公开(公告)号：US09997561B2

公开(公告)日：2018-06-12

申请号：US15413079

申请日：2017-01-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nam Goo Cha ,  Yong Il Kim ,  Young Soo Park

IPC: H01L33/00 ,  H01L27/15 ,  H01L25/065 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L33/44 ,  H01L25/075

CPC classification number: H01L27/156 ,  H01L25/0655 ,  H01L25/0753 ,  H01L33/0012 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/44 ,  H01L33/50 ,  H01L33/507 ,  H01L33/52 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066

Abstract: In some examples, a semiconductor device may comprise a semiconductor chip including a plurality of pixels, each pixel formed of a plurality of sub-pixels, such as a red sub-pixel, green sub-pixel and blue sub-pixel. Each sub-pixel may comprise a light emitting diode. A first signal line may connect to signal terminals of a first group sub-pixels (e.g., arranged in the same row), and a second signal line may connect to common terminals of a second group of sub-pixels (e.g., arranged in the same column). The number of chip pads may thus be reduced to provide increased design flexibility in location and/or allowing an increase in chip pad size. In some examples, a light transmissive material may be formed in openings of a semiconductor growth substrate on which light emitting cells of the sub-pixels were grown. The light transmissive material of some of the sub-pixels may comprise a wavelength conversion material and/or filter. Exemplary display panels and methods of manufacturing semiconductor devices and display panels are also disclosed.