公开(公告)号：US20110281202A1

公开(公告)日：2011-11-17

申请号：US13097155

申请日：2011-04-29

Applicant: Hiroyuki HANAZONO ,  Shinichi INOUE ,  Mineyoshi HASEGAWA ,  Keisuke OKUMURA ,  Hirofumi EBE

Inventor： Hiroyuki HANAZONO ,  Shinichi INOUE ,  Mineyoshi HASEGAWA ,  Keisuke OKUMURA ,  Hirofumi EBE

IPC: H01M8/04 ,  H05K1/00 ,  H05K3/10

CPC classification number: H01M8/0269 ,  H01M8/1011 ,  H01M8/2465 ,  Y02E60/523 ,  Y02P70/56 ,  Y10T29/49155

Abstract: An FPC board, electrode films and a fuel accommodating chamber are accommodated in a casing. In the FPC board, a plurality of collector portions are joined onto a base insulating layer with an adhesive pattern sandwiched therebetween. The base insulating layer is made of porous ePTFE, and is air-permeable. Openings are formed in the collector portions. The adhesive pattern has the same shape as the plurality of collector portions. The FPC board is sandwiched by an upper surface portion and a lower surface portion of the casing while being bent along a bend portion. The electrode films are arranged between the plurality of collector portions of the FPC board. The fuel accommodating chamber is provided between the FPC board and the lower surface portion so as to come in contact with the base insulating layer. A liquid fuel is supplied to the fuel accommodating chamber.

Abstract translation: FPC基板，电极膜和燃料容纳室容纳在壳体中。 在FPC基板中，将多个集电体部分接合到基底绝缘层上，其中夹有粘合剂图案。 基底绝缘层由多孔ePTFE制成，是透气的。 开口形成在收集器部分中。 粘合剂图案具有与多个集电体部分相同的形状。 FPC基板沿着弯曲部弯曲而夹在壳体的上表面部分和下表面部分之间。 电极膜配置在FPC基板的多个集电部之间。 燃料容纳室设置在FPC基板和下表面部分之间以与基底绝缘层接触。 液体燃料被供给到燃料容纳室。

公开(公告)号：US20110277321A1

公开(公告)日：2011-11-17

申请号：US13083097

申请日：2011-04-08

Applicant: Shinichi INOUE ,  Hiroyuki HANAZONO ,  Mineyoshi HASEGAWA ,  Keisuke OKUMURA

Inventor： Shinichi INOUE ,  Hiroyuki HANAZONO ,  Mineyoshi HASEGAWA ,  Keisuke OKUMURA

IPC: H05K3/10

CPC classification number: H05K3/20 ,  H05K1/0393 ,  Y10T29/49117 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A resist film is formed on a conductor layer of a two-layered base material composed of a carrier layer and the conductor layer. Next, the resist film is exposed and developed, so that an etching resist pattern is formed. A region of the conductor layer that is exposed while not covered with the etching resist pattern is removed by etching. A conductor pattern is formed by removing the etching resist pattern. Then, an adhesive layer precursor is applied on an entire surface including an upper surface of the conductor pattern. The adhesive layer precursor is exposed and developed, so that an adhesive pattern is formed on the conductor pattern. After that, a base insulating layer is joined onto the conductor pattern with the adhesive pattern sandwiched therebetween. Finally, a carrier layer is separated from the conductor pattern, so that the FPC board is manufactured.

Abstract translation: 在由载体层和导体层构成的两层基材的导体层上形成抗蚀剂膜。 接下来，将抗蚀剂膜曝光和显影，从而形成抗蚀剂图案。 通过蚀刻除去未被抗蚀剂图案覆盖的露出的导体层的区域。 通过去除抗蚀剂图案形成导体图案。 然后，在包括导体图案的上表面的整个表面上施加粘合剂层前体。 粘合剂层前体被曝光和显影，使得在导体图案上形成粘合剂图案。 之后，将基底绝缘层接合到导体图案上，其中夹有粘合剂图案。 最后，将载体层与导体图案分离，从而制造FPC基板。

