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公开(公告)号：US10555087B2
公开(公告)日：2020-02-04
申请号：US15808712
申请日：2017-11-09
Applicant: OMRON Corporation
Inventor： Yuki Uchida
Abstract: An acoustic sensor has a semiconductor substrate having an opening, a back plate that is disposed facing the opening of the semiconductor substrate, that is configured to function as a fixed electrode, and that has sound holes that allow passage of air, a vibration electrode film disposed facing the back plate through a void, and a casing configured to house the substrate, the back plate, and the vibration electrode film, and having a pressure hole that allows inflow of air. The acoustic sensor converts transformation of the vibration electrode film into a change in capacitance between the vibration electrode film and the back plate to detect sound pressure.
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公开(公告)号：US09723423B2
公开(公告)日：2017-08-01
申请号：US14630917
申请日：2015-02-25
Applicant: OMRON Corporation
Inventor： Yuki Uchida
CPC classification number: H04R31/00 , H04R19/005
Abstract: An acoustic transducer has a back plate having a fixed electrode, a diaphragm that is opposed to the back plate with a gap interposed therebetween and that serves as a movable electrode, and a stopper protruding from a face of the back plate or the diaphragm, which is on a side of the gap. The stopper includes a conductive section electrically isolated from the fixed electrode and the movable electrode. The conductive section comes in contact with a front face of the fixed electrode or the movable electrode opposed to the stopper through deformation of the diaphragm.
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公开(公告)号：US09674618B2
公开(公告)日：2017-06-06
申请号：US14972354
申请日：2015-12-17
Applicant: OMRON CORPORATION
Inventor： Yuki Uchida , Koji Momotani , Takashi Kasai
CPC classification number: H04R19/005 , H04R19/04 , H04R31/00 , H04R2201/003 , H04S7/00 , H04S2420/01
Abstract: An acoustic sensor is provided for improving shock resistance performance, along with a method for manufacturing the acoustic sensor. In the acoustic sensor, a fixing plate is provided by a semiconductor manufacturing process, a frame wall has a curved shape in at least a portion of the periphery of the fixing plate, the frame wall being coupled to the semiconductor substrate. A sacrifice layer removed from the inner side of the fixing plate in the manufacturing process remains at least on a portion of the inner side of the frame wall. Roughness of the remaining sacrifice layer is smaller than roughness of a sound shape reflecting structure in which a shape similar to the external shape of sound holes is repeated. Roughness of the sound shape reflecting structure is formed when removing the sacrifice layer using etching liquid supplied from the plurality of sound holes in the semiconductor manufacturing process.
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公开(公告)号：US09668063B2
公开(公告)日：2017-05-30
申请号：US14772108
申请日：2013-09-09
Applicant: OMRON Corporation
Inventor： Yuki Uchida
IPC: H04R19/04 , H04R1/24 , H04R3/06 , H04R19/00 , H04R3/00 , H04R1/04 , B81B3/00 , G10K11/00 , H04R7/06
CPC classification number: H04R19/04 , B81B3/00 , G10K11/002 , H04R1/04 , H04R1/245 , H04R3/002 , H04R3/005 , H04R3/06 , H04R7/06 , H04R19/005 , H04R2201/003 , H04R2410/03 , H04R2499/11
Abstract: A chamber that penetrates vertically is formed in a silicon substrate. A diaphragm is arranged on the upper surface of the silicon substrate so as to cover the upper opening of the chamber. The diaphragm is divided by slits into a region located above the chamber (first diaphragm) and a region located above the upper surface of the silicon substrate (second diaphragm). A fixed electrode plate is arranged above the first diaphragm, and a low-volume first acoustic sensing portion is formed by the first diaphragm and the fixed electrode plate. Also, a high-volume second acoustic sensing portion is formed by the second diaphragm and the upper surface (electrically conducting layer) of the silicon substrate.
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公开(公告)号：US09462364B2
公开(公告)日：2016-10-04
申请号：US14426536
申请日：2013-08-12
Applicant: OMRON Corporation
Inventor： Yuki Uchida , Takashi Kasai
Abstract: A capacitance type sensor has a substrate, a vibration electrode plate formed over the substrate, a back plate formed over the substrate so as to cover the vibration electrode plate, and a fixed electrode plate provided on the back plate so as to be opposite to the vibration electrode plate. At least one of the vibration electrode plate and the fixed electrode plate is separated into a plurality of regions, each of the plurality of regions being formed with a sensing section including the vibration electrode plate and the fixed electrode plate. A barrier electrode is provided between respective sensing sections of at least one adjacent pair of regions of the plurality of regions to prevent signal interference between the respective sensing sections.
Abstract translation: 电容式传感器具有基板，形成在基板上的振动电极板，形成在基板上的覆盖振动电极板的背板和设置在背板上的固定电极板，以与 振动电极板。 振动电极板和固定电极板中的至少一个被分离成多个区域，所述多个区域中的每个区域形成有包括振动电极板和固定电极板的感测部分。 阻挡电极设置在多个区域中的至少一个相邻的一对区域的相应感测部分之间，以防止各个感测部分之间的信号干扰。
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Patent Agency Ranking
公开(公告)号：US20150264476A1
公开(公告)日：2015-09-17
申请号：US14630917
申请日：2015-02-25
Applicant: OMRON Corporation
Inventor： Yuki Uchida
IPC: H04R3/00
CPC classification number: H04R31/00 , H04R19/005
Abstract: An acoustic transducer has a back plate having a fixed electrode, a diaphragm that is opposed to the back plate with a gap interposed therebetween and that serves as a movable electrode, and a stopper protruding from a face of the back plate or the diaphragm, which is on a side of the gap. The stopper includes a conductive section electrically isolated from the fixed electrode and the movable electrode. The conductive section comes in contact with a front face of the fixed electrode or the movable electrode opposed to the stopper through deformation of the diaphragm.
