公开(公告)号：US20010020482A1

公开(公告)日：2001-09-13

申请号：US09859930

申请日：2001-05-17

Applicant: SEMITOOL, INC.

Inventor： Dana Scranton ,  Gary L. Curtis

IPC: B08B003/04

CPC classification number: H01L21/67034 ,  Y10S134/902

Abstract: In a method of processing or drying a semiconductor wafer, the wafer is withdrawn from a fluid bath at an inclined angle, and at a selected withdrawal speed. A solvent vapor is provided at the surface of the bath, to create a surface tension gradient and promote drying, or removal of the fluid from the wafer surface. After the wafer is entirely withdrawn from the rinsing liquid, the wafer is rotated briefly, to remove any remaining fluid via centrifugal force, without the fluid drying on the wafer. The wafer is held onto a rotor assembly which rotates the wafer within an enclosed chamber, and which is also pivoted within the chamber, to position the wafer at the incline angle.

Abstract translation: 在半导体晶片的处理或干燥的方法中，将晶片以倾斜角度从流体槽中以选定的退出速度取出。 在浴的表面处提供溶剂蒸气，以产生表面张力梯度并促进干燥或从晶片表面去除流体。 在晶片完全从冲洗液体中取出之后，晶片短暂旋转，通过离心力除去任何剩余的流体，而不会在晶片上流体干燥。 将晶片保持在转子组件上，转子组件使晶片在封闭的腔室内旋转，并且还在腔室内枢转，以便以倾斜角定位晶片。

公开(公告)号：US20040023494A1

公开(公告)日：2004-02-05

申请号：US10632495

申请日：2003-07-31

Applicant: Semitool, Inc.

Inventor： Brian K. Aegerter ,  Curt T. Dundas ,  Tom L. Ritzdorf ,  Gary L. Curtis ,  Michael Jolley

IPC: H01L021/302 ,  H01L021/461

CPC classification number: H01L21/6715 ,  C23F1/18 ,  C23F1/30 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/6708 ,  Y10S134/902 ,  Y10S438/906

Abstract: This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides or the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece as the workpiece and corresponding reactor are spinning about an axis of rotation that is generally orthogonal to the center of the face of the workpiece being processed. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

Abstract translation: 本发明提供了一种用于处理具有前侧，后侧和外周的工件的方法。 根据该过程，从前侧或后侧或工件中的至少一个的外周边缘选择性地施加或排除处理流体。 处理流体的排除和/或应用通过将一种或多种加工流体施加到工件上而发生，因为工件和相应的反应器围绕大致正交于被加工工件的面的中心的旋转轴旋转。 使用一种或多种加工流体的流量，流体压力和/或旋转速率来控制从外周边缘选择性地施加或排除处理流体的程度。

公开(公告)号：US20020144973A1

公开(公告)日：2002-10-10

申请号：US10150631

申请日：2002-05-17

Applicant: Semitool, Inc.

Inventor： Brian Aegerter ,  Curt T. Dundas ,  Michael Jolley ,  Tom L. Ritzdorf ,  Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson

IPC: H01B013/00

CPC classification number: H01L21/67017 ,  C23F1/18 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S438/928 ,  Y10S438/963

Abstract: In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

Abstract translation: 在处理诸如半导体晶片的工件的处理中，处理流体被选择性地从工件的前侧或后侧中的至少一个的外周边缘施加或排除。 通过在工件和保持工件的反应器旋转的同时将一种或多种加工流体施加到工件来发生加工流体的排除和/或应用。 处理流体的流量，流体压力和/或旋转速率用于控制从外周边缘选择性地施加或排除处理流体的程度。

公开(公告)号：US20010050060A1

公开(公告)日：2001-12-13

申请号：US09921840

申请日：2001-08-02

Applicant: SEMITOOL, INC.

Inventor： Gary L. Curtis ,  Raymon F. Thompson

IPC: C23C016/00

CPC classification number: H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S134/902

Abstract: An apparatus for processing a workpiece in a micro-environment includes a workpiece housing connected to be rotated by a motor. The workpiece housing forms a substantially closed processing chamber where one or more processing fluids are distributed across at least one face of the workpiece by centrifugal force generated during rotation of the housing. A sump is connected to an inlet and an outlet in the chamber. Rotation of the workpiece housing recirculates fluid into the chamber.

Abstract translation: 用于在微环境中处理工件的装置包括连接以由电动机旋转的工件壳体。 工件壳体形成基本封闭的处理室，其中一个或多个处理流体通过在壳体旋转期间产生的离心力分布在工件的至少一个面上。 贮槽连接到腔室中的入口和出口。 工件壳体的旋转使流体进入腔室。

公开(公告)号：US20010047752A1

公开(公告)日：2001-12-06

申请号：US09921854

申请日：2001-08-02

Applicant: SEMITOOL, INC.

Inventor： Gary L. Curtis ,  Raymon F. Thompson

IPC: B05C011/02

CPC classification number: H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S134/902

Abstract: An apparatus for processing a workpiece in a micro-environment includes a workpiece housing connected to a motor for rotation. The workpiece housing forms a processing chamber where one or more processing fluids are distributed across at least one face of the workpiece by centrifugal force generated during rotation of the housing. An array of workpiece housings are contained within an enclosure. A robot moves workpieces into and out of the workpiece housings.

Abstract translation: 用于在微环境中处理工件的装置包括连接到用于旋转的电动机的工件壳体。 工件壳体形成处理室，其中一个或多个处理流体通过在壳体旋转期间产生的离心力分布在工件的至少一个表面上。 工件外壳的阵列包含在外壳内。 机器人将工件移入和移出工件外壳。