公开(公告)号：US09674618B2

公开(公告)日：2017-06-06

申请号：US14972354

申请日：2015-12-17

Applicant: OMRON CORPORATION

Inventor： Yuki Uchida ,  Koji Momotani ,  Takashi Kasai

IPC: H04R19/00 ,  H04R19/04 ,  H04R31/00

CPC classification number: H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2201/003 ,  H04S7/00 ,  H04S2420/01

Abstract: An acoustic sensor is provided for improving shock resistance performance, along with a method for manufacturing the acoustic sensor. In the acoustic sensor, a fixing plate is provided by a semiconductor manufacturing process, a frame wall has a curved shape in at least a portion of the periphery of the fixing plate, the frame wall being coupled to the semiconductor substrate. A sacrifice layer removed from the inner side of the fixing plate in the manufacturing process remains at least on a portion of the inner side of the frame wall. Roughness of the remaining sacrifice layer is smaller than roughness of a sound shape reflecting structure in which a shape similar to the external shape of sound holes is repeated. Roughness of the sound shape reflecting structure is formed when removing the sacrifice layer using etching liquid supplied from the plurality of sound holes in the semiconductor manufacturing process.

公开(公告)号：US09668063B2

公开(公告)日：2017-05-30

申请号：US14772108

申请日：2013-09-09

Applicant: OMRON Corporation

Inventor： Yuki Uchida

IPC: H04R19/04 ,  H04R1/24 ,  H04R3/06 ,  H04R19/00 ,  H04R3/00 ,  H04R1/04 ,  B81B3/00 ,  G10K11/00 ,  H04R7/06

CPC classification number: H04R19/04 ,  B81B3/00 ,  G10K11/002 ,  H04R1/04 ,  H04R1/245 ,  H04R3/002 ,  H04R3/005 ,  H04R3/06 ,  H04R7/06 ,  H04R19/005 ,  H04R2201/003 ,  H04R2410/03 ,  H04R2499/11

Abstract: A chamber that penetrates vertically is formed in a silicon substrate. A diaphragm is arranged on the upper surface of the silicon substrate so as to cover the upper opening of the chamber. The diaphragm is divided by slits into a region located above the chamber (first diaphragm) and a region located above the upper surface of the silicon substrate (second diaphragm). A fixed electrode plate is arranged above the first diaphragm, and a low-volume first acoustic sensing portion is formed by the first diaphragm and the fixed electrode plate. Also, a high-volume second acoustic sensing portion is formed by the second diaphragm and the upper surface (electrically conducting layer) of the silicon substrate.

公开(公告)号：US09462364B2

公开(公告)日：2016-10-04

申请号：US14426536

申请日：2013-08-12

Applicant: OMRON Corporation

Inventor： Yuki Uchida ,  Takashi Kasai

IPC: H04R25/00 ,  H04R1/08 ,  H04R19/00 ,  H04R7/06 ,  H04R7/12 ,  H04R19/04 ,  H01L29/84

CPC classification number: H04R1/08 ,  H01L29/84 ,  H04R7/06 ,  H04R7/122 ,  H04R19/005 ,  H04R19/04

Abstract: A capacitance type sensor has a substrate, a vibration electrode plate formed over the substrate, a back plate formed over the substrate so as to cover the vibration electrode plate, and a fixed electrode plate provided on the back plate so as to be opposite to the vibration electrode plate. At least one of the vibration electrode plate and the fixed electrode plate is separated into a plurality of regions, each of the plurality of regions being formed with a sensing section including the vibration electrode plate and the fixed electrode plate. A barrier electrode is provided between respective sensing sections of at least one adjacent pair of regions of the plurality of regions to prevent signal interference between the respective sensing sections.

Abstract translation: 电容式传感器具有基板，形成在基板上的振动电极板，形成在基板上的覆盖振动电极板的背板和设置在背板上的固定电极板，以与 振动电极板。 振动电极板和固定电极板中的至少一个被分离成多个区域，所述多个区域中的每个区域形成有包括振动电极板和固定电极板的感测部分。 阻挡电极设置在多个区域中的至少一个相邻的一对区域的相应感测部分之间，以防止各个感测部分之间的信号干扰。

公开(公告)号：US20150264476A1

公开(公告)日：2015-09-17

申请号：US14630917

申请日：2015-02-25

Applicant: OMRON Corporation

Inventor： Yuki Uchida

IPC: H04R3/00

CPC classification number: H04R31/00 ,  H04R19/005

Abstract: An acoustic transducer has a back plate having a fixed electrode, a diaphragm that is opposed to the back plate with a gap interposed therebetween and that serves as a movable electrode, and a stopper protruding from a face of the back plate or the diaphragm, which is on a side of the gap. The stopper includes a conductive section electrically isolated from the fixed electrode and the movable electrode. The conductive section comes in contact with a front face of the fixed electrode or the movable electrode opposed to the stopper through deformation of the diaphragm.