Abstract translation: 声学换能器具有背板，该背板具有固定电极，隔膜与背板相对设置并且用作可动电极的隔板和从背板或隔膜的表面突出的止动件 在差距的一边。 止动件包括与固定电极和可动电极电隔离的导电部分。 导电部通过膜片的变形与固定电极的前面或与止动件相对的可动电极接触。
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公开(公告)号：US20180167741A1
公开(公告)日：2018-06-14
申请号：US15808736
申请日：2017-11-09
Applicant: OMRON Corporation
Inventor： Yuki Uchida
IPC: H04R9/08
CPC classification number: H04R9/08 , H04R19/005 , H04R19/04 , H04R2201/003 , H04R2410/03
Abstract: A capacitive transducer system has a capacitive transducer, and a controller. The capacitive transducer includes a first fixed electrode, a second fixed electrode, and a vibration electrode disposed between the first fixed electrode and the second fixed electrode so as to face the first and second fixed electrodes through gaps. A first capacitor is formed by the first fixed electrode and the vibration electrode. A second capacitor is formed by the second fixed electrode and the vibration electrode. The capacitive transducer is configured to convert transformation of the vibration electrode into changes in capacitance in the first capacitor and the second capacitor. The controller is configured to process voltages supplied to the first capacitor and the second capacitor and/or signals based on the changes in capacitance of the first capacitor and the second capacitor.
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公开(公告)号：US09641939B2
公开(公告)日：2017-05-02
申请号：US14859474
申请日：2015-09-21
Applicant: OMRON Corporation
Inventor： Yuki Uchida , Koji Momotani , Takashi Kasai
CPC classification number: H04R19/005 , H04R19/013 , H04R19/016 , H04R2201/003
Abstract: An acoustic transducer includes a slit having higher passage resistance than in conventional structures and having a lower rate of decrease in the passage resistance than in conventional structures when, for example, the vibration electrode plate warps. The acoustic transducer includes a stationary electrode plate, and a vibration electrode plate facing the stationary electrode plate with a space between the electrode plates. The vibration electrode plate includes a slit that allows sound to pass through. The vibration electrode plate includes a resistance increasing section including at least one pair of high-resistance surfaces that constitute side surfaces of the slit in a width direction thereof, and are thicker than a middle portion of the vibration electrode plate.
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公开(公告)号：US09344807B2
公开(公告)日：2016-05-17
申请号：US14482302
申请日：2014-09-10
Applicant: OMRON Corporation
Inventor： Yuki Uchida
CPC classification number: H04R19/005 , H01L2224/48091 , H01L2224/48137 , H01L2924/15151 , H01L2924/16152 , H04R1/086 , H04R19/04 , H04R31/00 , H01L2924/00014
Abstract: A capacitance-type transducer has a substrate having a cavity, a vibrating electrode plate disposed above the substrate, a back plate disposed on the substrate, a fixed electrode plate disposed on the back plate opposite the vibrating electrode plate, a plurality of holes formed in the back plate and the fixed electrode plate, and a protrusion disposed on the back plate at a location opposing the vibrating electrode plate. In a view from a direction perpendicular to an upper surface of the substrate, a shortest distance from a cross-sectional center of the protrusion to an edge of a hole adjacent to the protrusion is larger than a shortest distance from a center of a region that is surrounded by the holes but not provided with the protrusion to an edge of a hole in the periphery.
Abstract translation: 电容型换能器具有：具有空腔的基板，设置在基板的上方的振动电极板;设置在基板上的背板;配置在与振动电极板相对的背板上的固定电极板，形成在多个孔中的多个孔 背板和固定电极板，以及在与振动电极板相对的位置处设置在背板上的突起。 从垂直于基板的上表面的方向看，从突起的横截面中心到与突起相邻的孔的边缘的最短距离大于距离突起的中心的最短距离， 被孔围绕，但没有在周边的孔的边缘上设置突起。
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公开(公告)号：US09118994B2
公开(公告)日：2015-08-25
申请号：US14402163
申请日：2013-05-22
Applicant: OMRON Corporation
Inventor： Yuki Uchida , Takashi Kasai
CPC classification number: H04R1/08 , H04R1/005 , H04R1/04 , H04R7/06 , H04R19/005 , H04R19/04 , H04R2201/003
Abstract: A capacitance sensor has a substrate, a vibration electrode plate formed over an upper side of the substrate, a back plate formed over the upper side of the substrate to cover the vibration electrode plate, and a fixed electrode plate arranged on the back plate facing the vibration electrode plate. At least one of the vibration electrode plate and the fixed electrode plate is divided into a plurality of regions. A sensing unit configured by the vibration electrode plate and the fixed electrode plate is formed on each of the divided regions. An isolation portion that suppresses vibration from being propagated is formed on the back plate to partition the sensing units from each other.
Abstract translation: 电容传感器具有基板，形成在基板的上侧的振动电极板，形成在基板的上侧以覆盖振动电极板的背板，以及布置在背板上的固定电极板， 振动电极板。 振动电极板和固定电极板中的至少一个被分成多个区域。 在每个分割区域上形成由振动电极板和固定电极板构成的感测单元。 在背板上形成抑制振动传播的隔离部分，以将传感单元彼此隔开。
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