer includes a plurality of protrusions, the plurality of protrusions each have a lower portion and an upper portion, and a side of the lower portion and a side of the upper portion have different gradients.
Abstract translation: 本文公开了包括多个包括氧化锌的突起的发光二极管及其制造方法。 根据本公开的示例性实施例,发光二极管包括:基板; 设置在所述基板上的氮化物发光结构; 以及设置在所述氮化物发光结构上的透明电极层,其中所述透明电极层包括多个突起,所述多个突起各自具有下部和上部,所述下部的一侧和 上部具有不同的梯度。
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公开(公告)号:US12132148B2
公开(公告)日:2024-10-29
申请号:US17536074
申请日:2021-11-28
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Seong Kyu Jang , Chan Seob Shin , Seom Geun Lee , Ho Joon Lee
IPC: H01L33/24 , H01L25/075 , H01L33/62 , G02B27/01 , G06F1/16
CPC classification number: H01L33/24 , H01L25/0753 , H01L33/62 , G02B27/0172 , G02B2027/0178 , G06F1/163
Abstract: A method of fabricating a light emitting device for a display, the method including the steps of growing a first LED stack on a first growth substrate, the first LED stack including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, growing a second LED stack on a second growth substrate, the second LED stack including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, bonding the second LED stack to a first temporary substrate, removing the second growth substrate from the second LED stack, bonding the second LED stack to the first LED stack, and removing the first temporary substrate from the second LED stack.
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公开(公告)号:US11502230B2
公开(公告)日:2022-11-15
申请号:US16668325
申请日:2019-10-30
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Seong Gyu Jang , Chan Seob Shin , Seom Geun Lee , Ho Joon Lee , Jong Hyeon Chae
Abstract: A light emitting device including first, second, and third light emitting parts disposed one over another and each including a first-type semiconductor layer, an active layer, and a second-type semiconductor layer, a first conductive pattern at least partially disposed between the second and third light emitting parts, the first conductive pattern including a first portion electrically coupled with at least one of the first-type and second-type semiconductor layers of the first and second light emitting parts, and a second portion extending from the first portion and disposed on one surface of the second light emitting part between the second and third light emitting parts, and a second conductive pattern disposed on the third light emitting part and electrically coupled with the first conductive pattern, in which the second conductive pattern at least partially overlaps with the second portion of the first conductive pattern.
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公开(公告)号:US11362073B2
公开(公告)日:2022-06-14
申请号:US16782594
申请日:2020-02-05
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Seom Geun Lee , Chan Seob Shin , Ho Joon Lee , Seong Kyu Jang
Abstract: A light emitting device for a display including first, second, and third LED stacks each including a first semiconductor layer, an active layer, and a second semiconductor layer, first, second, and third transparent electrodes in ohmic contact with a lower surface of the first LED stack, an upper surface of the second LED stack, and an upper surface of the third LED stack, respectively, a first electrode pad disposed on the first semiconductor layer of the third LED stack, a lower second electrode pad disposed on the third transparent electrode, and first, second, and third bump pads disposed on the first LED stack and electrically connected to the LED stacks, respectively, and a common bump pad disposed electrically connected to each LED stack, in which an upper surface of the first electrode pad is located at substantially the same elevation as that of the lower second electrode pad.
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公开(公告)号:US11211528B2
公开(公告)日:2021-12-28
申请号:US16815823
申请日:2020-03-11
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Seong Kyu Jang , Chan Seob Shin , Seom Geun Lee , Ho Joon Lee
IPC: H01L33/24 , H01L33/62 , H01L25/075 , G02B27/01 , G06F1/16
Abstract: A light emitting device for a display including first, second, and third LED stacks, and bump pads disposed on the first LED stack, in which each LED stack includes a first semiconductor layer and a second semiconductor layer exposing a portion of the first semiconductor layer, the first LED stack includes upper through-holes and the second LED stack includes lower through-holes, the bump pads include a first bump pad electrically connected to the second semiconductor layer of the first LED stack, a second bump pad electrically connected to the second semiconductor layer of the second LED stack through the upper through-hole, a third bump pad electrically connected to the second semiconductor layer of the third LED stack through the upper through-hole and the lower through-hole, and a common bump pad electrically connected to the first semiconductor layers of each LED stack in common.
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公开(公告)号:US10396250B2
公开(公告)日:2019-08-27
申请号:US15870687
申请日:2018-01-12
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Chan Seob Shin , Myoung Hak Yang , Yeo Jin Yoon , Seom Geun Lee
Abstract: An exemplary light emitting diode is provided to comprise: a first semiconductor layer; a mesa disposed on the first semiconductor layer and including an active layer and a second semiconductor layer disposed on the active layer; a ZnO transparent electrode disposed on the mesa; a first electrode disposed on the first semiconductor layer; and a second electrode disposed on the ZnO transparent electrode, and including a second electrode pad and at least one second electrode extending portion extending from the second electrode pad. The second electrode extending portion contacts the ZnO transparent electrode. The ZnO transparent electrode includes a first region and a second region. The first region protrudes from the top surface of the ZnO transparent electrode, includes a plurality of projecting portions arranged in a predetermined pattern, the thickness of the first region greater than the thickness of the second region.
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19.
公开(公告)号:US12272681B2
公开(公告)日:2025-04-08
申请号:US18535545
申请日:2023-12-11
Applicant: Seoul Viosys Co., Ltd.
Inventor: Seong Kyu Jang , Seom Geun Lee , Chan Seob Shin , Ho Joon Lee
IPC: H01L25/075 , H10H20/01 , H10H20/855 , H10H20/857
Abstract: A display panel including a circuit board having pads, light emitting devices electrically connected to the pads and arranged on the circuit board, each light emitting device having a first surface facing the circuit board and a second surface opposite to the first surface, a buffer material layer disposed between the circuit board and the light emitting devices to fill a space between the circuit board and the light emitting devices, and a cover layer covering the second surface of the light emitting devices, in which the buffer material layer is disposed under the first surfaces of the light emitting devices and has grooves in a region between adjacent light emitting devices, a portion of a top surface of the buffer material layer is disposed between adjacent light emitting devices, and the cover layer fills the grooves of the buffer material layer.
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20.
公开(公告)号:US11842987B2
公开(公告)日:2023-12-12
申请号:US17866249
申请日:2022-07-15
Applicant: Seoul Viosys Co., Ltd
Inventor: Seong Kyu Jang , Seom Geun Lee , Chan Seob Shin , Ho Joon Lee
IPC: H01L25/075 , H01L33/58 , H01L33/00 , H01L33/62
CPC classification number: H01L25/0753 , H01L33/0093 , H01L33/58 , H01L33/62 , H01L2933/0058 , H01L2933/0066
Abstract: A display panel including a circuit board having pads, light emitting devices electrically connected to the pads and arranged on the circuit board, each light emitting device having a first surface facing the circuit board and a second surface opposite to the first surface, a buffer material layer disposed between the circuit board and the light emitting devices to fill a space between the circuit board and the light emitting devices, and a cover layer covering the second surface of the light emitting devices, in which the buffer material layer is disposed under the first surfaces of the light emitting devices and has grooves in a region between adjacent light emitting devices, a portion of a top surface of the buffer material layer is disposed between adjacent light emitting devices, and the cover layer fills the grooves of the buffer material layer.
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