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公开(公告)号:US11296205B2
公开(公告)日:2022-04-05
申请号:US16591312
申请日:2019-10-02
Applicant: STMicroelectronics (Crolles 2) SAS , STMicroelectronics SA
Inventor: Alexis Gauthier , Pascal Chevalier
IPC: H01L29/66 , H01L29/06 , H01L29/08 , H01L29/732 , H01L21/265
Abstract: A bipolar transistor includes a collector. The collector is formed by: a first portion of the collector which extends under an insulating trench, and a second portion of the collector which crosses through the insulating trench. The first and second portions of the collector are in physical contact.
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公开(公告)号:US11276752B2
公开(公告)日:2022-03-15
申请号:US16995054
申请日:2020-08-17
Applicant: STMicroelectronics (Crolles 2) SAS
Inventor: Alexis Gauthier , Pascal Chevalier , Gregory Avenier
IPC: H01L29/06 , H01L29/66 , H01L29/732
Abstract: A device including a transistor is fabricated by forming a first part of a first region of the transistor through the implantation of dopants through a first opening. The second region of the transistor is then formed in the first opening by epitaxy.
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公开(公告)号:US11996465B2
公开(公告)日:2024-05-28
申请号:US17486000
申请日:2021-09-27
Applicant: STMicroelectronics (Crolles 2) SAS , STMicroelectronics SA
Inventor: Alexis Gauthier , Pascal Chevalier
CPC classification number: H01L29/66234 , H01L21/22 , H01L29/0649 , H01L29/73
Abstract: A bipolar transistor includes a collector. The collector is produced by a process wherein a first substantially homogeneously doped layer is formed at the bottom of a cavity. A second gradually doped layer is then formed by diffusion of dopants of the first substantially homogeneously doped layer.
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公开(公告)号:US11776995B2
公开(公告)日:2023-10-03
申请号:US17734486
申请日:2022-05-02
Applicant: STMicroelectronics (Crolles 2) SAS
Inventor: Alexis Gauthier , Pascal Chevalier , Gregory Avenier
IPC: H01L29/06 , H01L21/8222 , H01L29/66 , H01L29/732
CPC classification number: H01L29/0642 , H01L21/8222 , H01L29/6634 , H01L29/7322
Abstract: A transistor is produced by forming a first part of a first region of the transistor in a semiconductor substrate by implanting dopants through an opening in an isolating trench formed at an upper surface of the semiconductor substrate. A second region of the transistor in the opening by epitaxy.
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公开(公告)号:US11038017B2
公开(公告)日:2021-06-15
申请号:US16279361
申请日:2019-02-19
Applicant: STMicroelectronics (Crolles 2) SAS
Inventor: Alexis Gauthier , Julien Borrel
IPC: H01L29/08 , H01L29/06 , H01L29/167 , H01L29/66 , H01L29/737 , H01L29/732 , H01L21/265
Abstract: A bipolar junction transistor includes an extrinsic collector region buried in a semiconductor substrate under an intrinsic collector region. Carbon-containing passivating regions are provided to delimit the intrinsic collector region. An insulating layer on the intrinsic collector region includes an opening within which an extrinsic base region is provided. A semiconductor layer overlies the insulating layer, is in contact with the extrinsic base region, and includes an opening with insulated sidewalls. The collector region of the transistor is provided between the insulated sidewalls.
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公开(公告)号:US10453919B2
公开(公告)日:2019-10-22
申请号:US15803959
申请日:2017-11-06
Applicant: STMicroelectronics (Crolles 2) SAS
Inventor: Pascal Chevalier , Alexis Gauthier
IPC: H01L29/08 , H01L29/66 , H01L29/732 , H01L29/737
Abstract: A bipolar transistor is supported by a single-crystal silicon substrate including a collector connection region. A first epitaxial region forms a collector region doped with a first conductivity type on the collector connection region. The collector region includes a counter-doped region of a second conductivity type. A second epitaxial region forms a base region of a second conductivity type on the first epitaxial region. Deposited semiconductor material forms an emitter region of the first conductivity type on the second epitaxial region. The collector region, base region and emitter region are located within an opening formed in a stack of insulating layers that includes a sacrificial layer. The sacrificial layer is selectively removed to expose a side wall of the base region. Epitaxial growth from the exposed sidewall forms a base contact region.
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公开(公告)号:US10186605B1
公开(公告)日:2019-01-22
申请号:US15783109
申请日:2017-10-13
Applicant: STMicroelectronics (Crolles 2) SAS
Inventor: Alexis Gauthier , Fabien Deprat , Yves Campidelli
IPC: H01L29/732 , H01L29/66 , H01L29/737 , H01L27/06 , H01L21/8249 , H01L29/417
Abstract: A bipolar transistor is supported by a single-crystal silicon substrate including a collector contact region. A cyclical epitaxy process is performed to provide a collector region of a first conductivity type on the collector contact region that is laterally separated from a silicon layer by an air gap. A second epitaxial region forms a base region of a second conductivity type. Deposited semiconductor material forms an emitter region of the first conductivity type. The collector region, base region and emitter region are located within an opening formed in a stack of insulating layers that includes a sacrificial layer. The sacrificial layer is selectively removed to expose a side wall of the base region. Epitaxial growth from the exposed sidewall forms a base contact region.
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公开(公告)号:US20180277659A1
公开(公告)日:2018-09-27
申请号:US15707258
申请日:2017-09-18
Applicant: STMicroelectronics (Crolles 2) SAS
Inventor: Alexis Gauthier , Guillaume C. Ribes
CPC classification number: H01L29/66666 , H01L21/02532 , H01L21/02595 , H01L21/28008 , H01L21/308 , H01L29/127 , H01L29/42376 , H01L29/7827 , H01L49/006
Abstract: A vertical transistor includes two portions of a gate conductor that extend within a layer of insulator. An opening extending through the later of insulator includes source, channel and drain regions form by epitaxy operations. A thickness of the portions of the gate conductor decreases in the vicinity of the channel region.
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公开(公告)号:US12125894B2
公开(公告)日:2024-10-22
申请号:US18383926
申请日:2023-10-26
Inventor: Alexis Gauthier , Pascal Chevalier
IPC: H01L29/66 , H01L29/06 , H01L29/08 , H01L29/732 , H01L21/265
CPC classification number: H01L29/66272 , H01L29/0649 , H01L29/0821 , H01L29/732 , H01L21/26513
Abstract: A bipolar transistor includes a collector. The collector is formed by: a first portion of the collector which extends under an insulating trench, and a second portion of the collector which crosses through the insulating trench. The first and second portions of the collector are in physical contact.
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公开(公告)号:US11837647B2
公开(公告)日:2023-12-05
申请号:US17685780
申请日:2022-03-03
Applicant: STMicroelectronics (Crolles 2) SAS , STMicroelectronics SA
Inventor: Alexis Gauthier , Pascal Chevalier
IPC: H01L29/66 , H01L29/06 , H01L29/08 , H01L29/732 , H01L21/265
CPC classification number: H01L29/66272 , H01L29/0649 , H01L29/0821 , H01L29/732 , H01L21/26513
Abstract: A bipolar transistor includes a collector. The collector is formed by: a first portion of the collector which extends under an insulating trench, and a second portion of the collector which crosses through the insulating trench. The first and second portions of the collector are in physical contact.
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