公开(公告)号：US20220108939A1

公开(公告)日：2022-04-07

申请号：US17491082

申请日：2021-09-30

Applicant: STMicroelectronics S.r.l.

Inventor： Agatino MINOTTI ,  Francesco SALAMONE ,  Massimiliano FIORITO ,  Alessio SCORDIA ,  Manuel PONTURO

IPC: H01L23/49 ,  H01L23/492 ,  H01L23/373 ,  H01R12/58 ,  H01R43/02

Abstract: A blocking element is provided for connecting an electronic, micro-mechanical and/or micro-electro-mechanical component, in particular for controlling the propulsion of an electric vehicle. The pin blocking element is formed by a holed body having a first end, a second end and an axial cavity configured for fittingly accommodating a connecting pin. A first flange projects transversely from the holed body at the first end and a second flange projects transversely from the holed body at the second end. The first flange has a greater area than the second flange and is configured to be ultrasonically soldered to a conductive bearing plate to form a power module.

公开(公告)号：US20210037674A1

公开(公告)日：2021-02-04

申请号：US16934991

申请日：2020-07-21

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristiano Gianluca STELLA ,  Francesco SALAMONE

IPC: H05K7/20 ,  H01L23/373 ,  H01L25/07

Abstract: The device has a first support element forming a first thermal dissipation surface and carrying a first power component; a second support element forming a second thermal dissipation surface and carrying a second power component, a first contacting element superimposed to the first power component; a second contacting element superimposed to the second power component; a plurality of leads electrically coupled with the power components through the first and/or the second support elements; and a thermally conductive body arranged between the first and the second contacting elements. The first and the second support elements and the first and the second contacting elements are formed by electrically insulating and thermally conductive multilayers.

公开(公告)号：US20160118320A1

公开(公告)日：2016-04-28

申请号：US14870721

申请日：2015-09-30

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Fabio Vito COPPONE ,  Agatino MINOTTI ,  Francesco SALAMONE

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49562 ,  H01L21/565 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49568 ,  H01L24/06 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/84 ,  H01L2924/00

Abstract: An electronic device comprising: a semiconductor die integrating an electronic component; a leadframe housing the semiconductor die; a protection body, which surrounds laterally and at the top the semiconductor die and, at least in part, the leadframe structure, defining a top surface, a bottom surface, and a thickness of the electronic device; and a conductive lead electrically coupled to the semiconductor die. The conductive lead is modelled in such a way as to extend throughout the thickness of the protection body for forming a front electrical contact accessible from the top surface of the electronic device, and a rear electrical contact accessible from the bottom surface of the electronic device.

Abstract translation: 一种电子设备，包括：集成电子部件的半导体管芯; 引线框架，其容纳半导体管芯; 保护体，其横向地和顶部包围半导体管芯，并且至少部分地围绕引线框架结构，限定电子器件的顶表面，底表面和厚度; 以及电连接到半导体管芯的导电引线。 导电引线被模制成能够延伸到保护体的整个厚度上，以形成从电子器件的顶表面可接近的前电接触，以及可从电子器件的底表面接近的后电接触。