公开(公告)号：US11653396B2

公开(公告)日：2023-05-16

申请号：US17497580

申请日：2021-10-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongyeob Oak ,  Sejin Park ,  Jisoo Song ,  Wonil Lee

IPC: H04W76/10 ,  H04L67/10 ,  H04W72/04 ,  H04W80/02

CPC classification number: H04W76/10 ,  H04L67/10 ,  H04W72/04 ,  H04W80/02

Abstract: The present disclosure relates to a research that has been conducted with the support of the “Cross-Departmental Giga KOREA Project” funded by the government (the Ministry of Science and ICT) in 2017 (No. GK17N0100, millimeter wave 5G mobile communication system development). The present disclosure relates to a communication technique for convergence of a 5G communication system for supporting a higher data transmission rate beyond a 4G system with an IoT technology, and a system therefor. The present disclosure may be applied to an intelligent service (for example, smart home, smart building, smart city, smart car or connected car, health care, digital education, retail business, security and safety-related service, etc.) on the basis of a 5G communication technology and an IoT-related technology.

公开(公告)号：US20230119548A1

公开(公告)日：2023-04-20

申请号：US17873990

申请日：2022-07-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyoeun Kim ,  Juhyeon Kim ,  Wonil Lee ,  Youngkun Jee

IPC: H01L23/00 ,  H01L25/065

Abstract: A semiconductor package includes a first semiconductor chip including a first substrate and a first bonding layer disposed on the first substrate, and having a flat first outer surface provided by the first bonding layer; and a second semiconductor chip disposed on the first outer surface of the first semiconductor chip, including a second substrate and a second bonding layer disposed on the second substrate, and having a flat second outer surface provided by the second bonding layer and contacting the first outer surface of the first semiconductor chip. The first bonding layer includes a first outermost insulating layer providing the first outer surface, a first internal insulating layer stacked between the first outermost insulating layer and the first substrate, first external marks disposed in the first outermost insulating layer and spaced apart from each other, and first internal marks interlaced with the first external marks within the first internal insulating layer.

公开(公告)号：US11244894B2

公开(公告)日：2022-02-08

申请号：US16809116

申请日：2020-03-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghoon Yeon ,  Wonil Lee ,  Yonghoe Cho

IPC: H01L29/00 ,  H01L23/522 ,  H01L23/498 ,  H01L23/48 ,  H01L23/00

Abstract: A semiconductor package includes a semiconductor device having a through silicon via, a lower redistribution structure on the semiconductor device, the lower redistribution structure including a lower redistribution insulating layer and a lower redistribution pattern electrically connected to the through silicon via, a package connection terminal on the lower redistribution structure and electrically connected to the lower redistribution pattern, an upper redistribution structure on the semiconductor device and including an upper redistribution insulating layer and an upper redistribution pattern electrically connected to the through silicon via, a conductive via in contact with the upper redistribution pattern and on the upper redistribution insulating layer, a connection pad on the conductive via, and a passive element pattern on the upper redistribution structure and electrically connected to the conductive via.

公开(公告)号：US11166193B2

公开(公告)日：2021-11-02

申请号：US16632052

申请日：2018-07-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehwan Jeon ,  Sejin Park ,  Wonil Lee

IPC: H04W28/04 ,  H04L1/16 ,  H04W56/00

Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). The communication method of a base station in a wireless communication system, according to one embodiment of the disclosure, can comprise the steps of: setting a transmission period of a poll bit for indicating the transmission of information on whether a packet has been successfully received; generating a packet including the poll bit set on the basis of the transmission period; and transmitting the generated packet to a terminal.

公开(公告)号：US11147107B2

公开(公告)日：2021-10-12

申请号：US16611346

申请日：2017-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongyeob Oak ,  Sejin Park ,  Jisoo Song ,  Wonil Lee

IPC: H04W76/10 ,  H04L29/08 ,  H04W72/04 ,  H04W80/02

Abstract: The present disclosure relates to a research that has been conducted with the support of the “Cross-Depaitmental Giga KOREA Project” funded by the government (the Ministry of Science and ICT) in 2017 (No. GK17N0100, millimeter wave 5G mobile communication system development). The present disclosure relates to a communication technique for convergence of a 5G communication system for supporting a higher data transmission rate beyond a 4G system with an IoT technology, and a system therefor. The present disclosure may be applied to an intelligent service (for example, smart home, smart building, smart city, smart car or connected car, health care, digital education, retail business, security and safety-related service, etc.) on the basis of a 5G communication technology and an IoT-related technology.

