公开(公告)号：US20220361118A1

公开(公告)日：2022-11-10

申请号：US17733154

申请日：2022-04-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanghyun LEE ,  Seungmoo CHO ,  Yonghyon KIM ,  Dongchul MA ,  Byungki MOON ,  Sungbo PARK

IPC: H04W52/36 ,  H04W52/14 ,  H04L1/20 ,  H04L1/00

Abstract: According to various embodiments, an electronic device may comprise: a temperature sensor; a wireless communication circuit; and a processor electrically connected to the wireless communication circuit, wherein the processor is configured to: receive a temperature sensed by the temperature sensor; determine a first maximum transmission power as a maximum transmission power of uplink transmission data to be transmitted through the wireless communication circuit, identify a modulation and coding scheme (MCS) index and a number of resource blocks (RBs), when the received temperature is higher than a predetermined value, based on the identified the MCS index and the number of RBs, determine a second maximum transmission power, and change the first maximum transmission power to the second maximum transmission power, wherein the second maximum transmission power is lower than the first maximum transmission power.

公开(公告)号：US20220360315A1

公开(公告)日：2022-11-10

申请号：US17654671

申请日：2022-03-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangun OH ,  Inhye YEOM ,  Naram YOON ,  Sanghyun LEE ,  Seongwon CHO

IPC: H04B7/08 ,  H04L5/00 ,  H04W24/10 ,  H04W8/24

Abstract: An electronic device includes: a plurality of antennas, and at least one processor, wherein the at least one processor is configured to: identify an over-temperature state of the electronic device, identify a current state of the electronic device for at least one parameter of a user equipment (UE) capability of the electronic device based on identification of the over-temperature state, perform a first operation of reducing a number of antennas for reception among the plurality of antennas based on satisfying a specific condition by the current state of the electronic device for the at least one parameter, and perform the first operation and a second operation of changing at least some of the UE capability of the electronic device based on not satisfying the specific condition by the current state of the electronic device for the at least one parameter.

公开(公告)号：US20220240078A1

公开(公告)日：2022-07-28

申请号：US17577937

申请日：2022-01-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungjuhn PARK ,  Sanghyun LEE

IPC: H04W8/18 ,  H04W68/00 ,  H04W24/10 ,  H04W24/08 ,  H04W76/28

Abstract: An electronic device is provided. The electronic device includes a processor connected to a first SIM and a second SIM, and RF devices used for communication based on the first SIM and on the second SIM, the processor identifies expiration of a timer for paging monitoring associated with the second SIM while use of the RF devices is allocated to the first SIM, to allocate use of the RF devices to the second SIM to perform first paging monitoring and first-type measurement, reallocates use of the RF devices to the first SIM according to completion of the first paging monitoring and the first-type measurement, identifies expiration of the timer for the paging monitoring associated with the second SIM while use of the RF devices is reallocated to the first SIM, and allocates use of the RF devices to the second SIM to perform second paging monitoring and second-type measurement.

公开(公告)号：US20210384100A1

公开(公告)日：2021-12-09

申请号：US17307181

申请日：2021-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyo-Chang RYU ,  Chulwoo KIM ,  Juhyun LYU ,  Sanghyun LEE ,  Yun Seok CHOI

IPC: H01L23/367 ,  H01L25/065 ,  H01L23/00

Abstract: A semiconductor package includes a first substrate, a first chip structure and a second chip structure spaced apart from each other on the first substrate, a gap region being defined between the first and second chip structures, and a heat dissipation member covering the first chip structure, the second chip structure, and the first substrate, the heat dissipation member including a first trench in an inner top surface of the heat dissipation member, wherein the first trench vertically overlaps with the gap region and has a width greater than a width of the gap region, and wherein the first trench vertically overlaps with at least a portion of a top surface of the first chip structure or a portion of a top surface of the second chip structure.

公开(公告)号：US20210219362A1

公开(公告)日：2021-07-15

申请号：US17141683

申请日：2021-01-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanghyun LEE ,  Jungmin OH ,  Kyungwon LEE

IPC: H04W76/15 ,  H04W72/04 ,  H04L12/24 ,  H04W24/08

Abstract: Disclosed is a user equipment (UE), including: a first subscriber identity module corresponding to a first cellular network, a second subscriber identity module corresponding to a second cellular network, a wireless communication circuit, and a processor operatively connected to the first subscriber identity module, the second subscriber identity module, and the wireless communication circuit, wherein the processor is configured to: control the UE to perform data communication with the first cellular network that supports EUTRA NR dual connectivity (EN-DC) using first identity information of the first subscriber identity module, via the wireless communication circuit; detect an activity that triggers data communication via the second cellular network; and in response to the detection of the activity, connect data communication with the second cellular network using second identity information of the second subscriber identity module via the wireless communication circuit, and maintain support of an EN-DC of a UE capability associated with the first cellular network.

