公开(公告)号：US20180056319A1

公开(公告)日：2018-03-01

申请号：US15803630

申请日：2017-11-03

Applicant: STMicroelectronics, Inc. ,  STMICROELECTRONICS S.R.L. ,  STMicroelectronics International N.V.

Inventor： Simon DODD ,  Joe SCHEFFELIN ,  Dave HUNT ,  Matt GIERE ,  Dana GRUENBACHER ,  Faiz SHERMAN

IPC: B05B17/06 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  B41J2/14 ,  B41J2/16

CPC classification number: B05B17/0607 ,  B05B17/0638 ,  B05B17/0684 ,  B41J2/14016 ,  B41J2/14024 ,  B41J2/14056 ,  B41J2/14072 ,  B41J2/1433 ,  B41J2/1601 ,  B41J2/1632 ,  B41J2/175 ,  B41J2/17526 ,  B41J2/1753 ,  B41J2002/14338 ,  B41J2002/14491 ,  H05K1/0212 ,  H05K1/111 ,  H05K1/181 ,  Y10T29/49119

Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

公开(公告)号：US20170311446A1

公开(公告)日：2017-10-26

申请号：US15253615

申请日：2016-08-31

Applicant: STMICROELECTRONICS, INC. ,  STMICROELECTRONICS S.R.L.

Inventor： Simon DODD ,  Roberto BRIOSCHI

IPC: H05K1/18 ,  H05K1/03 ,  H05K3/10 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K1/181 ,  B81C1/0023 ,  H01L2924/1461 ,  H05K1/0272 ,  H05K1/0293 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/10 ,  H05K3/4007 ,  H05K2201/0175 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/09727 ,  H05K2201/09763 ,  H05K2201/09827 ,  H05K2201/10083 ,  H05K2201/10159 ,  H05K2201/10181 ,  H05K2203/171 ,  H05K2203/175

Abstract: The present disclosure is directed to a ceramic substrate that includes a plurality of contact pads, a plurality of electrical traces, and a microelectromechanical die. Contacts on the die are coupled to the plurality of contact pads through the plurality of electrical traces. The substrate also includes a plurality of memory bits formed directly on the substrate. Each memory bit is coupled between a first one of the contact pads and a second one of the contact pads.

公开(公告)号：US20170190174A1

公开(公告)日：2017-07-06

申请号：US15253601

申请日：2016-08-31

Applicant: STMICROELECTRONICS, INC. ,  STMICROELECTRONICS INTERNATIONAL N.V. ,  STMICROELECTRONICS S.R.L.

Inventor： Simon DODD ,  David S. HUNT ,  Joseph Edward SCHEFFELIN ,  Dana GRUENBACHER

IPC: B41J2/14

CPC classification number: B41J2/1433 ,  B41J2/14072 ,  B41J2/14201 ,  B41J2/1753 ,  B41J2/17553 ,  B41J2002/14362 ,  B41J2002/14491

Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.

公开(公告)号：US20170188526A1

公开(公告)日：2017-07-06

申请号：US14985128

申请日：2015-12-30

Applicant: STMicroelectronics, Inc.

Inventor： Marco DE FAZIO ,  Simon DODD

IPC: A01G25/02 ,  G05B15/02

CPC classification number: A01G25/02 ,  A01G9/14 ,  A01G31/02 ,  G05B15/02 ,  G05B2219/2625 ,  Y02A40/252 ,  Y02P60/216

Abstract: The present disclosure is directed to a greenhouse or single container for plant growth coupled to the Internet of Things and including a microfluidic die for water or nutrient distribution. The microfluidic die is controllable automatically or with instructions from a remote user, based on sensors included within a growth environment.