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公开(公告)号：US08951878B2
公开(公告)日：2015-02-10
申请号：US14097793
申请日：2013-12-05
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yasuhiro Jinbo , Hironobu Shoji , Hideto Ohnuma , Shunpei Yamazaki
IPC: H01L21/331 , H01L21/8222 , H01L21/84 , H01L21/265 , H01L21/762
CPC classification number: H01L21/84 , H01L21/26506 , H01L21/76254
Abstract: It is an object of the present invention to provide a method for manufacturing an SOI substrate having an SOI layer that can be used in practical applications with high yield even when a flexible substrate such as a glass substrate or a plastic substrate is used. Further, it is another object of the present invention to provide a method for manufacturing a thin semiconductor device using such an SOI substrate with high yield. When a single-crystal semiconductor substrate is bonded to a flexible substrate having an insulating surface and the single-crystal semiconductor substrate is separated to manufacture an SOI substrate, one or both of bonding surfaces are activated, and then the flexible substrate having an insulating surface and the single-crystal semiconductor substrate are attached to each other.
Abstract translation: 本发明的目的是提供一种制造具有SOI层的SOI衬底的方法，该SOI衬底即使在使用诸如玻璃衬底或塑料衬底的柔性衬底时，也可以在实际应用中以高产率使用。 此外，本发明的另一个目的是提供一种以高产率制造使用这种SOI衬底的薄半导体器件的方法。 当将单晶半导体衬底接合到具有绝缘表面的柔性衬底并且分离单晶半导体衬底以制造SOI衬底时，一个或两个键合表面被激活，然后柔性衬底具有绝缘表面 并且单晶半导体衬底彼此附接。
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公开(公告)号：US12170291B2
公开(公告)日：2024-12-17
申请号：US18534908
申请日：2023-12-11
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Hisao Ikeda , Kouhei Toyotaka , Hideaki Shishido , Hiroyuki Miyake , Kohei Yokoyama , Yasuhiro Jinbo , Yoshitaka Dozen , Takaaki Nagata , Shinichi Hirasa
IPC: H01L27/12 , G09G3/20 , G09G3/3233 , H01L29/786 , H10K59/131 , H10K59/35 , G09G3/36 , G09G5/391
Abstract: Provided is a display device with extremely high resolution, a display device with higher display quality, a display device with improved viewing angle characteristics, or a flexible display device. Same-color subpixels are arranged in a zigzag pattern in a predetermined direction. In other words, when attention is paid to a subpixel, another two subpixels exhibiting the same color as the subpixel are preferably located upper right and lower right or upper left and lower left. Each pixel includes three subpixels arranged in an L shape. In addition, two pixels are combined so that pixel units including subpixel are arranged in matrix of 3×2.
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公开(公告)号：US12159941B2
公开(公告)日：2024-12-03
申请号：US17770588
申请日：2020-10-26
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Shunpei Yamazaki , Yasuhiro Jinbo , Tomosato Kanagawa
IPC: H01L29/786 , H01L29/417
Abstract: A semiconductor device with a small variation in transistor characteristics is provided. An oxide semiconductor film, a source electrode and a drain electrode over the oxide semiconductor film, an interlayer insulating film placed to cover the oxide semiconductor film, the source electrode, and the drain electrode, and a gate electrode over the oxide semiconductor film are included; an opening is formed overlapping with a region between the source electrode and the drain electrode in the interlayer insulating film; the gate electrode is placed in the opening in the interlayer insulating film; and the source electrode and the drain electrode include a conductive film having compressive stress.
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公开(公告)号：US11881522B2
公开(公告)日：2024-01-23
申请号：US17276166
申请日：2019-09-24
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei Yamazaki , Naoki Okuno , Yasuhiro Jinbo
IPC: H01L29/66 , H01L21/02 , H01L27/12 , H01L29/417 , H01L29/786 , H10B12/00
CPC classification number: H01L29/66969 , H01L21/02345 , H01L21/02565 , H01L27/124 , H01L27/1207 , H01L27/1225 , H01L27/1255 , H01L29/41733 , H01L29/7869 , H01L29/78648 , H10B12/00
Abstract: A semiconductor device having favorable electrical characteristics is provided. A first oxide is formed over a substrate; a first insulator is formed over the first oxide; an opening reaching the first oxide is formed in the first insulator; a first oxide film is deposited in contact with the first oxide and the first insulator in the opening; a first insulating film is deposited over the first oxide film; microwave treatment is performed from above the first insulating film; heat treatment is performed on one or both of the first insulating film and the first oxide; a first conductive film is deposited over the first insulating film; and part of the first oxide film, part of the first insulating film, and part of the first conductive film are removed until a top surface of the first insulator is exposed, so that a second oxide, a second insulator, and a first conductor are formed. The microwave treatment is performed using a gas containing oxygen under reduced pressure, and the heat treatment is performed under reduced pressure.
