Integrated circuits
    11.
    发明授权
    Integrated circuits 有权
    集成电路

    公开(公告)号:US07687857B2

    公开(公告)日:2010-03-30

    申请号:US11957013

    申请日:2007-12-14

    IPC分类号: H01L29/786

    摘要: Integrated circuits and methods of forming field effect transistors are disclosed. In one aspect, an integrated circuit includes a semiconductor substrate comprising bulk semiconductive material. Electrically insulative material is received within the bulk semiconductive material. Semiconductor material is formed on the insulative material. A field effect transistor is included and comprises a gate, a channel region, and a pair of source/drain regions. In one implementation, one of the source/drain regions is formed in the semiconductor material, and the other of the source/drain regions is formed in the bulk semiconductive material. In one implementation, the electrically insulative material extends from beneath one of the source/drain regions to beneath only a portion of the channel region. Other aspects and implementations, including methodical aspects, are disclosed.

    摘要翻译: 公开了形成场效应晶体管的集成电路和方法。 在一个方面,集成电路包括包括本体半导体材料的半导体衬底。 电绝缘材料容纳在本体半导体材料内。 在绝缘材料上形成半导体材料。 包括场效应晶体管,并包括栅极,沟道区和一对源极/漏极区。 在一个实施方案中,源/漏区中的一个形成在半导体材料中,并且源/漏区中的另一个在体半导体材料中形成。 在一个实施方案中,电绝缘材料从源极/漏极区域之一延伸到仅沟道区域的仅一部分的下方。 公开了其他方面和实施方式,包括方法方面。

    System and method for fabricating a fin field effect transistor
    12.
    发明申请
    System and method for fabricating a fin field effect transistor 有权
    用于制造鳍式场效应晶体管的系统和方法

    公开(公告)号:US20080050885A1

    公开(公告)日:2008-02-28

    申请号:US11508047

    申请日:2006-08-22

    IPC分类号: H01L21/76

    摘要: There is provided a system and method for fabricating a fin field effect transistor. More specifically, in one embodiment, there is provided a method comprising depositing a layer of nitride on a substrate, applying a photolithographic mask on the layer of nitride to define a location of a wall, etching the layer of nitride to create the wall, removing the photolithographic mask, depositing a spacer layer adjacent to the wall, etching the spacer layer to create a spacer adjacent to the wall, wherein the spacer and the wall cover a first portion of the substrate, and etching a second portion of the substrate not covered by the spacer to create a trench.

    摘要翻译: 提供了制造鳍式场效应晶体管的系统和方法。 更具体地,在一个实施例中,提供了一种方法,包括在衬底上沉积氮化物层,在氮化层上施加光刻掩模以限定壁的位置,蚀刻氮化物层以产生壁,去除 光刻掩模,在壁附近沉积间隔层,蚀刻间隔层以产生邻近壁的隔离物,其中间隔物和壁覆盖基底的第一部分,并蚀刻未被覆盖的基底的第二部分 通过间隔件形成沟槽。

    Methods of fabricating fin structures
    13.
    发明授权
    Methods of fabricating fin structures 有权
    翅片结构的制作方法

    公开(公告)号:US08748280B2

    公开(公告)日:2014-06-10

    申请号:US13324520

    申请日:2011-12-13

    IPC分类号: H01L21/336

    摘要: There is provided fin methods for fabricating fin structures. More specifically, fin structures are formed in a substrate. The fin structures may include two fins separated by a channel, wherein the fins may be employed as fins of a field effect transistor. The fin structures are formed below the upper surface of the substrate, and may be formed without utilizing a photolithographic mask to etch the fins.

    摘要翻译: 提供了用于制造翅片结构的翅片方法。 更具体地,翅片结构形成在基板中。 翅片结构可以包括由通道分开的两个翅片,其中翅片可以用作场效应晶体管的翅片。 翅片结构形成在衬底的上表面下方,并且可以在不利用光刻掩模来形成以蚀刻鳍片的情况下形成。

    METHODS OF FABRICATING FIN STRUCTURES
    14.
    发明申请
    METHODS OF FABRICATING FIN STRUCTURES 有权
    烧结结构的方法

    公开(公告)号:US20120088349A1

    公开(公告)日:2012-04-12

    申请号:US13324520

    申请日:2011-12-13

    IPC分类号: H01L21/762 H01L21/28

    摘要: There is provided fin methods for fabricating fin structures. More specifically, fin structures are formed in a substrate. The fin structures may include two fins separated by a channel, wherein the fins may be employed as fins of a field effect transistor. The fin structures are formed below the upper surface of the substrate, and may be formed without utilizing a photolithographic mask to etch the fins.