Abstract translation: 声学换能器具有背板，该背板具有固定电极，隔膜与背板相对设置并且用作可动电极的隔板和从背板或隔膜的表面突出的止动件 在差距的一边。 止动件包括与固定电极和可动电极电隔离的导电部分。 导电部通过膜片的变形与固定电极的前面或与止动件相对的可动电极接触。

公开(公告)号：US20180167741A1

公开(公告)日：2018-06-14

申请号：US15808736

申请日：2017-11-09

Applicant: OMRON Corporation

Inventor： Yuki Uchida

IPC: H04R9/08

CPC classification number: H04R9/08 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2410/03

Abstract: A capacitive transducer system has a capacitive transducer, and a controller. The capacitive transducer includes a first fixed electrode, a second fixed electrode, and a vibration electrode disposed between the first fixed electrode and the second fixed electrode so as to face the first and second fixed electrodes through gaps. A first capacitor is formed by the first fixed electrode and the vibration electrode. A second capacitor is formed by the second fixed electrode and the vibration electrode. The capacitive transducer is configured to convert transformation of the vibration electrode into changes in capacitance in the first capacitor and the second capacitor. The controller is configured to process voltages supplied to the first capacitor and the second capacitor and/or signals based on the changes in capacitance of the first capacitor and the second capacitor.

公开(公告)号：US09843868B2

公开(公告)日：2017-12-12

申请号：US15017514

申请日：2016-02-05

Applicant: Omron Corporation ,  STMICROELECTRONICS S.R.L.

Inventor： Takashi Kasai ,  Shobu Sato ,  Yuki Uchida ,  Igino Padovani ,  Filippo David ,  Sebastiano Conti

IPC: H04R19/04 ,  H04R3/00 ,  H04R19/00 ,  H04R19/01 ,  H04R31/00 ,  B81B3/00 ,  H04R1/02 ,  H04R1/08

CPC classification number: H04R19/04 ,  B81B3/0021 ,  H04R1/023 ,  H04R1/086 ,  H04R3/00 ,  H04R3/005 ,  H04R19/005 ,  H04R19/016 ,  H04R31/00 ,  H04R2201/003 ,  H04R2499/11

Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.

公开(公告)号：US09641939B2

公开(公告)日：2017-05-02

申请号：US14859474

申请日：2015-09-21

Applicant: OMRON Corporation

Inventor： Yuki Uchida ,  Koji Momotani ,  Takashi Kasai

IPC: H04R25/00 ,  H04R19/00 ,  H04R19/01

CPC classification number: H04R19/005 ,  H04R19/013 ,  H04R19/016 ,  H04R2201/003

Abstract: An acoustic transducer includes a slit having higher passage resistance than in conventional structures and having a lower rate of decrease in the passage resistance than in conventional structures when, for example, the vibration electrode plate warps. The acoustic transducer includes a stationary electrode plate, and a vibration electrode plate facing the stationary electrode plate with a space between the electrode plates. The vibration electrode plate includes a slit that allows sound to pass through. The vibration electrode plate includes a resistance increasing section including at least one pair of high-resistance surfaces that constitute side surfaces of the slit in a width direction thereof, and are thicker than a middle portion of the vibration electrode plate.

公开(公告)号：US09380380B2

公开(公告)日：2016-06-28

申请号：US13936110

申请日：2013-07-05

Applicant: Omron Corporation ,  STMICROELECTRONICS S.R.L.

