公开(公告)号：US20040040573A1

公开(公告)日：2004-03-04

申请号：US10655210

申请日：2003-09-04

Applicant: Semitool, Inc.

Inventor： Eric Bergman ,  Dana Scranton ,  Eric Lund ,  Worm Lind

IPC: C25F001/00

CPC classification number: B08B3/12 ,  Y10S134/902

Abstract: A system for processing a workpiece includes an inner chamber pivotably supported within an outer chamber. The inner chamber has an opening to allow liquid to drain out. A motor pivots the inner chamber to bring the opening at or below the level of liquid in the inner chamber. As the inner chamber turns, liquid drains out. Workpieces within the inner chamber are supported on a holder or a rotor, which may be fixed or rotating. Multi processes may be performed within the inner chamber, reducing the need to move the workpieces between various apparatus and reducing risk of contamination.

Abstract translation: 用于处理工件的系统包括可枢转地支撑在外室内的内室。 内室具有开口以允许液体排出。 电动机使内腔枢转，使开口处于内腔液面之下或之下。 当内室转动时，液体排出。 内腔内的工件支撑在可固定或旋转的支架或转子上。 多个工艺可以在内腔内执行，减少了在各种装置之间移动工件的需要，并降低了污染的风险。

公开(公告)号：US20010020482A1

公开(公告)日：2001-09-13

申请号：US09859930

申请日：2001-05-17

Applicant: SEMITOOL, INC.

Inventor： Dana Scranton ,  Gary L. Curtis

IPC: B08B003/04

CPC classification number: H01L21/67034 ,  Y10S134/902

Abstract: In a method of processing or drying a semiconductor wafer, the wafer is withdrawn from a fluid bath at an inclined angle, and at a selected withdrawal speed. A solvent vapor is provided at the surface of the bath, to create a surface tension gradient and promote drying, or removal of the fluid from the wafer surface. After the wafer is entirely withdrawn from the rinsing liquid, the wafer is rotated briefly, to remove any remaining fluid via centrifugal force, without the fluid drying on the wafer. The wafer is held onto a rotor assembly which rotates the wafer within an enclosed chamber, and which is also pivoted within the chamber, to position the wafer at the incline angle.

Abstract translation: 在半导体晶片的处理或干燥的方法中，将晶片以倾斜角度从流体槽中以选定的退出速度取出。 在浴的表面处提供溶剂蒸气，以产生表面张力梯度并促进干燥或从晶片表面去除流体。 在晶片完全从冲洗液体中取出之后，晶片短暂旋转，通过离心力除去任何剩余的流体，而不会在晶片上流体干燥。 将晶片保持在转子组件上，转子组件使晶片在封闭的腔室内旋转，并且还在腔室内枢转，以便以倾斜角定位晶片。

公开(公告)号：US20030136429A1

公开(公告)日：2003-07-24

申请号：US10055467

申请日：2002-01-22

Applicant: Semitool, Inc.

Inventor： Dana Scranton ,  Eric J. Bergman

IPC: B08B003/10

CPC classification number: H01L21/67051 ,  B08B3/08 ,  B08B3/102 ,  B08B7/00 ,  B08B2203/005 ,  F26B21/14 ,  H01L21/67028

Abstract: A processor for cleaning, rinsing, and drying workpieces includes a process vessel, an ozone injection system for introducing ozone gas into the process vessel, a liquid injection system for introducing a processing fluid into the process vessel, and a drying system for delivering a drying fluid to the process vessel. The processing fluid is introduced into the process vessel such that the processing fluid lies beneath a workpiece. Ozone gas is introduced into the process vessel. The workpiece is then bathed in the processing fluid. A drying fluid is introduced into the process vessel while the processing fluid is evacuated from the process vessel. Microelectronic workpieces can be cleaned and dried in a single vessel, reducing the equipment and space used in manufacturing.

Abstract translation: 用于清洁，冲洗和干燥工件的处理器包括处理容器，用于将臭氧气体引入处理容器的臭氧注入系统，用于将处理流体引入处理容器的液体注入系统，以及用于输送干燥的干燥系统 流体到处理容器。 将处理流体引入处理容器中，使得处理流体位于工件下方。 将臭氧气体引入加工容器中。 然后将工件浸在处理液中。 将干燥流体引入处理容器中，同时处理流体从处理容器排出。 微电子工件可以在单个容器中进行清洁和干燥，减少制造中使用的设备和空间。

公开(公告)号：US20030101616A1

公开(公告)日：2003-06-05

申请号：US10336193

申请日：2003-01-03

Applicant: Semitool, Inc.

Inventor： Dana Scranton ,  Ian Sharp

IPC: F26B003/00

CPC classification number: H01L21/67034 ,  B08B3/06 ,  B08B3/10 ,  B08B3/12 ,  H01L21/67028

Abstract: A processor for rinsing and drying of semiconductor substrates includes a process vessel contained within an outer containment vessel. A diluted organic vapor creates a Marangoni effect flow along the surface of processing liquid contained within the process vessel. The process vessel includes porous walls that allow residual chemicals, organic species, and other unwanted materials to flow from the process vessel to the outer containment vessel. The porous walls allow for the maintenance of a stable surface tension gradient to sustain a consistent Marangoni force for even drying. Replacement processing fluid is preferably introduced to the process vessel to prevent the build up of organic species in the surface layer of the processing fluid.

