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    SYSTEM FOR COUPLING LIGHT TO INTEGRATED DEVICES AND CORRESPONDING METHOD
    12.
    发明申请
    SYSTEM FOR COUPLING LIGHT TO INTEGRATED DEVICES AND CORRESPONDING METHOD 审中-公开

    公开(公告)号：US20170090123A1

    公开(公告)日：2017-03-30

    申请号：US15078785

    申请日：2016-03-23

    Applicant: STMicroelectronics S.r.l.

    Inventor： Luca Maggi ,  Marco Piazza ,  Giuseppe Cusmai

    IPC: G02B6/34 ,  G02B6/32 ,  G02B6/30

    Abstract: System for coupling light to integrated devices, comprising a grating coupler which couples light, such as light from a light source, into an optic fiber. The system includes an optic subsystem comprising a transmitter portion receiving the light emitted by the grating coupler and a receiver portion receiving light from the transmitter and focusing the light into the integrated device, the transmitter portion being configured to modify an angle distribution of the light emitted by the grating coupler and the receiving portion being configured to focus the light with modified angle distribution into the integrated device.

    Semiconductor integrated device assembly process
    13.
    发明授权
    Semiconductor integrated device assembly process 有权
    半导体集成器件组装过程

    公开(公告)号：US08921164B2

    公开(公告)日：2014-12-30

    申请号：US13772210

    申请日：2013-02-20

    Applicant: STMicroelectronics Ltd (Malta) ,  STMicroelectronics S.r.l.

    Inventor： Kenneth Fonk ,  Luca Maggi ,  Jeremy Spiteri

    IPC: H01L21/00 ,  H01L23/495

    CPC classification number: B81B7/0045 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C1/00238 ,  B81C1/00325 ,  B81C2203/0785 ,  B81C2203/0792 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A process for assembly of an integrated device, envisages: providing a first body of semiconductor material integrating at least one electronic circuit and having a top surface; providing a second body of semiconductor material integrating at least one microelectromechanical structure and having a bottom surface; and stacking the second body on the first body with the interposition, between the top surface of the first body and the bottom surface of the second body, of an elastic spacer material. Prior to the stacking step, the step is envisaged of providing, in an integrated manner, at the top surface of the first body a confinement and spacing structure that confines inside it the elastic spacer material and supports the second body at a distance from the first body during the stacking step.

    Abstract translation: 集成装置的组装方法设想：提供集成至少一个电子电路并具有顶表面的第一半导体材料体; 提供集成至少一个微机电结构并具有底表面的第二半导体材料; 并且在所述第一主体的顶表面和所述第二主体的所述底表面之间插入所述第一主体上的所述第二主体的弹性间隔件材料。 在层叠步骤之前，该步骤被设想为以第一体积的方式在第一体的顶表面处提供约束和间隔结构，该限制和间隔结构在其内部限定弹性间隔物材料，并且将第二体与第一体 身体在堆叠步骤。

    Integrated electronic module including two micromirrors, and system including the electronic module
    15.
    发明授权
    Integrated electronic module including two micromirrors, and system including the electronic module 有权

    公开(公告)号：US12204092B2

    公开(公告)日：2025-01-21

    申请号：US17480634

    申请日：2021-09-21

    Applicant: STMicroelectronics S.r.l.

    Inventor： Marco Del Sarto ,  Alex Gritti ,  Amedeo Maierna ,  Luca Maggi

    IPC: G02B26/08 ,  G02B26/10

    Abstract: An electronic module includes a first die of semiconductor material including a first reflector, a second die of semiconductor material including a second reflector, and a frame including a first supporting portion and a second supporting portion parallel to one another. The first and second dies are carried, respectively, by the first and second supporting portions and are respectively arranged so that the first reflector faces the second supporting portion and the second reflector faces the first supporting portion. An incoming light beam impinges upon the first reflector and is reflected on the second reflector so as to be supplied at output from the electronic module.

    Opto-mechanical transducer apparatus and corresponding method
    16.
    发明授权
    Opto-mechanical transducer apparatus and corresponding method 有权

    公开(公告)号：US11598920B2

    公开(公告)日：2023-03-07

    申请号：US17326955

    申请日：2021-05-21

    Applicant: STMicroelectronics S.r.l.

    Inventor： Luca Maggi ,  Mark Andrew Shaw

    IPC: G02B6/32 ,  G02F1/01 ,  G02B6/028 ,  G01L9/00

    Abstract: An embodiment apparatus comprises an optically transparent substrate having first and second surfaces; a piezoelectric membrane, arranged at the first surface, that oscillates in response to a light beam propagated through the substrate; at least one reflective facet facing the substrate and arranged at the piezoelectric membrane; and an optical element receiving the light beam at an input end and guiding the light beam towards an output end coupled to the second surface. The optical element incorporates a light focusing path focusing the light beam at a focal point at the piezoelectric membrane, and at least one light collimating path collimating the light beam onto the at least one reflective facet. The optical element guides light reflected from the at least one reflective facet to the input end, the reflected light indicating a position of the optical element with respect to the focal point.

    Photonic Wafer Level Testing Systems, Devices, and Methods of Operation
    17.
    发明申请
    Photonic Wafer Level Testing Systems, Devices, and Methods of Operation 有权

    公开(公告)号：US20210270699A1

    公开(公告)日：2021-09-02

    申请号：US17318831

    申请日：2021-05-12

    Applicant: STMicroelectronics S.r.l.

    Inventor： Marco Piazza ,  Antonio Canciamilla ,  Piero Orlandi ,  Luca Maggi

    IPC: G01M11/00 ,  G02B6/293 ,  G01M11/02 ,  G01R31/3185 ,  G01R31/317

    Abstract: A method of testing a photonic device includes providing a plurality of optical test signals at respective inputs of a first plurality of inputs of an optical input circuit located on a substrate, combining the plurality of optical test signals into a combined optical test signal at an output of the optical input circuit, transmitting the combined optical test signal through the output to an input waveguide of an optical device under test, the optical device under test being located on the substrate, and measuring a response of the optical device under test to the combined optical test signal. Each of the plurality of optical test signals comprises a respective dominant wavelength of a plurality of dominant wavelengths.

    Method of producing a device for adiabatic coupling between waveguide arrays, corresponding device, and system
    18.
    发明授权
    Method of producing a device for adiabatic coupling between waveguide arrays, corresponding device, and system 有权

    公开(公告)号：US10761279B2

    公开(公告)日：2020-09-01

    申请号：US16428428

    申请日：2019-05-31

    Applicant: STMicroelectronics S.r.l.

    Inventor： Mark Andrew Shaw ,  Luca Maggi ,  Antonio Fincato

    IPC: G02B6/42 ,  G02B6/122 ,  G02B6/12

    Abstract: A method includes providing a semiconductor body comprising a surface with a recessed portion therein. The recessed portion includes a bottom surface. Optical waveguide cores in a first array of optical waveguide cores extend side-by-side at the bottom surface. The method further includes providing a second array of optical waveguide cores over the first array of optical waveguide cores. Optical waveguide cores in the second array of optical waveguide cores extend side-by-side. Each optical waveguide core in the second array of optical waveguide cores is in an adiabatic coupling relationship with a corresponding optical waveguide core in the first array of optical waveguide cores. The method also includes applying an optical waveguide cladding material over the second array of optical waveguide cores.

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