Inventor： Takashi Kasai ,  Shobu Sato ,  Yuki Uchida ,  Igino Padovani ,  Filippo David ,  Sebastiano Conti ,  Martino Zerbini ,  Luca Molinari

IPC: H04R5/00 ,  H04R3/00 ,  H04R19/00 ,  H04R19/01 ,  H04R31/00 ,  H04R1/08

CPC classification number: H04R3/00 ,  H01L2224/48137 ,  H01L2924/16152 ,  H04R1/086 ,  H04R19/005 ,  H04R19/016 ,  H04R31/00

Abstract: The present disclosure is directed to an acoustic transducer configured to detect a sound wave according to changes in capacitances between a vibrating electrode and a fixed electrode. At least one of the vibrating electrode and the fixed electrode being divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting electrical signals. The disclosure includes a digital interface circuit coupled to the divided electrodes. The circuit includes a recombination stage, which supplies a mixed signal by combining the first digital processed signal and the second digital processed signal with a respective weight that is a function of a first level value of the first processed signal. An output stage is included, which supplies, selectively and alternatively, a first processed signal, a second processed signal, or a mixed signal.

Abstract translation: 本公开涉及一种被配置为根据振动电极和固定电极之间的电容的变化来检测声波的声学换能器。 振动电极和固定电极中的至少一个分为多个分割电极，多个分割电极输出电信号。 本公开包括耦合到分割电极的数字接口电路。 电路包括复合级，其通过将第一数字处理信号和第二数字处理信号组合为具有作为第一处理信号的第一电平值的函数的相应权重来提供混合信号。 包括输出级，其选择性地或替代地提供第一处理信号，第二处理信号或混合信号。

公开(公告)号：US09344807B2

公开(公告)日：2016-05-17

申请号：US14482302

申请日：2014-09-10

Applicant: OMRON Corporation

Inventor： Yuki Uchida

IPC: H04R25/00 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00 ,  H04R1/08

CPC classification number: H04R19/005 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H01L2924/16152 ,  H04R1/086 ,  H04R19/04 ,  H04R31/00 ,  H01L2924/00014

Abstract: A capacitance-type transducer has a substrate having a cavity, a vibrating electrode plate disposed above the substrate, a back plate disposed on the substrate, a fixed electrode plate disposed on the back plate opposite the vibrating electrode plate, a plurality of holes formed in the back plate and the fixed electrode plate, and a protrusion disposed on the back plate at a location opposing the vibrating electrode plate. In a view from a direction perpendicular to an upper surface of the substrate, a shortest distance from a cross-sectional center of the protrusion to an edge of a hole adjacent to the protrusion is larger than a shortest distance from a center of a region that is surrounded by the holes but not provided with the protrusion to an edge of a hole in the periphery.

Abstract translation: 电容型换能器具有：具有空腔的基板，设置在基板的上方的振动电极板;设置在基板上的背板;配置在与振动电极板相对的背板上的固定电极板，形成在多个孔中的多个孔 背板和固定电极板，以及在与振动电极板相对的位置处设置在背板上的突起。 从垂直于基板的上表面的方向看，从突起的横截面中心到与突起相邻的孔的边缘的最短距离大于距离突起的中心的最短距离， 被孔围绕，但没有在周边的孔的边缘上设置突起。

公开(公告)号：US09118994B2

公开(公告)日：2015-08-25

申请号：US14402163

申请日：2013-05-22

Applicant: OMRON Corporation

Inventor： Yuki Uchida ,  Takashi Kasai

IPC: H04R25/00 ,  H04R1/08 ,  H04R19/04 ,  H04R19/00

CPC classification number: H04R1/08 ,  H04R1/005 ,  H04R1/04 ,  H04R7/06 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

Abstract: A capacitance sensor has a substrate, a vibration electrode plate formed over an upper side of the substrate, a back plate formed over the upper side of the substrate to cover the vibration electrode plate, and a fixed electrode plate arranged on the back plate facing the vibration electrode plate. At least one of the vibration electrode plate and the fixed electrode plate is divided into a plurality of regions. A sensing unit configured by the vibration electrode plate and the fixed electrode plate is formed on each of the divided regions. An isolation portion that suppresses vibration from being propagated is formed on the back plate to partition the sensing units from each other.

Abstract translation: 电容传感器具有基板，形成在基板的上侧的振动电极板，形成在基板的上侧以覆盖振动电极板的背板，以及布置在背板上的固定电极板， 振动电极板。 振动电极板和固定电极板中的至少一个被分成多个区域。 在每个分割区域上形成由振动电极板和固定电极板构成的感测单元。 在背板上形成抑制振动传播的隔离部分，以将传感单元彼此隔开。