公开(公告)号：US10306526B2

公开(公告)日：2019-05-28

申请号：US15593829

申请日：2017-05-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongyeob Oak ,  Jisoo Song ,  Wonil Lee

IPC: H04W36/08 ,  H04W84/04 ,  H04W74/08 ,  H04W4/70

Abstract: A method and apparatus is provided that controls the handover between distributed units (DUs) (inter-DU handover) in an eNB including a central unit (CU) and a distributed unit (DU). The method and system fuses 5G communication systems with IoT technology to transmission data at a high rate after 4G systems. The communication method and system is applied to intelligent services, based on 5G communication technology and IoT related technology, for example, smart homes, smart buildings, smart cities, smart cars or connected cars, health care, digital education, retail business, security, safety-related services, etc. The method of performing communication in a communication node of a mobile communication system includes: transmitting, to a source node, a first message instructing handover; receiving, from the source node, a second message including information related to a PDU transmitted to a terminal; receiving, from a target node, a third message related to the reception of a random access preamble of the terminal; and transmitting, to the target node, downlink data, based on the second message, in response to the third message.

公开(公告)号：US20240404955A1

公开(公告)日：2024-12-05

申请号：US18800320

申请日：2024-08-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunkyoung SEO ,  Taehwan Kim ,  Hyunjung Song ,  Hyoeun Kim ,  Wonil Lee ,  Sanguk Han

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/367

Abstract: A semiconductor package includes a redistribution structure, a lower semiconductor device arranged on the redistribution structure and including first through electrodes each having a first horizontal width, a connecting substrate arranged on the redistribution structure and spaced apart from the lower semiconductor device in a horizontal direction and including second through electrodes each having a second horizontal width greater than the first horizontal width, a first molding layer arranged on the redistribution structure and surrounding a side surface of the lower semiconductor device and a side surface of the connecting substrate, and an upper semiconductor device arranged on the lower semiconductor device and the connecting substrate, the upper semiconductor device electrically connected to the first and second through electrodes. A plane area of the upper semiconductor device is greater than a plane area of the lower semiconductor device, and the first horizontal width is about 1 μm to about 7 μm and the second horizontal width is about 10 μm to about 20 μm.

公开(公告)号：US20240274553A1

公开(公告)日：2024-08-15

申请号：US18643474

申请日：2024-04-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yukyung Park ,  Ungcheon Kim ,  Wonil Lee

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01L23/544 ,  H01L25/10 ,  H01L25/18

CPC classification number: H01L24/02 ,  H01L21/486 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L25/105 ,  H01L25/18 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/04 ,  H01L2223/54426 ,  H01L2224/0213 ,  H01L2224/02141 ,  H01L2224/02145 ,  H01L2224/0215 ,  H01L2224/03019 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05019 ,  H01L2224/05025 ,  H01L2224/05082 ,  H01L2224/0603 ,  H01L2224/06182

Abstract: An interposer according to an embodiment of the present invention includes a base layer having opposite first and second surfaces, a wiring structure on the first surface of the base layer, an interposer protective layer disposed on the second surface of the base layer and having a pad recess with a lower surface of the interposer protective layer positioned at a first vertical level and a bottom surface of the pad recess positioned at a second vertical level that is higher than the first vertical level, an interposer pad of which a portion fills the pad recess of the interposer protective layer and the remaining portion protrudes from the interposer protective layer, and an interposer through electrode extending through the base layer and the interposer protective layer to the interposer pad, the interposer through electrode electrically connecting the wiring structure to the interposer pad.

公开(公告)号：US12058744B2

公开(公告)日：2024-08-06

申请号：US18316751

申请日：2023-05-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongyeob Oak ,  Sejin Park ,  Jisoo Song ,  Wonil Lee

IPC: H04W76/10 ,  H04L67/10 ,  H04W72/04 ,  H04W80/02

CPC classification number: H04W76/10 ,  H04L67/10 ,  H04W72/04 ,  H04W80/02

Abstract: The present disclosure relates to a research that has been conducted with the support of the “Cross-Departmental Giga KOREA Project” funded by the government (the Ministry of Science and ICT) in 2017 (No. GK17N0100, millimeter wave 5G mobile communication system development). The present disclosure relates to a communication technique for convergence of a 5G communication system for supporting a higher data transmission rate beyond a 4G system with an IoT technology, and a system therefor. The present disclosure may be applied to an intelligent service (for example, smart home, smart building, smart city, smart car or connected car, health care, digital education, retail business, security and safety-related service, etc.) on the basis of a 5G communication technology and an IoT-related technology.

公开(公告)号：US20220302053A1

公开(公告)日：2022-09-22

申请号：US17528954

申请日：2021-11-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yukyung Park ,  Ungcheon Kim ,  Wonil Lee

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/544 ,  H01L25/10 ,  H01L25/18 ,  H01L21/48

Abstract: An interposer according to an embodiment of the present invention includes a base layer having opposite first and second surfaces, a wiring structure on the first surface of the base layer, an interposer protective layer disposed on the second surface of the base layer and having a pad recess with a lower surface of the interposer protective layer positioned at a first vertical level and a bottom surface of the pad recess positioned at a second vertical level that is higher than the first vertical level, an interposer pad of which a portion fills the pad recess of the interposer protective layer and the remaining portion protrudes from the interposer protective layer, and an interposer through electrode extending through the base layer and the interposer protective layer to the interposer pad, the interposer through electrode electrically connecting the wiring structure to the interposer pad.