公开(公告)号：US20220406959A1

公开(公告)日：2022-12-22

申请号：US17582172

申请日：2022-01-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junhee CHOI ,  Nakhyun KIM ,  Joosung KIM ,  Eunsung LEE ,  Joohun HAN ,  Kiho KONG ,  Junghun PARK

IPC: H01L33/00 ,  H01L33/12 ,  H01L33/44

Abstract: Provided is a substrate structure including a substrate, a buffer layer disposed on the substrate, a porous semiconductor layer disposed on the buffer layer, the porous semiconductor layer having a plurality of voids, a plurality of semiconductor light emitting structures disposed on the porous semiconductor layer, the plurality of semiconductor light emitting structures having a nanorod shape extending vertically, and a passivation film disposed on a side wall of each of the plurality of semiconductor light emitting structures, the passivation film having an insulation property.

公开(公告)号：US20210325948A1

公开(公告)日：2021-10-21

申请号：US17250509

申请日：2019-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunsung LEE ,  Changhoon SHIN ,  Hakryoul KIM ,  Jinwan AN

IPC: G06F1/24 ,  G06F9/4401 ,  G06F8/61 ,  G06F3/06

Abstract: In electronic devices according to various embodiments, after a partition in which one or more applications are installed is reset by a factory data reset function, the one or more applications installed in the partition can be installed on the basis of a backup file. When the factory data reset function is not requested by a user who has purchased an electronic device, for example, when an inspector of the electronic device requests the factory data reset function or the factory data reset function is requested on the basis of the SIM card that was first inserted into the electronic device, the restoration of the one or more applications using the backup file can be performed by the electronic device.

公开(公告)号：US20160151044A1

公开(公告)日：2016-06-02

申请号：US14886641

申请日：2015-10-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngil KIM ,  Jong Keun SONG ,  Eunsung LEE ,  Kyungil CHO ,  Minseog CHOI

IPC: A61B8/00

CPC classification number: A61B8/4455 ,  A61B8/429

Abstract: A ultrasonic probe including: a case including: an opening; and a coupling portion; and a probe lens comprising: a first portion being exposed through the opening and a second portion coupled to the coupling portion of the case, wherein one of the coupling portion of the case and the second portion of the probe lens comprises a groove, and other one of the coupling portion of the case and the second portion of the probe lens comprises a shape matching the groove to couple the case and the probe lens to each other.

Abstract translation: 一种超声波探头，包括：壳体，包括：开口; 和耦合部分; 以及探针透镜，包括：第一部分，其通过所述开口暴露;第二部分，其耦合到所述壳体的所述耦合部分，其中所述壳体的所述耦合部分和所述探针透镜的所述第二部分中的一个包括凹槽， 壳体的耦合部分和探针透镜的第二部分之一包括与槽相匹配的形状以将壳体和探针透镜彼此耦合。

公开(公告)号：US20150374336A1

公开(公告)日：2015-12-31

申请号：US14732894

申请日：2015-06-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunsung LEE ,  Youngil KIM ,  Jong Keun SONG ,  Minseog CHOI

IPC: A61B8/00

CPC classification number: A61B8/4494 ,  A61B8/0891 ,  A61B8/14 ,  A61B8/4444 ,  B06B1/02 ,  B06B2201/76 ,  G01S7/5208 ,  G01S15/8915

Abstract: Disclosed herein is an ultrasound probe including a transducer array configured to generate ultrasonic waves, an integrated circuit disposed on a back surface of the transducer array by using an adhesive member, a printed circuit board connected to the integrated circuit and configured to output a signal to the integrated circuit, and a pad bridge disposed on front surfaces of the printed circuit board and the integrated circuit by using the adhesive member and configured to electrically connect the printed circuit board with the integrated circuit. An area of a region of the ultrasound probe contacting the human body may be reduced without reducing the size of the transducer array, and the integrated circuit and the printed circuit board may be integrally connected by using the adhesive member.

Abstract translation: 本文公开了一种超声波探头，其包括构造成产生超声波的换能器阵列，通过使用粘合构件设置在换能器阵列的后表面上的集成电路，连接到集成电路的印刷电路板，并且被配置为输出信号 所述集成电路以及通过使用所述粘合构件设置在所述印刷电路板和所述集成电路的前表面上并被配置为将所述印刷电路板与所述集成电路电连接的衬垫桥。 可以在不减小换能器阵列的尺寸的情况下减少与人体接触的超声波探头的区域的区域，并且可以通过使用粘合构件将集成电路和印刷电路板一体地连接。

公开(公告)号：US20240419215A1

公开(公告)日：2024-12-19

申请号：US18659802

申请日：2024-05-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunsung LEE ,  Kiho KONG ,  Junhee CHOI ,  Nakhyun KIM

IPC: G06F1/16 ,  H01L25/16 ,  H01L33/14 ,  H01L33/50

Abstract: Provided are a display apparatus and a method of manufacturing the display apparatus. The display apparatus includes a pixel electrode configured to supply power to a subpixel; a common electrode; an organic transparent substrate; a driving layer provided on the organic transparent substrate and electrically connected to the pixel electrode, the driving layer including a driving device configured to control power on-off of the subpixel; and a light emitting unit provided on the driving layer and including an inorganic material, the light emitting unit including a first semiconductor layer, an active layer, and a second semiconductor layer.

公开(公告)号：US20230197693A1

公开(公告)日：2023-06-22

申请号：US17946763

申请日：2022-09-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kiho KONG ,  Junghun PARK ,  Eunsung LEE ,  Junhee CHOI

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/38 ,  H01L33/00 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/005 ,  H01L33/62 ,  H01L33/382 ,  H01L33/505 ,  H01L2933/0016 ,  H01L2933/0041 ,  H01L2933/0066

Abstract: A micro light-emitting device display apparatus and a method of manufacturing the same are provided. The micro light-emitting device display apparatus includes a display unit including an array of a plurality of micro light-emitting devices, a driving unit backplane, and a bonding structure formed on coupling surfaces, facing each other, of the display unit and the driving unit backplane, and electrically connecting the display unit to the driving unit backplane. The bonding structure includes a plurality of bonding pads on one of the coupling surfaces of the display unit and driving unit backplane, and a dot pad array formed on the other coupling surface in a two-dimensional array to cover the plurality of bonding pads and an area therebetween.

公开(公告)号：US20230145690A1

公开(公告)日：2023-05-11

申请号：US17953756

申请日：2022-09-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunsung LEE ,  Changhoon SHIN

IPC: G06F3/06

CPC classification number: G06F3/0619 ,  G06F3/0652 ,  G06F3/0679

Abstract: A method and a device are provided. The device includes a first memory, a second memory having a storage characteristic different from that of the first memory, and a processor operatively connected to at least one of the first memory and the second memory. The processor is configured to generate a logical storage area in a data area of the first memory, store designated data in the generated logical storage area, and enter a recovery mode to store the data stored in the logical storage area in the second memory, format the first memory, and move the data stored in the second memory to the data area of the first memory.

公开(公告)号：US20200049889A1

公开(公告)日：2020-02-13

申请号：US16660368

申请日：2019-10-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： KYUHWAN CHOI ,  Byong Min KANG ,  Dong Kyung NAM ,  Eunsung LEE ,  Jinho LEE ,  Yoonsun CHOI

IPC: G02B6/293 ,  H04N13/31 ,  H04N13/32 ,  H04N13/317 ,  G02F1/1335 ,  F21V8/00

Abstract: An optical layer may include a barrier. The barrier may include slits arranged in the barrier so that vertically neighboring slits from among the slits are connected to each other. The slits are configured to transmit light through the barrier.