公开(公告)号：US20110189508A1

公开(公告)日：2011-08-04

申请号：US13019460

申请日：2011-02-02

Applicant: Shinichi INOUE ,  Hiroyuki HANAZONO

Inventor： Shinichi INOUE ,  Hiroyuki HANAZONO

IPC: H01M14/00 ,  H01M8/00 ,  H05K1/00 ,  H05K1/09

CPC classification number: H01M8/00 ,  H01M14/00 ,  H05K1/00 ,  H05K1/09

Abstract: Collector portions, connection conductor portions and drawn-out conductor portions are formed on one surface of a base insulting layer of an FPC board. The collector portions, the connection conductor portions and the drawn-out conductor portions are covered with cover layers. The cover layers contain a resin composition. The resin composition has moisture permeability of not more than 150 g/(m2·24 h) in an environment at a temperature of 40° C. and with a relative humidity of 90%. The resin composition has a glass transition temperature of not less than 80° C.

Abstract translation: 集电体部分，连接导体部分和引出导体部分形成在FPC基板的基底绝缘层的一个表面上。 集电体部分，连接导体部分和引出导体部分被覆盖层覆盖。 覆盖层含有树脂组合物。 在40℃，相对湿度90％的环境下，树脂组合物的透湿度不超过150g /（m2·24h）。 树脂组合物的玻璃化转变温度不低于80℃

公开(公告)号：US20120061126A1

公开(公告)日：2012-03-15

申请号：US13221212

申请日：2011-08-30

Applicant: Shinichi INOUE ,  Hiroyuki HANAZONO ,  Hirofumi EBE

Inventor： Shinichi INOUE ,  Hiroyuki HANAZONO ,  Hirofumi EBE

IPC: H05K1/09 ,  H01B1/24 ,  H01B1/20 ,  H01B1/22 ,  B82Y99/00

CPC classification number: C08K5/3472 ,  C08G18/4219 ,  C08G18/8061 ,  C08G59/50 ,  C08G59/508 ,  C08K3/04 ,  C08K3/041 ,  C08K3/08 ,  C09D17/005 ,  C09D163/00 ,  C09D175/06 ,  H01M8/0206 ,  H01M8/0213 ,  H01M8/0221 ,  H01M8/0226 ,  H01M8/0247 ,  H01M8/1011 ,  H01M8/2475 ,  Y02E60/523 ,  C08L63/00

Abstract: A conductor layer is formed on one surface of a base insulating layer. The conductor layer is composed of a pair of rectangular collector portions and drawn-out conductor portions extending in long-sized shapes from the collector portions, respectively. Cover layers are formed on the base insulating layer to cover respective given portions of the conductor layer. A paste composition containing a compound represented by the formula (1) is used as a material for the cover layer.

Abstract translation: 在基底绝缘层的一个表面上形成导体层。 导体层由一对矩形集电体部分和从收集部分分别延伸成长形状的拉出导体部分组成。 覆盖层形成在基底绝缘层上以覆盖导体层的各个给定部分。 使用含有式（1）表示的化合物的糊剂组合物作为覆盖层的材料。

公开(公告)号：US20120024581A1

公开(公告)日：2012-02-02

申请号：US13094941

申请日：2011-04-27

Applicant: Mineyoshi HASEGAWA ,  Keisuke OKUMURA ,  Shinichi INOUE ,  Hiroyuki HANAZONO

Inventor： Mineyoshi HASEGAWA ,  Keisuke OKUMURA ,  Shinichi INOUE ,  Hiroyuki HANAZONO

IPC: H05K1/00 ,  H05K3/10

CPC classification number: H05K1/034 ,  H01B3/445 ,  H05K1/0393 ,  H05K3/06 ,  H05K3/108 ,  H05K3/28 ,  H05K2201/0116 ,  H05K2201/015

Abstract: A plurality of conductor traces are formed on a porous base insulating layer made of porous ePTFE. Each conductor trace has a laminated structure of a seed layer and a conductor layer. A cover insulating layer is formed on the base insulating layer to cover each conductor trace. The ePTFE used as the porous base insulating layer has continuous pores. An average pore size of the ePTFE is not less than 0.05 μm and not more than 1.0 μm.