公开(公告)号：US20020157686A1

公开(公告)日：2002-10-31

申请号：US09925884

申请日：2001-08-06

Applicant: Semitool, Inc.

Inventor： Michael Kenny ,  Brian Aegeter ,  Eric Bergman ,  Dana Scranton

IPC: B08B007/04

CPC classification number: H01L21/02052 ,  B08B3/00 ,  B08B3/02 ,  B08B3/044 ,  B08B3/08 ,  B08B7/00 ,  B08B2203/005 ,  B08B2203/007 ,  B08B2203/0288 ,  B08B2230/01 ,  H01L21/02054 ,  H01L21/3065 ,  H01L21/67034 ,  H01L21/6704 ,  H01L21/67051 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K3/3426 ,  Y02P70/613 ,  H01L2924/00

Abstract: In a system for cleaning a workpiece or wafer, a boundary layer of heated liquid is formed on the workpiece surface. Ozone is provided around the workpiece. The ozone diffuses through the boundary layer and chemically reacts with contaminants on the workpiece surface. A jet of high velocity heated liquid is directed against the workpiece, to physically dislodge or remove a contaminant from the workpiece. The jet penetrates through the boundary layer at the point of impact. The boundary layer otherwise remains largely undisturbed. Preferably, the liquid includes water, and may also include a chemical. Steam may also be jetted onto the workpiece, with the steam also physically removing contaminants, and also heating the workpiece to speed up chemical cleaning. The workpiece and the jet of liquid are moved relative to each other, so that substantially all areas of the workpiece surface facing the jet are exposed at least momentarily to the jet. Sonic or electromagnetic energy may also be introduced to the workpiece.

Abstract translation: 在用于清洁工件或晶片的系统中，在工件表面上形成加热液体的边界层。 在工件周围提供臭氧。 臭氧通过边界层扩散并与工件表面上的污染物发生化学反应。 高速加热液体的喷嘴被引导到工件上，以物理地移除或去除工件上的污染物。 喷射器在冲击点穿过边界层。 否则边界层大体上不受干扰。 优选地，液体包括水，并且还可以包括化学品。 蒸汽也可以喷射到工件上，蒸汽还物理地去除污染物，并且还加热工件以加速化学清洁。 工件和液体射流相对于彼此移动，使得面对射流的工件表面的基本上所有区域至少暴露于射流。 也可以将声波或电磁能引入到工件中。

公开(公告)号：US20020139400A1

公开(公告)日：2002-10-03

申请号：US09818042

申请日：2001-03-27

Applicant: Semitool, Inc.

Inventor： Dana Scranton

IPC: B08B003/12

CPC classification number: H01L21/67057 ,  B08B3/102 ,  B08B3/12 ,  H01L21/67051

Abstract: A processor for processing microelectronic workpieces includes a process vessel adapted to hold one or more microelectronic workpieces vertically within a rotatable fixture. A drive motor is coupled to the rotatable fixture to spin the rotatable fixture during processing. A processing fluid is introduced into the process vessel for processing of the microelectronic workpieces. The rotatable fixture is raised out of the processor for loading/unloading. The processor can be used to clean, plate, etch, strip, rinse, or dry microelectronic workpieces.

Abstract translation: 用于处理微电子工件的处理器包括适于将一个或多个微电子工件垂直地保持在可旋转夹具内的处理容器。 驱动马达联接到可转动的固定装置，以在加工过程中旋转可旋转夹具。 将处理流体引入到用于处理微电子工件的处理容器中。 可旋转夹具从处理器中升出以进行装载/卸载。 该处理器可用于清洁，印版，蚀刻，剥离，冲洗或干燥微电子工件。

公开(公告)号：US20030136431A1

公开(公告)日：2003-07-24

申请号：US10056706

申请日：2002-01-24

Applicant: Semitool, Inc.

Inventor： Dana Scranton ,  Steve Eudy

IPC: B08B001/04 ,  B08B003/00

CPC classification number: H01L21/67046 ,  B08B1/04 ,  B08B3/10 ,  H01L21/67028

Abstract: In a post chemical-mechanical polishing (CMP) procedure for cleaning a workpiece, a cleaning solution is delivered to the core of a brush where the solution is absorbed by the brush and then applied by the brush onto the workpiece. The cleaning solution is uniformly applied to the workpiece. The volumes of solutions used in the scrubbing process is reduced. A thin oxide layer is etched. A hydrophilic surface state is maintained. The workpiece is then rinsed and dried in a centrifugal processing between upper and lower rotors. A high level clean is achieved while consumption of rinsing and drying fluids is reduced.

