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    Encapsulated microelectromechanical structure
    11.
    发明授权
    Encapsulated microelectromechanical structure 有权

    公开(公告)号：US10450190B2

    公开(公告)日：2019-10-22

    申请号：US16106649

    申请日：2018-08-21

    Applicant: SiTime Corporation

    Inventor： Aaron Partridge ,  Markus Lutz ,  Pavan Gupta

    IPC: H01L21/46 ,  B81C1/00 ,  H01L41/113 ,  H01L23/051 ,  B81B7/00

    Abstract: In a MEMS device, an oxide layer is disposed between first and second semiconductor layers and MEMS resonator is formed within a cavity in the first semiconductor layer. A first electrically conductive feature functionally coupled to the MEMS resonator is exposed at a surface of the first semiconductor layer, and an insulating region is exposed at the surface of the first semiconductor layer adjacent the first electrically conductive feature. A semiconductor cover layer is bonded to the surface of the first semiconductor layer to hermetically seal the MEMS resonator within the cavity. A second electrically conductive feature extends through the semiconductor cover layer to contact the first electrically conductive feature, and an isolation trench extends through the semiconductor cover layer to the insulating region to electrically isolate a conductive path formed by the first and second electrically conductive features.

    Low-profile stacked-die MEMS resonator system
    12.
    发明授权
    Low-profile stacked-die MEMS resonator system 有权

    公开(公告)号：US10287162B2

    公开(公告)日：2019-05-14

    申请号：US15805031

    申请日：2017-11-06

    Applicant: SiTime Corporation

    Inventor： Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

    IPC: H01L23/34 ,  B81B7/00 ,  B81C1/00 ,  H01L23/498 ,  H01L23/31

    Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

    STACKED-DIE MEMS RESONATOR
    18.
    发明申请
    STACKED-DIE MEMS RESONATOR 有权

    公开(公告)号：US20250019229A1

    公开(公告)日：2025-01-16

    申请号：US18641815

    申请日：2024-04-22

    Applicant: SiTime Corporation

    Inventor： Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

    IPC: B81B7/00 ,  B81C1/00 ,  H01L23/31 ,  H01L23/34 ,  H01L23/498 ,  H10N30/30

    Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

    Package Structure For Micromechanical Resonator
    20.
    发明申请
    Package Structure For Micromechanical Resonator 审中-公开

    公开(公告)号：US20190292043A1

    公开(公告)日：2019-09-26

    申请号：US16372745

    申请日：2019-04-02

    Applicant: SiTime Corporation

    Inventor： Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

    IPC: B81B7/00 ,  H01L23/498 ,  H01L23/34 ,  B81C1/00

    Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

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