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1.发明公开公开(公告)号：US20240319593A1
公开(公告)日：2024-09-26
申请号：US18381335
申请日：2023-10-18
发明人： Yool Kang , Taehui Kwon , Dongjun Kim , Ahram Suh , Miyeon Jung , Samjong Choi , Ohhwan Kweon , Minki Kim , Jaehyun Kim , Sunggun Shin , Seungryul Yoo , Heekyung Lee
CPC分类号： G03F7/0048 , G03F7/2004
摘要： Provided are a thinner composition, which may be generally used for an extreme ultraviolet (EUV) photoresist as well as KrF and ArF photoresists and exhibits improved performance in reduced resist coating (RRC) and edge bead removal (EBR), and which has an excellent pipe cleaning capability, and a method of treating a substrate surface by using the thinner composition. The thinner composition includes a C2-C4 alkylene glycol C1-C4 alkyl ether acetate, a C2-C3 alkylene glycol C1-C4 alkyl ether, and a cycloketone.
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公开(公告)号：US20240071995A1
公开(公告)日：2024-02-29
申请号：US18212461
申请日：2023-06-21
发明人： Raeyoung Kang , Minki Kim , Hyuekjae Lee
IPC分类号： H01L25/065 , H01L23/00 , H01L23/498 , H01L23/522 , H01L23/538
CPC分类号： H01L25/0652 , H01L23/49827 , H01L23/5226 , H01L23/5384 , H01L24/05 , H01L24/08 , H01L24/09 , H01L24/16 , H01L24/20 , H01L24/24 , H01L24/73 , H01L2224/05147 , H01L2224/08113 , H01L2224/08148 , H01L2224/0903 , H01L2224/09051 , H01L2224/16227 , H01L2224/16238 , H01L2224/215 , H01L2224/24147 , H01L2224/24227 , H01L2224/73209 , H01L2924/1431 , H01L2924/1436 , H01L2924/1437 , H01L2924/1441
摘要： A semiconductor package includes a first semiconductor chip including a first semiconductor layer, a first through-electrode passing through the first semiconductor layer in a vertical direction, and a first bonding pad connected to the first through-electrode, and a second semiconductor chip including a second semiconductor layer on the first semiconductor chip, a wiring structure between the second semiconductor layer and the first semiconductor chip, a wiring pad connected to the wiring structure below the wiring structure, and a second bonding pad connected to the wiring pad below the wiring pad and in contact with the first bonding pad, wherein the second bonding pad includes a protrusion protruding toward the wiring pad.
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公开(公告)号：US11895286B2
公开(公告)日：2024-02-06
申请号：US17550270
申请日：2021-12-14
发明人： Kwangmin Byeon , Seungbum Lee , Seungseok Hong , Minki Kim , Hyunsoo Kim , Donghyun Yeom
IPC分类号： H04N13/167 , H04N13/383 , H04N13/293
CPC分类号： H04N13/167 , H04N13/293 , H04N13/383
摘要： Various embodiments of the present disclosure provide an electronic device comprising: a communication module comprising communication circuitry, a memory, and a processor operatively connected to the communication module and the memory, wherein the processor is configured to: control the electronic device to establish a connection to a wearable display device through the communication module, receive gaze information from the wearable display device, determine a first application and a second application corresponding to the gaze information to be displayed on a screen, identify profiles of the determined first application and second application, and combine graphic data corresponding to the first application and graphic data corresponding to the second application and transmit the combined graphic data to the wearable display device, or transmit each of graphic data corresponding to the first application and graphic data corresponding to the second application to the wearable display device, based on the identified profiles.
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公开(公告)号：US20240030074A1
公开(公告)日：2024-01-25
申请号：US18320046
申请日：2023-05-18
发明人： Minki Kim , Seungduk Baek , Hyuekjae Lee
IPC分类号： H01L21/66 , H01L23/00 , H01L25/065
CPC分类号： H01L22/32 , H01L24/06 , H01L24/80 , H01L25/0657 , H01L2224/0603 , H01L2225/06596 , H01L2224/80345
摘要： A semiconductor device includes a base structure comprising a first bonding pad and a first test pad, and a semiconductor chip comprising a second bonding pad being in contact with the first bonding pad of the base structure and a second test pad being in contact with the first test pad of the base structure. A width of the second bonding pad of the semiconductor chip is less than a width of the second test pad of the semiconductor chip. An air gap is provided between the first test pad of the base structure and the second test pad of the semiconductor chip.
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公开(公告)号：US20230163087A1
公开(公告)日：2023-05-25
申请号：US17944430
申请日：2022-09-14
发明人： Minki Kim , Seungduk Baek , Won IL Lee
IPC分类号： H01L23/00 , H01L25/065
CPC分类号： H01L24/05 , H01L25/0657 , H01L24/08 , H01L2225/06527 , H01L2225/06544 , H01L2224/08145 , H01L2924/3512 , H01L2224/05541 , H01L2224/05551 , H01L2224/05557 , H01L2224/05558 , H01L2224/05576 , H01L2224/05647 , H01L2224/05687 , H01L2224/05009 , H01L2224/05011 , H01L2224/05017 , H01L2224/05018 , H01L2224/05025 , H01L2224/05076 , H01L2224/05083 , H01L2224/05166 , H01L2224/05181 , H01L2224/05187 , H01L2224/0239 , H01L2224/02331 , H01L2224/02381 , H01L2924/1434 , H01L2924/1431
摘要： A semiconductor package includes: a semiconductor substrate; a through electrode that penetrates the semiconductor substrate; a first pad disposed on the through electrode; and a dielectric structure disposed on the semiconductor substrate, wherein a lower portion of the dielectric structure at least partially surrounds the through electrode, wherein an upper portion of the dielectric structure at least partially surrounds the first pad, wherein the dielectric structure includes: a first dielectric pattern; an etch stop pattern disposed on the first dielectric pattern; and a second dielectric pattern spaced apart from the first dielectric pattern by the etch stop pattern, wherein the first pad is in contact with the through electrode, the first dielectric pattern, the etch stop pattern, and second dielectric pattern, and wherein a top surface of the through electrode is at a level higher than a level of a top surface of the first dielectric pattern.
