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    COVER FOR AN ELECTRONIC DEVICE AND METHOD OF FABRICATION
    11.
    发明申请
    COVER FOR AN ELECTRONIC DEVICE AND METHOD OF FABRICATION 审中-公开

    公开(公告)号：US20190304891A1

    公开(公告)日：2019-10-03

    申请号：US16365063

    申请日：2019-03-26

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Romain COFFY

    IPC: H01L23/498 ,  H01L21/50 ,  H01L23/10 ,  H01L23/31 ,  H01L23/00 ,  H01L31/0203

    Abstract: A cover for an electronic device includes a support body having a through-passage. An optical element which allows light to pass is mounted on said support body in a position extending across the through-passage. A surface of the optical element includes an electrically-conducting track configured as a security detection element. At least two electrical connection leads are rigidly attached to the support body and include first uncovered portions internal to the support body and electrically connected to spaced apart locations on the electrically-conducting track. The at least two electrical connection leads further including second uncovered portions external to said support body. The cover is mounted on a support plate carrying an electronic chip situated in the through-passage at a distance from the optical element.

    TIME-OF-FLIGHT SENSOR
    17.
    发明公开
    TIME-OF-FLIGHT SENSOR 审中-公开

    公开(公告)号：US20230266441A1

    公开(公告)日：2023-08-24

    申请号：US18112087

    申请日：2023-02-21

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Romain COFFY ,  Younes BOUTALEB

    IPC: G01S7/481 ,  H01L25/16

    CPC classification number: G01S7/4813 ,  H01L25/167 ,  H01L25/165

    Abstract: A time-of-flight sensor includes a first light ray generation circuit and a second light ray reception circuit. A resin layer encapsulates the first light ray generation circuit and the second light ray reception circuit. A first region configured to emit light rays of the first light ray generation circuit is exposed at a surface of the resin layer. A second region configured to receive light rays of the second light ray reception circuit is also exposed at that surface of the resin layer. The surface of the resin layer is configured to be directed towards a scene.

    ELECTRONIC DEVICE INCLUDING ELECTRICAL CONNECTIONS ON AN ENCAPSULATION BLOCK
    19.
    发明申请
    ELECTRONIC DEVICE INCLUDING ELECTRICAL CONNECTIONS ON AN ENCAPSULATION BLOCK 有权

    公开(公告)号：US20210366865A1

    公开(公告)日：2021-11-25

    申请号：US17396346

    申请日：2021-08-06

    Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

    Inventor： Romain COFFY ,  Patrick LAURENT ,  Laurent SCHWARTZ

    IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31

    Abstract: An integrated circuit chip includes a front face having an electrical connection pad. An overmolded encapsulation block encapsulates the integrated circuit chip and includes a front layer at least partially covering a front face of the integrated circuit chip. A through-hole the encapsulation block is located above the electrical connection pad of the integrated circuit chip. A wall of the through-hole is covered with an inner metal layer that is joined to the front pad of the integrated circuit chip. A front metal layer covers a local zone of the front face of the front layer, with the front metal layer being joined to the inner metal layer to form an electrical connection. The inner metal layer and the front metal layer are attached or anchored to activated additive particles that are included in the material of the encapsulation block.

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