Abstract:
A circuit of a dual control voltage-controlled ring oscillator is disclosed having significantly less power and area while still maintaining a large frequency range and tune accuracy. The dual control ring oscillator has at least two delay paths which can be added or interpolated according to an interpolation variable set by a coarse tune and a fine tune code. In addition, moreover, each of the delay paths have a number of variable delay elements which are varied in response to another input code. When the variable delay elements are capacitors, the capacitance will be varied in accordance with another coarse tune code. In the preferred embodiment, the input codes are digital and the frequency range obtained can be greater than two to one. First, the variable delay elements are adjusted to obtain coarse tuning of the dual control ring oscillator then the interpolation variable is more finely adjusted to obtain fine tuning of the ring oscillator. Phase control can be similarly accomplished using coarse tuning by adjusting the delay of the paths, and then using fine tuning to interpolate the delay paths.
Abstract:
An apparatus and method to control signal phase in a radio device includes a phase rotator configured to control a phase of a local oscillator. A phase error determination module is configured to determine phase error information based on received in-phase (I) and quadrature (Q) (IQ) signal values. A phase correction module is configured to derive from the received IQ signal values a correction signal and apply the correction signal to the phase rotator in a path of the local oscillator.
Abstract:
Techniques provide improved thermal interface material application in an assembly associated with an integrated circuit package. For example, an apparatus comprises an integrated circuit module, a printed circuit board, and a heat transfer device. The integrated circuit module is mounted on a first surface of the printed circuit board. The printed circuit board has at least one thermal interface material application via formed therein in alignment with the integrated circuit module. The heat transfer device is mounted on a second surface of the printed circuit board and is thermally coupled to the integrated circuit module. The second surface of the printed circuit board is opposite to the first surface of the printed circuit board.
Abstract:
An input attenuator may include a first input circuit having an RF_IN+ terminal, a first node, a transmission line, a DC blocking capacitor, a second node, a third node, and an output terminal coupled in series, the first node selectively coupled to ground via a serially coupled capacitor and a first silicon germanium heterojunction bipolar transistor, the second node coupled to ground via a capacitor, and the third node selectively coupled to ground via a DC blocking capacitor, a resistor, and a second silicon germanium heterojunction bipolar transistor coupled in series. The input attenuator may also include a second input circuit parallel to the first input circuit and having structure similar to the first input circuit.
Abstract:
Quadrature modulation systems, circuits and methods are provided to support various modulation modes including ASK (amplitude shift key), FSK (frequency shift key) and PSK (phase shift key) modulation at high data rates (e.g., gigabit data rates). For example, a modulation circuit includes a mixer circuit including an integrated sign modulation control circuit and a plurality of mixer ports. The mixer ports include a first input port, a second input port, an output port and a sign modulation control port. The modulation circuit generates a modulated signal by operation of the mixer circuit multiplying a modulating signal applied to the first input port with a carrier signal applied to the second input port to generate a mixed signal output from the output port, and by operation of the integrated sign modulation control circuit controlling polarity switching of a signal at one of the mixer ports in response to a sign modulation control signal input to the sign modulation control port. The sign modulation control signal can be a digital data signal having binary data encoded into the modulated signal.
Abstract:
Spectrum analyzer circuits and methods are provided which implement “zero-IF” (direct conversion) or “near-zero IF” (or very low IF) architectures that enable implementation of integrated (on-chip) spectrum analyzers for measuring the frequency spectrum of internal chip signals. An integrated spectrum analyzer circuit, which comprises a zero IF or near-zero IF framework, enables a low-power compact design with sufficient resolution bandwidth for on-chip implementation and diagnostics of internal chip signals.
Abstract:
A variable-gain amplifier includes an intermediate node operative to receive an electric current from a current source. A common-emitter amplifier has a collector electrically connected to the intermediate node. A first common-base amplifier has an emitter electrically connected to the intermediate node and a collector electrically connected to an output node. A base-degenerated amplifier has an emitter electrically connected to the intermediate node and a collector electrically connected to the output node. A second common-base amplifier has an emitter electrically connected to the intermediate node and a collector electrically connected to small-signal ground. The intermediate node is operative to direct the electric current to the first common-base amplifier, thereby causing the variable-gain amplifier to operate in a first mode; and the intermediate node is operative to direct the electric current to the base-degenerated amplifier and the second common-base amplifier, thereby causing the variable-gain amplifier to operate in a second mode.
Abstract:
An off-chip signal is provided to a differential branch-line directional coupler implemented entirely on-chip. The coupler produces differential quadrature signals, which are then buffered and applied to a quadrature mixer. The coupler is implemented entirely on-chip using microstrip transmission lines. The coupler is made up of a plurality of rings and a plurality of underpasses connecting ports of the rings, wherein each of the plurality of rings is made up of four branch lines, and each branch line having an electrical length of one-quarter wavelength at the center design frequency. Coupling between the plurality of branch lines of the rings may be varied.
Abstract:
This invention provides a circuit and method to replace the passive resistive or statically biased active load devices with dynamically biased active load devices. This allows the load devices to present an effective load which varies depending on the state of the circuit output. The effective load and the time rate of change of the effective load can be dynamically optimized to improve circuit performance with changing conditions. The effective load is varied according to the state of the circuit by the use of time-delayed negative feedback. The biasing of the load devices is also capable to control the logic swing of the circuit. A bias generating circuit employing a dynamically biased active load is described. This provides a method for a family of logic circuits, especially CML circuits, to operate at low voltage and low power at high switching speeds, having symmetrical rise and fall times and well defined logic signal swings. The output is sampled and maintained at near ideal bias voltage with a voltage follower type circuit which provides a gain of less than unity and finite delay. Particular circuit implementations using various semiconductor technologies are described and many others are possible. Although the invention may find primary use in VLSI logic circuits, especially those requiring high speed and low power, it is also shown to be useful in analog circuits. Alternate circuit configurations for dynamically biased active load devices are described.
Abstract:
Radio frequency integrated circuits with on-chip noise source for use in the performance of tests and/or calibrations. A radio frequency integrated circuit includes at least one noise source residing on the radio frequency integrated circuit, the noise source being controllable by a digital input, and a radio frequency circuit residing on the radio frequency integrated circuit and being coupled to the noise source, wherein at least one attribute of the radio frequency circuit is determinable by controlling the noise source via the digital input.