Abstract translation: 在由多孔ePTFE制成的多孔基底绝缘层上形成多个导体迹线。 每个导体迹线具有种子层和导体层的层叠结构。 覆盖绝缘层形成在基底绝缘层上以覆盖每个导体迹线。 用作多孔基底绝缘层的ePTFE具有连续的孔。 ePTFE的平均孔径不小于0.05μm且不大于1.0μm。

公开(公告)号：US20120024574A1

公开(公告)日：2012-02-02

申请号：US13187830

申请日：2011-07-21

Applicant: Shinichi INOUE ,  Hiroyuki HANAZONO ,  Mineyoshi HASEGAWA

Inventor： Shinichi INOUE ,  Hiroyuki HANAZONO ,  Mineyoshi HASEGAWA

IPC: H05K1/00 ,  H05K3/10

CPC classification number: H05K3/108 ,  H05K1/0274 ,  H05K1/0393 ,  H05K3/28 ,  H05K2201/0116 ,  H05K2201/2054

Abstract: A printed circuit board includes a base insulating layer formed of a porous film. Conductor traces are formed on the base insulating layer formed of the porous film. A cover insulating layer is formed on the base insulating layer to cover the conductor traces. The porous film used as the base insulating layer has a reflectivity of not less than 50% for light of at least a part of wavelengths in a wavelength region from 400 nm to 800 nm.

Abstract translation: 印刷电路板包括由多孔膜形成的基底绝缘层。 在由多孔膜形成的基底绝缘层上形成导体迹线。 在绝缘绝缘层上形成覆盖导体迹线的覆盖绝缘层。 用作基底绝缘层的多孔膜对于在400nm至800nm的波长区域中的至少一部分波长的光具有不小于50％的反射率。

公开(公告)号：US20110076522A1

公开(公告)日：2011-03-31

申请号：US12884763

申请日：2010-09-17

Applicant: Hiroyuki HANAZONO ,  Shinichi INOUE

Inventor： Hiroyuki HANAZONO ,  Shinichi INOUE

IPC: H01M14/00 ,  H05K1/00 ,  H05K1/09

CPC classification number: H05K1/0326 ,  H01M8/006 ,  H01M8/0269 ,  H01M8/1011 ,  H01M8/1097 ,  H05K1/0393 ,  H05K2201/0141 ,  Y02E60/523

Abstract: An FPC board includes a base insulating layer. The base insulating layer is composed of a first insulating portion and a second insulating portion. A bend portion is provided in the first insulating portion. A conductor layer is formed on one surface of the base insulating layer. The conductor layer is composed of a collector portion and a drawn-out conductor portion. A cover layer is formed to cover the conductor layer. A liquid crystal polymer is used as a material for the base insulating layer.

Abstract translation: FPC基板包括基底绝缘层。 基极绝缘层由第一绝缘部和第二绝缘部构成。 弯曲部分设置在第一绝缘部分中。 在基底绝缘层的一个表面上形成导体层。 导体层由集电部和拉出导体部构成。 形成覆盖层以覆盖导体层。 使用液晶聚合物作为基底绝缘层的材料。

公开(公告)号：US20080145572A1

公开(公告)日：2008-06-19

申请号：US11955850

申请日：2007-12-13

Applicant: Kohei YANO ,  Akiko OGASAWARA ,  Tsuyoshi CHIBA ,  Yuusuke TOYAMA ,  Shinichi INOUE ,  Masayuki SATAKE

Inventor： Kohei YANO ,  Akiko OGASAWARA ,  Tsuyoshi CHIBA ,  Yuusuke TOYAMA ,  Shinichi INOUE ,  Masayuki SATAKE

IPC: C09K19/00

CPC classification number: G02B5/3016 ,  C09J7/29 ,  C09J7/385 ,  C09J2433/00 ,  C09K2019/0429 ,  C09K2019/0448 ,  Y10T428/1077 ,  Y10T428/2861 ,  Y10T428/2891

Abstract: A pressure-sensitive adhesive optical film of the present invention comprises: an optical film comprising a transparent base film and a discotic liquid crystal layer on one side of the transparent base film; and a pressure-sensitive adhesive layer that is provided on the discotic liquid crystal layer, wherein the pressure-sensitive adhesive layer is made from a pressure-sensitive adhesive containing an acrylic polymer comprising an alkyl(meth)acrylate (a1) and a ring structure-containing (meth)acrylate (a2) as monomer units and having a weight average molecular weight of 1,000,000 to 3,000,000, and a crosslinking agent. The pressure-sensitive adhesive optical film has durability and can be prevented from causing display unevenness in a peripheral portion of a display screen.