    摘要翻译: 提供了用于制造翅片结构的翅片方法。 更具体地,翅片结构形成在基板中。 翅片结构可以包括由通道分开的两个翅片,其中翅片可以用作场效应晶体管的翅片。 翅片结构形成在衬底的上表面下方,并且可以在不利用光刻掩模来形成以蚀刻鳍片的情况下形成。

    Methods of Making a Semiconductor Memory Device
    15.
    发明申请
    Methods of Making a Semiconductor Memory Device 有权
    制造半导体存储器件的方法

    公开(公告)号:US20110171802A1

    公开(公告)日:2011-07-14

    申请号:US13071979

    申请日:2011-03-25

    IPC分类号: H01L21/336

    摘要: One-transistor (1T) capacitor-less DRAM cells each include a MOS transistor having a bias gate layer that separates a floating body region from a base substrate. The MOS transistor functions as a storage device, eliminating the need of the storage capacitor. Logic “1” is written to and stored in the storage device by causing majority carriers (holes in an NMOS transistor) to accumulate and be held in the floating body region next to the bias gate layer, and is erased by removing the majority carriers from where they are held.

    摘要翻译: 单晶体管(1T)无电容器DRAM单元各自包括具有将浮体区域与基底基板分离的偏置栅极层的MOS晶体管。 MOS晶体管用作存储器件,不需要存储电容器。 通过使多数载波(NMOS晶体管中的空穴)累积并保持在偏置栅极层旁边的浮动体区域中,将逻辑“1”写入并存储在存储装置中,并且通过从多个载流子 他们在哪里举行。

    SOURCE/DRAIN ZONES WITH A DELECTRIC PLUG OVER AN ISOLATION REGION BETWEEN ACTIVE REGIONS AND METHODS
    19.
    发明申请
    SOURCE/DRAIN ZONES WITH A DELECTRIC PLUG OVER AN ISOLATION REGION BETWEEN ACTIVE REGIONS AND METHODS 有权
    具有活动区域和方法之间的隔离区域的电压插入源/漏区

    公开(公告)号:US20130168756A1

    公开(公告)日:2013-07-04

    申请号:US13343087

    申请日:2012-01-04

    IPC分类号: H01L29/792 H01L21/336

    摘要: Devices, memory arrays, and methods are disclosed. In an embodiment, one such device has a source/drain zone that has first and second active regions, and an isolation region and a dielectric plug between the first and second active regions. The dielectric plug may extend below upper surfaces of the first and second active regions and may be formed of a dielectric material having a lower removal rate than a dielectric material of the isolation region for a particular isotropic removal chemistry.

    摘要翻译: 公开了设备,存储器阵列和方法。 在一个实施例中,一个这样的器件具有源极/漏极区域,其具有第一和第二有源区域,以及在第一和第二有源区域之间的隔离区域和电介质插塞。 电介质插塞可以延伸到第一和第二有源区域的上表面之下,并且可以由对于特定各向同性去除化学物质具有比隔离区域的电介质材料更低的去除速率的电介质材料形成。

    Fin structures and methods of fabricating fin structures
    20.
    发明授权
    Fin structures and methods of fabricating fin structures 有权
    鳍结构和制造鳍结构的方法

    公开(公告)号:US08076721B2

    公开(公告)日:2011-12-13

    申请号:US12795495

    申请日:2010-06-07

    IPC分类号: H01L29/78

    摘要: There is provided fin structures and methods for fabricating fin structures. More specifically, fin structures are formed in a substrate. The fin structures may include two fins separated by a channel, wherein the fins may be employed as fins of a field effect transistor. The fin structures are formed below the upper surface of the substrate, and may be formed without utilizing a photolithographic mask to etch the fins.

    摘要翻译: 提供了用于制造翅片结构的翅片结构和方法。 更具体地,翅片结构形成在基板中。 翅片结构可以包括由通道分开的两个翅片,其中翅片可以用作场效应晶体管的翅片。 翅片结构形成在衬底的上表面下方,并且可以在不利用光刻掩模来形成以蚀刻鳍片的情况下形成。