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公开(公告)号：US11600489B2
公开(公告)日：2023-03-07
申请号：US16972413
申请日：2019-05-31
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Shunpei Yamazaki , Tetsuya Kakehata , Yuji Egi , Yasuhiro Jinbo , Yujiro Sakurada
IPC: H01L21/02 , H01L29/786 , H01L29/51 , H01L21/8234
Abstract: A semiconductor device having favorable electrical characteristics is provided. A metal oxide is formed over a substrate by the steps of: introducing a first precursor into a chamber in which the substrate is provided; introducing a first oxidizer after the introduction of the first precursor; introducing a second precursor after the introduction of the first oxidizer; and introducing a second oxidizer after the introduction of the second precursor.
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Patent Agency Ranking
公开(公告)号：US11516927B2
公开(公告)日：2022-11-29
申请号：US17569631
申请日：2022-01-06
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yoshiharu Hirakata , Yasuhiro Jinbo , Shunpei Yamazaki
Abstract: A light-emitting device can be folded in such a manner that a flexible light-emitting panel is supported by a plurality of housings which are provided spaced from each other and the light-emitting panel is bent so that surfaces of adjacent housings are in contact with each other. Furthermore, in the light-emitting device, in which part or the whole of the housings have magnetism, the two adjacent housings can be fixed to each other by a magnetic force when the light-emitting device is used in a folded state.
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公开(公告)号：US11304318B2
公开(公告)日：2022-04-12
申请号：US17367661
申请日：2021-07-06
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yoshiharu Hirakata , Yasuhiro Jinbo , Shunpei Yamazaki
Abstract: A light-emitting device can be folded in such a manner that a flexible light-emitting panel is supported by a plurality of housings which are provided spaced from each other and the light-emitting panel is bent so that surfaces of adjacent housings are in contact with each other. Furthermore, in the light-emitting device, in which part or the whole of the housings have magnetism, the two adjacent housings can be fixed to each other by a magnetic force when the light-emitting device is used in a folded state.
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公开(公告)号：US10912205B2
公开(公告)日：2021-02-02
申请号：US16694048
申请日：2019-11-25
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yoshiharu Hirakata , Yasuhiro Jinbo , Shunpei Yamazaki
Abstract: A light-emitting device can be folded in such a manner that a flexible light-emitting panel is supported by a plurality of housings which are provided spaced from each other and the light-emitting panel is bent so that surfaces of adjacent housings are in contact with each other. Furthermore, in the light-emitting device, in which part or the whole of the housings have magnetism, the two adjacent housings can be fixed to each other by a magnetic force when the light-emitting device is used in a folded state.
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公开(公告)号：US10276826B2
公开(公告)日：2019-04-30
申请号：US15861899
申请日：2018-01-04
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei Yamazaki , Yasuhiro Jinbo , Shingo Eguchi
Abstract: A lightweight flexible light-emitting device that is less likely to be broken is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, an element layer, a first bonding layer, and a second bonding layer. The element layer includes a light-emitting element. The element layer is provided between the first flexible substrate and the second flexible substrate. The first bonding layer is provided between the first flexible substrate and the element layer. The second bonding layer is provided between the second flexible substrate and the element layer. The first and second bonding layers are in contact with each other on the outer side of an end portion of the element layer. The first and second flexible substrates are in contact with each other on the outer side of the end portions of the element layer, the first bonding layer, and the second bonding layer.
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公开(公告)号：US10243012B2
公开(公告)日：2019-03-26
申请号：US15798459
申请日：2017-10-31
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Minato Ito , Yasuhiro Jinbo
Abstract: A method for manufacturing a display device, which does not easily damage an electrode, is provided. In the first step, a terminal electrode, a wiring, and a functional layer are provided over a first substrate; the terminal electrode, the wiring, and the functional layer are electrically connected to one another; an insulating layer is provided over the terminal electrode; a first layer is provided over the terminal electrode and the insulating layer; an adhesive layer is sandwiched between the first substrate and a second substrate; the second substrate and the adhesive layer include a first opening overlapping with part of the first layer; and the insulating layer includes a second opening inside the first opening in a top view. In the second step, part of the first layer is removed by emitting particles having a high sublimation property to the first layer, so that the terminal electrode is exposed.
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