公开(公告)号：US11277915B2

公开(公告)日：2022-03-15

申请号：US16384257

申请日：2019-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minki Kim ,  Chulwoo Park ,  Dongil Son

IPC: H05K1/14 ,  H01Q1/08 ,  H01Q1/24 ,  H01Q1/22 ,  H05K1/02

Abstract: An antenna device and an electronic device including the same are provided. The antenna device includes a housing that includes a first plate, a second plate facing a direction opposite to the first plate, and a side member surrounding a space between the first plate and the second plate, a display viewable through at least a portion of the first plate, an antenna assembly disposed within the housing wherein the antenna assembly includes a first printed circuit board, a second printed circuit board, at least one structure interconnecting the first printed circuit board and the second printed circuit board and including conductive paths, a plurality of conductive patterns, and a wireless communication circuit, a flexible printed circuit board, and a third printed circuit board.

公开(公告)号：US11923709B2

公开(公告)日：2024-03-05

申请号：US17551793

申请日：2021-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungtae Park ,  Minki Kim ,  Kicheol Bae ,  Yongjae Song ,  Hyelim Yun ,  Woosung Jang

IPC: H05K1/11 ,  H01Q7/00 ,  H02J7/00 ,  H02J50/10 ,  H05K1/14 ,  H05K1/18 ,  H05K5/00

CPC classification number: H02J7/0042 ,  H01Q7/00 ,  H02J50/10 ,  H05K1/11 ,  H05K1/144 ,  H05K1/181 ,  H05K5/0086 ,  H05K2201/10734

Abstract: An electronic device is provided. The electronic device includes a first circuit board, an antenna member disposed to face one surface of the first circuit board, an electronic module disposed between the first circuit board and the antenna member and including a plurality of contact protrusions disposed to face the antenna member, and a plurality of contact members disposed on the antenna member and configured to electrically contact one of the plurality of contact protrusions. As the antenna member generates an induced current in reaction to an external electrical signal or an external electromagnetic field, the electronic module may be configured to supply power using the induced current generated by the antenna member.

公开(公告)号：US20230163089A1

公开(公告)日：2023-05-25

申请号：US17934298

申请日：2022-09-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minki Kim ,  Seungduk Baek

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/48

CPC classification number: H01L24/08 ,  H01L25/0657 ,  H01L24/05 ,  H01L24/06 ,  H01L25/0652 ,  H01L23/481 ,  H01L2924/1434 ,  H01L2924/1431 ,  H01L2224/08145 ,  H01L2224/08121 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05009 ,  H01L2224/05018 ,  H01L2224/05073 ,  H01L2224/05541 ,  H01L2224/05558 ,  H01L2224/05576 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/05017 ,  H01L2224/05557 ,  H01L2224/08225 ,  H01L2225/06527 ,  H01L2225/06544

Abstract: A semiconductor package may include a first semiconductor chip and a second semiconductor chip on a top surface thereof. The first semiconductor chip may include a first bonding pad on a top surface of a first semiconductor substrate and a first penetration via on a bottom surface of the first bonding pad and penetrating the first semiconductor substrate. The second semiconductor chip may include a second interconnection pattern on a bottom surface of a second semiconductor substrate and a second bonding pad on a bottom surface of the second interconnection pattern and coupled to the second interconnection pattern. The second bonding pad may be directly bonded to the first bonding pad. A width of the first penetration via may be smaller than that of the first bonding pad, and a width of the second interconnection pattern may be larger than that of the second bonding pad.

公开(公告)号：US11425456B2

公开(公告)日：2022-08-23

申请号：US16778161

申请日：2020-01-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinbong Ryu ,  Minki Kim ,  Jimin Kim ,  Hyungsuk Kim ,  Hyuntaek Lee ,  Donghyun Yeom

IPC: H04N5/765 ,  H04N21/4402 ,  H04N21/435 ,  H04N9/64 ,  H04N9/87

Abstract: An electronic device is provided. The electronic device includes communication circuitry configured to communicate with an external electronic device, a processor operatively connected with the communication circuitry, and a memory operatively connected with the processor. The memory may store instructions which, when executed, cause the processor to control the electronic device to: obtain environment information associated with a video playback environment of the external electronic device, decode a high dynamic range (HDR) video, perform color conversion of the decoded HDR video based on the environment information, encode the color-converted video into a standard dynamic range (SDR) format, and transmit the encoded video to the external electronic device via the communication circuitry.

公开(公告)号：US11309645B2

公开(公告)日：2022-04-19

申请号：US17061461

申请日：2020-10-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minki Kim ,  Byunghoon Lee ,  Min Park ,  Sungtae Park ,  Jungmin Park ,  Yongjae Song ,  Hongshin Shin ,  Woosung Jang ,  Chulwoo Park ,  Chihyun Cho

IPC: H05K5/00 ,  H01R12/62 ,  H05K1/14

Abstract: An electronic device includes a housing; a first circuit board, and a flexible circuit board. The first circuit board is disposed in an internal space of the housing and includes a plurality of first conductive terminals. The flexible circuit board includes a first connection portion including a plurality of second conductive terminals configured to connect to the plurality of first conductive terminals. The flexible circuit board also includes a connection portion extended from the first connection portion, and at least one conductive layer extended from the connection portion to at least a portion of the first connection portion. Additionally, the flexible circuit board includes at least one transmissive area in which light may be transmitted and the at least one conductive layer is at least partially omitted. At least some of the plurality of second conductive terminals are visible from the outside through the at least one transmissive area.