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    Apparatus and methods for processing a workpiece
    2.
    发明申请
    Apparatus and methods for processing a workpiece 失效

    公开(公告)号：US20030176067A1

    公开(公告)日：2003-09-18

    申请号：US10412944

    申请日：2003-04-14

    Applicant: Semitool, Inc.

    Inventor： Paul Z. Wirth ,  Steven L. Peace ,  Erik Lund

    IPC: H01L021/302 ,  H01L021/461

    CPC classification number: B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/6715 ,  Y10S134/902 ,  Y10S438/906 ,  Y10S438/913

    Abstract: A system for processing a workpiece includes a head attached to a head lifter. A workpiece is supported in the head between an upper rotor and a lower rotor. A base has a bowl for containing a liquid. The head is movable by the head lifter from a first position vertically above the bowl, to a second position where the workpiece is at least partially positioned in the bowl. The bowl has a contour section with a sidewall having a radius of curvature which increases adjacent to a drain outlet in the bowl, to help rapid draining of liquid from the bowl. The head has a load position, where the rotors are spaced apart by a first amount, and a process position, where the rotors are engaged and sealed against each other. For rapid evacuation of fluid, the head also has a fast drain position, where the rotors are moved apart sufficiently to create an annular drain gap. Fluid is rapid evacuated by spinning the rotors with the head rotors slightly apart and unsealed, causing the fluid to flow our quickly under centrifugal force.

    Selective treatment of the surface of a microelectronic workpiece
    3.
    发明申请
    Selective treatment of the surface of a microelectronic workpiece 审中-公开
    选择性处理微电子工件的表面

    公开(公告)号：US20020144973A1

    公开(公告)日：2002-10-10

    申请号：US10150631

    申请日：2002-05-17

    Applicant: Semitool, Inc.

    Inventor： Brian Aegerter ,  Curt T. Dundas ,  Michael Jolley ,  Tom L. Ritzdorf ,  Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson

    IPC: H01B013/00

    CPC classification number: H01L21/67017 ,  C23F1/18 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S438/928 ,  Y10S438/963

    Abstract: In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

    Abstract translation: 在处理诸如半导体晶片的工件的处理中，处理流体被选择性地从工件的前侧或后侧中的至少一个的外周边缘施加或排除。 通过在工件和保持工件的反应器旋转的同时将一种或多种加工流体施加到工件来发生加工流体的排除和/或应用。 处理流体的流量，流体压力和/或旋转速率用于控制从外周边缘选择性地施加或排除处理流体的程度。

    Reactor for processing a semiconductor wafer
    4.
    发明申请
    Reactor for processing a semiconductor wafer 失效
    用于处理半导体晶片的反应器

    公开(公告)号：US20020189652A1

    公开(公告)日：2002-12-19

    申请号：US10223974

    申请日：2002-08-20

    Applicant: Semitool, Inc.

    Inventor： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

    IPC: B08B003/00

    CPC classification number: H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

    Abstract: A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

    Abstract translation: 用于处理半导体晶片或类似物品的方法包括在旋转晶片时旋转晶片并将其施加到晶片的第一侧的步骤。 流体通过离心力在晶片的第一侧上在所有方向上径向向外流动。 当流体从晶片的圆周边缘流出时，其被包含在环形储存器中，使得流体也流到晶片的第二侧的外部环形区域。 开口允许流体从储存器流出。 开口限定分流线的位置，超过该分隔线，流体不会在晶片的第二侧上行进。 用于处理半导体晶片或类似物品的装置包括具有由上下转子形成的处理室的反应器。 晶片支撑在转子之间。 转子由旋转电机旋转。 处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。 流体向外均匀地向各个方向流动。 晶片支架自动提升晶片，从而当转子在加工后彼此分离时，可以通过机器人将其从反应器中移除。

    Reactor for processing a semiconductor wafer
    5.
    发明申请
    Reactor for processing a semiconductor wafer 有权
    用于处理半导体晶片的反应器

    公开(公告)号：US20020185163A1

    公开(公告)日：2002-12-12

    申请号：US10202074

    申请日：2002-07-23

    Applicant: Semitool, Inc.

    Inventor： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

    IPC: B08B003/00

    CPC classification number: H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

    Abstract: An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

    Abstract translation: 用于处理半导体晶片或类似物品的装置包括具有由上下转子形成的处理室的反应器。 晶片支撑在转子之间。 转子由旋转电机旋转。 处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。 流体向外均匀地向各个方向流动。 晶片支架自动提升晶片，从而当转子在加工后彼此分离时，它可以由机器人从反应器中移出。

    Apparatus and methods for processing a workpiece
    6.
    发明申请
    Apparatus and methods for processing a workpiece 有权
    用于加工工件的设备和方法

    公开(公告)号：US20020083960A1

    公开(公告)日：2002-07-04

    申请号：US09907484

    申请日：2001-07-16

    Applicant: Semitool, Inc.

    Inventor： Paul Z. Wirth ,  Steven L. Peace ,  Erik Lund

    IPC: C25F001/00 ,  C25F003/30 ,  C25F005/00 ,  B08B006/00

    CPC classification number: H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708 ,  H01L21/67086 ,  Y10S134/902 ,  Y10S438/906 ,  Y10S438/913

    Abstract: A system for processing a workpiece includes a head attached to a head lifter. A workpiece is supported in the head between an upper rotor and a lower rotor. A base has a bowl for containing a liquid. The head is movable by the head lifter from a first position vertically above the bowl, to a second position where the workpiece is at least partially positioned in the bowl. The bowl has a contour section with a sidewall having a radius of curvature which increases adjacent to a drain outlet in the bowl, to help rapid draining of liquid from the bowl. The head has a load position, where the rotors are spaced apart by a first amount, and a process position, where the rotors are engaged and sealed against each other. For rapid evacuation of fluid, the head also has a fast drain position, where the rotors are moved apart sufficiently to create an annular drain gap. Fluid is rapid evacuated by spinning the rotors with the head rotors slightly apart and unsealed, causing the fluid to flow our quickly under centrifugal force.

    Abstract translation: 用于处理工件的系统包括附接到头部升降器的头部。 工件在上转子和下转子之间的头部中被支撑。 底座有一个容纳液体的碗。 头部可由头部升降器从垂直于碗的第一位置移动到第二位置，在该位置，工件至少部分地定位在碗中。 碗具有轮廓部分，其侧壁具有与碗中的排水出口相邻增加的曲率半径，以帮助液体从碗中快速排出。 头部具有负载位置，其中转子间隔开第一量，以及处理位置，其中转子彼此接合并密封。 为了快速排出流体，头部还具有快速的排放位置，其中转子被足够地移动以产生环形的排水间隙。 流体通过旋转转子而迅速抽空，头部转子稍微分开并开封，导致流体在离心力下快速流动。

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