Abstract:
A radiation detector module includes a radiation detecting substrate including a plurality of semiconductor devices mounted thereon for detecting radiation, a fixing member for holding the radiation detecting substrate, and a circuit substrate connected to the radiation detecting substrate. The radiation detecting substrate further includes a mounting board including an edge portion connected to the circuit substrate at one end thereof, and a flexible substrate including a wiring pattern connected to the plurality of semiconductor devices. The fixing member includes a bottom, a first side wall extending in a normal direction to the bottom from one end of the bottom, a second side wall extending in the normal direction to the bottom from the other end of the bottom, and substrate supporting portions on the first side wall and the second side wall.
Abstract:
An FPC board includes a base insulating layer. The base insulating layer is composed of a first insulating portion and a second insulating portion. A bend portion is provided in the first insulating portion. A conductor layer is formed on one surface of the base insulating layer. The conductor layer is composed of a collector portion and a drawn-out conductor portion. A cover layer is formed to cover the conductor layer. A liquid crystal polymer is used as a material for the base insulating layer.
Abstract:
There is provided a pressure-sensitive adhesive composition for optical films. The composition can form a pressure-sensitive adhesive layer that can prevent light leakage caused by stress associated with dimensional change of a component such as an optical film, that has reworkability such that it can be easily peeled from a component, and that has satisfactory processability such that it can be processed without pressure-sensitive adhesive stain or dropout, after it is formed on an optical film. A pressure-sensitive adhesive optical film produced using the composition is also provided. The pressure-sensitive adhesive composition is prepared to include a (meth)acrylic polymer including (a) 34 to 94% by weight of an alkyl (meth)acrylate monomer unit, (b) 5 to 50% by weight of an aromatic ring-containing (meth)acrylate monomer unit, and (c) 0.01 to 0.5% by weight of an amino group-containing (meth)acrylate monomer unit; 0.01 to 2 parts by weight of a peroxide as a crosslinking agent; and 0.01 to 2 parts by weight of a silane coupling agent based on 100 parts by weight of the (meth)acrylic polymer.
Abstract:
A pressure-sensitive adhesive composition for an optical film of the present invention comprises 100 parts by weight of a (meth)acrylic polymer comprising 45 to 99.99% by weight of an alkyl (meth)acrylate monomer unit and 0.01 to 2% by weight of a tertiary amino group-containing monomer unit; and 0.01 to 2 parts by weight of a peroxide as a crosslinking agent. The pressure-sensitive adhesive composition can form an pressure-sensitive adhesive layer that has satisfactory reworkability such that optical films can be easily peeled from liquid crystal panels with no adhesive residue and also has satisfactory processability such that it can be worked without pressure-sensitive adhesive fouling or dropout.
Abstract:
An audio signal processing apparatus includes a high-frequency components extraction means for extracting high-frequency components higher than a predetermined cutoff frequency from the input audio signal and supplying them to satellite speakers by way of a predetermined high frequency range amplifier, a low-frequency components extraction means for extracting low-frequency components lower than a predetermined cutoff frequency from the input audio signal, a correlation reducing means for reducing the correlation of the high-frequency components and the low-frequency components of the input audio signal and a delay means for delaying the low-frequency components and supplying them to a subwoofer by way of a predetermined low frequency range amplifier.
Abstract:
An input device which allows a user to erase display information such as a character inputted thereto is provided. The input device includes a rectangular frame-shaped optical waveguide having a rectangular hollow input-use interior, and a control means provided on the outside of one of the sides of the optical waveguide. The optical waveguide and the control means are provided on a surface of a rectangular frame-shaped retainer plate having the hollow input-use interior, and are covered with a rectangular frame-shaped protective plate. The control means includes: a light-emitting element connected to ends of light-emitting cores of the optical waveguide; a light-receiving element connected to ends of light-receiving cores of the optical waveguide; and a CPU incorporating a program for recognizing the size of the tip of a pen and the size of the tip of an eraser in a region within the hollow input-use interior.
Abstract:
A resist film is formed on a conductor layer of a two-layered base material composed of a carrier layer and the conductor layer. Next, the resist film is exposed and developed, so that an etching resist pattern is formed. A region of the conductor layer that is exposed while not covered with the etching resist pattern is removed by etching. A conductor pattern is formed by removing the etching resist pattern. Then, an adhesive layer precursor is applied on an entire surface including an upper surface of the conductor pattern. The adhesive layer precursor is exposed and developed, so that an adhesive pattern is formed on the conductor pattern. After that, a base insulating layer is joined onto the conductor pattern with the adhesive pattern sandwiched therebetween. Finally, a carrier layer is separated from the conductor pattern, so that the FPC board is manufactured.
Abstract:
Collector portions, connection conductor portions and drawn-out conductor portions are formed on one surface of a base insulting layer of an FPC board. The collector portions, the connection conductor portions and the drawn-out conductor portions are covered with cover layers. The cover layers contain a resin composition. The resin composition has moisture permeability of not more than 150 g/(m2·24 h) in an environment at a temperature of 40° C. and with a relative humidity of 90%. The resin composition has a glass transition temperature of not less than 80° C.
Abstract:
There is provided an optical film pressure-sensitive adhesive composition capable of forming a pressure-sensitive adhesive layer that has reworkability such that optical films therewith can be easily separated from liquid crystal panels with no adhesive residue and also has satisfactory processability such that it can be processed without causing adhesive stain or dropout after it is formed on an optical film. The optical film pressure-sensitive adhesive composition includes 100 parts by weight of a (meth)acrylic polymer including, as monomer units, (a) 50 to 99.79% by weight of an alkyl (meth)acrylate monomer, (b) 0.01 to 0.45% by weight of a tertiary amino group-containing monomer, and (c) 0.1 to 3% by weight of a hydroxyl group-containing monomer; and 0.01 to 2 parts by weight of a crosslinking agent that is at least one selected from the group consisting of hexamethylene diisocyanate, hydrogenated xylylene diisocyanate, and isophorone diisocyanate, or a polyisocyanate compound derived therefrom.
Abstract:
A pressure-sensitive adhesive optical film of the present invention comprises an optical film; and a pressure-sensitive adhesive layer laminated on at least one side of the optical film, wherein the pressure-sensitive adhesive layer is formed from an acrylic pressure-sensitive adhesive comprising a (meth)acrylic polymer comprising 30 to 99.99% by weight of an alkyl (meth)acrylate monomer unit and 0.01 to 15% by weight of a functional group-containing monomer unit, and the (meth)acrylic polymer in the acrylic pressure-sensitive adhesive is crosslinked by electron beam irradiation. The pressure-sensitive adhesive optical film has a high level of reworkability, durability and workability.