公开(公告)号：US20240079285A1

公开(公告)日：2024-03-07

申请号：US18316682

申请日：2023-05-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongmin Kang ,  Jongbo Shim ,  Ji-Yong Park ,  Choongbin Yim ,  Sungeun Pyo

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00 ,  H01L25/10 ,  H10B80/00

CPC classification number: H01L23/3128 ,  H01L21/56 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H10B80/00 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a first substrate, a first semiconductor chip on the first substrate, a molding layer on the first substrate and the first semiconductor chip and has a plurality of recesses, a plurality of substrate connection terminals on the first substrate and in the plurality of recesses, and a second semiconductor chip on the plurality of substrate connection terminals. The plurality of recesses and the plurality of substrate connection terminals are horizontally spaced apart from the first semiconductor chip. The molding layer is spaced apart from the second semiconductor chip.

公开(公告)号：US11682633B2

公开(公告)日：2023-06-20

申请号：US17181617

申请日：2021-02-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Yong Park ,  Duckgyu Kim

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L23/3185 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/49838 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/18161 ,  H01L2924/351

Abstract: Disclosed is a semiconductor package including a base film that has a first surface and a second surface opposite to the first surface, a plurality of input/output lines on the first surface of the base film, a semiconductor chip disposed on the first surface of the base film and connected to the input/output lines and including a central portion and end portions on opposite sides of the central portion, and a heat radiation pattern on the second surface of the base film. The heat radiation pattern corresponds to the semiconductor chip and has a plurality of openings that correspond to the end portions of the semiconductor chip and that vertically overlap the end portions of the semiconductor chip.

公开(公告)号：US10776601B2

公开(公告)日：2020-09-15

申请号：US16027620

申请日：2018-07-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woonbae Kim ,  Jikho Song ,  Sungeun Jo ,  Ji-Yong Park ,  Jeong-Kyu Ha

IPC: G06K9/28 ,  G06K9/00 ,  G09G3/3208

Abstract: Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.

公开(公告)号：US10282587B2

公开(公告)日：2019-05-07

申请号：US15395623

申请日：2016-12-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inho Choi ,  Youngdoo Jung ,  Woonbae Kim ,  Jungwoo Kim ,  Ji-Yong Park ,  Kyoungsuk Yang ,  Jeong-Kyu Ha

IPC: G06K9/20 ,  G06K9/00

Abstract: A sensing module substrate and a sensing module including the same are provided. The sensing module substrate includes a film substrate having a first surface and a second surface; sensing vias which penetrate the film substrate from the first surface to the second surface, each of the sensing vias being configured to be coupled to pixels of a semiconductor chip; and an interconnection pattern provided on at least one of the first surface and the second surface of the film substrate.

公开(公告)号：US20130320309A1

公开(公告)日：2013-12-05

申请号：US13765121

申请日：2013-02-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sae-Young Kim ,  Ji-Yong Park ,  Sang-Chul Sul

IPC: H01L51/44

CPC classification number: H01L51/441 ,  H01L27/14603 ,  H01L27/14643 ,  H01L27/307 ,  Y02E10/549

Abstract: An organic image sensor includes a first organic photoelectric conversion pixel circuit on an active region of a substrate and a second organic photoelectric conversion pixel circuit on an optical black region of the substrate. The first organic photoelectric conversion pixel circuit includes a first organic photoelectric conversion element configured to generate charges responding to incident light and a first readout circuit configured to receive a first input signal including the charges generated in the first organic photoelectric conversion element. The second organic photoelectric conversion pixel circuit includes a second organic photoelectric conversion element and a second readout circuit configured to receive a second input signal generated irrespective of the incident light.

Abstract translation: 有机图像传感器包括在基板的有源区域上的第一有机光电转换像素电路和在该基板的光学黑色区域上的第二有机光电转换像素电路。 第一有机光电转换像素电路包括：第一有机光电转换元件，被配置为产生响应于入射光的电荷;以及第一读出电路，被配置为接收包括在第一有机光电转换元件中产生的电荷的第一输入信号。 第二有机光电转换像素电路包括第二有机光电转换元件和第二读出电路，其被配置为接收与入射光无关地产生的第二输入信号。