公开(公告)号：US20160204030A1

公开(公告)日：2016-07-14

申请号：US14955374

申请日：2015-12-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： KeunHee BAI ,  Dohyoung KIM ,  Johnsoo KIM ,  Heungsik PARK ,  Doo-Young LEE ,  Sanghyun LEE

IPC: H01L21/768 ,  H01L21/3065 ,  H01L29/51 ,  H01L21/28

CPC classification number: H01L21/76897 ,  H01L21/823431 ,  H01L21/823475 ,  H01L29/517 ,  H01L29/66545

Abstract: A sacrificial layer is formed to cover the gate structures. The sacrificial layer is patterned to form a first opening in the sacrificial layer. A preliminary contact is formed in the first opening and the sacrificial layer is selectively removed. An insulating layer is formed to cover the gate structures and to expose the preliminary contact. The preliminary contact is removed to form a second opening in the insulating layer, and then a contact is formed in the second opening.

Abstract translation: 形成牺牲层以覆盖栅极结构。 牺牲层被图案化以在牺牲层中形成第一开口。 在第一开口中形成初步接触，并且选择性地去除牺牲层。 形成绝缘层以覆盖栅极结构并露出初步接触。 去除预接触以在绝缘层中形成第二开口，然后在第二开口中形成接触。

公开(公告)号：US20140099935A1

公开(公告)日：2014-04-10

申请号：US14047371

申请日：2013-10-07

Applicant: Samsung Electronics Co. Ltd.

Inventor： Jinsoo HAN ,  Hong KIM ,  Sanghyun LEE

IPC: H04W48/16 ,  H04W88/06

CPC classification number: H04W48/16 ,  H04W48/18 ,  H04W88/06

Abstract: A system and method for network-related information is provided. In a method for updating network-related information, an electronic device determines whether the network-related information is received from a currently accessed service network, and accesses another service network if the network-related information is not received, and receives the network-related information from the newly accessed service network.

Abstract translation: 提供了一种网络相关信息的系统和方法。 在更新网络相关信息的方法中，电子设备确定是否从当前访问的服务网络接收到网络相关信息，并且如果未接收到与网络相关的信息，则接入另一服务网络，并且接收与网络有关的信息 来自新访问的服务网络的信息。

公开(公告)号：US20240213160A1

公开(公告)日：2024-06-27

申请号：US18535143

申请日：2023-12-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyoungpil PARK ,  Doohwan PARK ,  Sanghyun LEE ,  Hyeonmin JEON

IPC: H01L23/532 ,  H01L23/522

CPC classification number: H01L23/5329 ,  H01L23/5226 ,  H01L23/49816

Abstract: A semiconductor device includes a first wiring level layer including a lower wiring layer, a second wiring level layer on the first wiring level layer and including an upper wiring layer, a via level layer positioned between the first wiring level layer and the second wiring level layer and including a via connecting the lower wiring layer to the upper wiring layer, and a reinforcing insulating layer positioned between the lower wiring layer and the upper wiring layer in the via level layer.

公开(公告)号：US20240048208A1

公开(公告)日：2024-02-08

申请号：US18197874

申请日：2023-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Leechun KIM ,  Kwonyeol PARK ,  Yookeun KANG ,  Sanghyun LEE ,  Seongho HUR

IPC: H04B7/06 ,  H04B7/0417 ,  H04B7/0452

CPC classification number: H04B7/0639 ,  H04B7/0417 ,  H04B7/0452 ,  H04B7/0632

Abstract: A method of a base station communicating with a plurality of User Equipments (UEs), includes: identifying a number of activated UEs from among the plurality of UEs; selecting, among a plurality of feedback schemes, a feedback scheme supporting a highest data throughput at the identified number of activated UEs with reference to history information; determining (i) a number of UEs in a companion group and (ii) a codebook size, the number of UEs in the companion group and the codebook size being corresponding to the selected feedback scheme; and performing Multiple Input and Multiple Output (MIMO) communication with the activated UEs based on the determined number of UEs in the companion group and the determined codebook size.

公开(公告)号：US20220382624A1

公开(公告)日：2022-12-01

申请号：US17885216

申请日：2022-08-10

Applicant: Samsung Electronics Co., LTD.

Inventor： Byungchul KIM ,  Kiseok KIM ,  Mingyu KIM ,  Jaemin OH ,  Sanghyun LEE

IPC: G06F11/07 ,  G06F9/4401

Abstract: The present disclosure refers to apparatuses and methods for initializing electronic devices. An electronic device according to various embodiments includes a memory, and a processor operatively connected to the memory. The processor is configured to record, in the memory, software binaries received from an external device during a download mode. The processor is further configured to, when the download mode has ended, perform booting in a normal mode using a bootloader based on a determination indicating that a predetermined software binary is present among the software binaries recorded in the memory, and perform booting in a recovery mode using the bootloader based on the determination indicating that the predetermined software binary is absent from among the software binaries recorded in the memory.