Abstract translation: 在用于清洁工件的后期化学机械抛光（CMP）程序中，将清洁溶液输送到刷子的芯部，其中溶液被刷子吸收，然后通过刷子施加到工件上。 清洗液均匀地涂在工件上。 洗涤过程中使用的溶液体积减少。 蚀刻薄的氧化物层。 保持亲水表面状态。 然后在上下转子之间的离心加工中冲洗和干燥工件。 在消耗冲洗和干燥流体的同时，实现了高水平的清洁。

公开(公告)号：US20030136422A1

公开(公告)日：2003-07-24

申请号：US10055302

申请日：2002-01-23

Applicant: Semitool, Inc.

Inventor： Dana Scranton

IPC: B08B003/12

CPC classification number: H01L21/67057 ,  B08B3/12

Abstract: A device for the side-specific cleaning of a microelectronic workpiece having a front side, a back side, and an edge includes a chamber, a fixture within the chamber that is adapted to hold one or more microelectronic workpieces. At least one transducer is located within the chamber and preferably adjacent to the edge of the microelectronic workpiece. The method includes the steps of immersing the front side, back side, and edge of the microelectronic workpiece in a first processing fluid while preferably rotating the microelectronic workpiece. The microelectronic workpiece is then rinsed and dried and immersed in a second processing fluid such that the back side and edge of the microelectronic workpiece are immersed in the second processing fluid, while preferably rotating the microelectronic workpiece, without exposing the front surface of the microelectronic workpiece to the second processing fluid. Vibrational energy, preferably in the form of megasonics, is introduced during at least one of the immersions steps.

Abstract translation: 用于侧面清洁具有前侧，后侧和边缘的微电子工件的装置包括腔室，室内的固定件，其适于容纳一个或多个微电子工件。 至少一个换能器位于腔室内并且优选地邻近微电子工件的边缘。 该方法包括以下步骤：将微电子工件的正面，背面和边缘浸入第一处理流体中，同时优选地旋转微电子工件。 然后将微电子工件冲洗并干燥并浸入第二处理流体中，使得微电子工件的背面和边缘浸入第二处理流体中，同时优选地旋转微电子工件，而不暴露微电子工件的前表面 到第二处理流体。 优选以兆声波形式的振动能量在至少一个浸入步骤期间引入。

公开(公告)号：US20030010362A1

公开(公告)日：2003-01-16

申请号：US09907544

申请日：2001-07-16

Applicant: Semitool, Inc.

Inventor： Dana Scranton ,  Eric Bergman ,  Eric Lund ,  Joe Lanfrankie ,  Worm Lund

IPC: B08B003/00

CPC classification number: H01L21/67057 ,  B08B3/045 ,  Y10S134/902

Abstract: Workpieces requiring low levels of contamination, such as semiconductor wafers, are loaded into a rotor within a process chamber. The process chamber has a horizontal drain opening in its cylindrical wall. The chamber is closed via a door. A process or rinsing liquid is introduced into the chamber. The liquid rises to a level so that the workpieces are immersed in the liquid. The chamber slowly pivots or rotates to move the drain opening down to the level of the liquid. The liquid drains out through the drain opening. The drain opening is kept near the surface of the liquid to drain off liquid at a uniform rate. An organic solvent vapor is introduced above the liquid to help prevent droplets of liquid from remaining on the workpieces as the liquid drains off. The rotor spins the workpieces to help to remove any remaining droplets by centrifugal force.

Abstract translation: 需要低水平污染的工件（例如半导体晶片）被装载到处理室内的转子中。 处理室在其圆柱形壁上具有水平排放开口。 房间通过门关闭。 将过程或冲洗液体引入室中。 液体升高到一定水平，使得工件浸入液体中。 腔室缓慢地枢转或旋转以将排水口向下移动到液体的高度。 液体通过排水口排出。 排水口保持在液体表面附近，以均匀的速度排出液体。 在液体上方引入有机溶剂蒸汽，以帮助防止液体液滴排出时残留在工件上。 转子旋转工件以帮助通过离心力去除任何剩余的液滴。

公开(公告)号：US20030010352A1

公开(公告)日：2003-01-16

申请号：US09907485

申请日：2001-07-16

Applicant: Semitool, Inc.

Inventor： Eric Bergman ,  Dana Scranton ,  Eric Lund ,  Worm Lund

IPC: B08B003/12 ,  B08B003/04 ,  B08B007/04

CPC classification number: B08B3/12 ,  Y10S134/902

Abstract: A system for processing a workpiece includes an inner chamber pivotably supported within an outer chamber. The inner chamber has an opening to allow liquid to drain out. A motor pivots the inner chamber to bring the opening at or below the level of liquid in the inner chamber. As the inner chamber turns, liquid drains out. Workpieces within the inner chamber are supported on a holder or a rotor, which may be fixed or rotating. Multi processes may be performed within the inner chamber, reducing the need to move the workpieces between various apparatus and reducing risk of contamination.

Abstract translation: 用于处理工件的系统包括可枢转地支撑在外室内的内室。 内室具有开口以允许液体排出。 电动机使内腔枢转，使开口处于内腔液面之下或之下。 当内室转动时，液体排出。 内腔内的工件支撑在可固定或旋转的支架或转子上。 多个工艺可以在内腔内执行，减少了在各种装置之间移动工件的需要，并减少污染的风险。