Abstract translation: 本发明的粘合型光学膜包括：透明基膜一侧的透明基膜和盘状液晶层的光学膜; 以及设置在盘状液晶层上的压敏粘合剂层，其中该压敏粘合剂层由含有包含（甲基）丙烯酸烷基酯（a1）的丙烯酸类聚合物和环状结构的压敏粘合剂制成 的（甲基）丙烯酸酯（a2）作为单体单元，重均分子量为1,000,000〜3,000,000，交联剂。 粘合型光学薄膜具有耐久性，可以防止在显示屏的周边部分产生显示不均匀。

公开(公告)号：US20120189874A1

公开(公告)日：2012-07-26

申请号：US13312353

申请日：2011-12-06

Applicant: Shinichi INOUE ,  Hirofumi EBE

Inventor： Shinichi INOUE ,  Hirofumi EBE

IPC: H01M2/00 ,  H05K1/02 ,  B05D3/02 ,  H01M2/02 ,  H05K3/10 ,  H05K1/00 ,  H05K1/09

CPC classification number: H01M8/0269 ,  C08K3/04 ,  C08K5/3472 ,  H01M8/0284 ,  H01M8/0286 ,  H01M8/1097 ,  H05K1/028 ,  H05K3/24 ,  H05K3/282 ,  H05K2201/0154 ,  H05K2201/0323 ,  H05K2201/056 ,  H05K2203/124 ,  Y02P70/56

Abstract: A conductor layer having a predetermined pattern is formed on a base insulating layer so that its second main surface opposes the base insulating layer. A barrier layer having higher corrosion resistance to acids than that of the conductor layer is formed on its first main surface and a side surface of the conductor layer while the first main surface and the side surface of the conductor layer and the barrier layer are covered with a conductive cover layer.

Abstract translation: 具有预定图案的导体层形成在基底绝缘层上，使得其第二主表面与基底绝缘层相对。 在导体层的第一主表面和侧表面上形成具有比导体层更高的耐酸性的阻挡层，同时，导体层和阻挡层的第一主表面和侧表面被覆盖 导电覆盖层。

公开(公告)号：US20090110924A1

公开(公告)日：2009-04-30

申请号：US12260210

申请日：2008-10-29

Applicant: Shinichi INOUE ,  Yuusuke TOYAMA ,  Mizue NAGATA ,  Toshitsugu HOSOKAWA

Inventor： Shinichi INOUE ,  Yuusuke TOYAMA ,  Mizue NAGATA ,  Toshitsugu HOSOKAWA

IPC: B32B33/00 ,  B32B38/00 ,  C08F20/10 ,  C08G16/00 ,  C08F20/28 ,  C08F26/02

CPC classification number: C09J133/066 ,  C09J7/22 ,  C09J7/38 ,  C09J2433/00 ,  Y10T428/2809

Abstract: A pressure-sensitive adhesive for an optical film of the present invention comprises a (meth)acrylic polymer comprising 50 to 99.99% by weight of alkyl (meth)acrylate monomer unit and 0.01 to 30% by weight of a photocrosslinkable monomer unit having an unsaturated double bond-containing polymerizable functional group and a photocrosslinkable moiety different from the functional group. A pressure-sensitive adhesive layer is formed from the pressure-sensitive adhesive on at least one side of an optical film, wherein the photocrosslinkable moiety of the (meth)acrylic polymer in the pressure-sensitive adhesive is crosslinked by active energy ray irradiation. The pressure-sensitive adhesive can form the pressure-sensitive adhesive layer with a high level of durability and preferable workability.

Abstract translation: 本发明的光学薄膜用粘合剂包含（甲基）丙烯酸系聚合物，其含有50〜99.99重量％的（甲基）丙烯酸烷基酯单体单元和0.01〜30重量％的具有不饱和键的光可交联单体单元 含有双键的可聚合官能团和与该官能团不同的光可交联部分。 在光学膜的至少一侧上由压敏粘合剂形成压敏粘合剂层，其中压敏粘合剂中的（甲基）丙烯酸类聚合物的光致交联部分通过活性能量射线照射而交联。 压敏粘合剂可以形成具有高水平的耐久性和优选的可加工性的压敏粘合剂层。