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公开(公告)号：US20230113465A1
公开(公告)日：2023-04-13
申请号：US17854659
申请日：2022-06-30
发明人： Minki Kim , Seungduk Baek , Soojeoung Park , Hyuekjae Lee
IPC分类号： H01L23/48 , H01L25/065 , H01L23/00
摘要： A semiconductor package includes a first semiconductor chip including a first semiconductor layer, a first through-electrode that penetrates through the first semiconductor layer, a first bonding pad connected to the first through-electrode, and a first insulating bonding layer, and a second semiconductor chip on the first semiconductor chip and including a second semiconductor layer, a second bonding pad bonded to the first bonding pad, and a second insulating bonding layer bonded to the first insulating bonding layer, wherein the first insulating bonding layer includes a first insulating material, the second insulating bonding layer includes a first insulating layer that forms a bonding interface with the first insulating bonding layer and a second insulating layer on the first insulating layer, the first insulating layer includes a second insulating material, different from the first insulating material, and the second insulating layer includes a third insulating material, different from the second insulating material.
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公开(公告)号：US11600556B2
公开(公告)日：2023-03-07
申请号：US17230662
申请日：2021-04-14
发明人： Minki Kim , Duckgyu Kim , Jae-Min Jung , Jeong-Kyu Ha , Sang-Uk Han
IPC分类号： H01L23/495 , H01L23/31 , H01L23/00 , H01L23/367
摘要： Disclosed is a semiconductor package comprising a semiconductor chip, a first chip pad on a bottom surface of the semiconductor chip and adjacent to a first lateral surface in a first direction of the semiconductor chip, the first lateral surface separated from the first chip pad from a plan view in a first direction, and a first lead frame coupled to the first chip pad. The first lead frame includes a first segment on a bottom surface of the first chip pad and extending from the first chip pad in a second direction opposite to the first direction and away from the first lateral surface of the semiconductor chip, and a second segment which connects to a first end of the first segment and then extends along the first direction to extend beyond the first lateral surface of the semiconductor chip after passing one side of the first chip pad, when viewed in the plan view.
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公开(公告)号：US11341882B2
公开(公告)日：2022-05-24
申请号：US15929550
申请日：2020-05-08
发明人： Jinbong Ryu , Minki Kim , Hyemin Kim , Hwanyeol Kim , Hyungjun Ahn , Sanghun Lee
IPC分类号： G09G3/20
摘要： An electronic device including at least one memory; a first display; a communication circuit; and at least one processor. The at least one processor is configured to while displaying multimedia content on the first display, receive capability data of an external electronic device for indicating that change of a posture of a second display of the external electronic device is available. The at least one processor is also configured to determine a posture of the second display corresponding to a display direction of the multimedia content. The at least one processor is further configured to transmit posture control information for indicating the determined posture to the external electronic device. Additionally, the at least one processor is configured to transmit streaming data of the multimedia content displayed on the first display to the external electronic device in order to display the multimedia content on the second display.
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公开(公告)号：US11200018B2
公开(公告)日：2021-12-14
申请号：US16282697
申请日：2019-02-22
发明人： Hyunkyoung Kim , Hongjin Park , Byungsung Kang , Kwanguk Kim , Minki Kim , Bongkyu Kim , Jinbong Ryu , Jongmoon Park , Jihwa Park , Junui Seo , Sanghun Lee
IPC分类号： G06F3/14 , G06F3/0481 , G06F21/44 , H04L29/06 , H04W12/069
摘要： An electronic device is disclosed. An electronic device comprises a display, a communication circuit configured to communicate with a first peripheral device, a memory configured to store first authentication information associated with the first peripheral device, and a processor, wherein the processor is configured to control the electronic device to: broadcast a first message via the communication circuit, receive a connection request message from the first peripheral device receiving the first message, authenticate the first peripheral device based on the first authentication information associated with the first peripheral device in response to the reception of the connection request message, and transmit screen data being displayed on the display to the first peripheral device via the communication circuit based on the authentication being valid.
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公开(公告)号：US11277915B2
公开(公告)日：2022-03-15
申请号：US16384257
申请日：2019-04-15
发明人： Minki Kim , Chulwoo Park , Dongil Son
摘要： An antenna device and an electronic device including the same are provided. The antenna device includes a housing that includes a first plate, a second plate facing a direction opposite to the first plate, and a side member surrounding a space between the first plate and the second plate, a display viewable through at least a portion of the first plate, an antenna assembly disposed within the housing wherein the antenna assembly includes a first printed circuit board, a second printed circuit board, at least one structure interconnecting the first printed circuit board and the second printed circuit board and including conductive paths, a plurality of conductive patterns, and a wireless communication circuit, a flexible printed circuit board, and a third printed circuit board.
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