公开(公告)号：US10306756B2

公开(公告)日：2019-05-28

申请号：US15878398

申请日：2018-01-23

Applicant: Sierra Circuits, Inc.

Inventor： Kenneth S. Bahl ,  Konstantine Karavakis

IPC: H05K1/09 ,  H05K3/38 ,  H05K1/03 ,  H05K1/02 ,  H05K3/42 ,  H05K3/46 ,  H05K1/11 ,  H05K3/18

Abstract: A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.

公开(公告)号：US09706667B2

公开(公告)日：2017-07-11

申请号：US15001140

申请日：2016-01-19

Applicant: SIERRA CIRCUITS, INC.

Inventor： Konstantine Karavakis ,  Kenneth S. Bahl

IPC: H05K1/09 ,  H05K3/38 ,  H05K3/42

CPC classification number: H05K3/387 ,  H05K3/427 ,  H05K2201/0221 ,  H05K2201/0236 ,  H05K2203/0709 ,  Y10T29/49167

Abstract: A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material. A layer of catalytic adhesive coats walls within the hole. The patterned metal layer is placed over the catalytic adhesive within the hole.

公开(公告)号：US09706650B1

公开(公告)日：2017-07-11

申请号：US15240133

申请日：2016-08-18

Applicant: Sierra Circuits, Inc.

Inventor： Kenneth S. Bahl ,  Konstantine Karavakis

IPC: H05K1/03 ,  H05K3/18 ,  H05K1/02 ,  H05K1/09 ,  H05K3/42 ,  H05K3/46 ,  H05K1/11 ,  H05K3/38

CPC classification number: H05K1/0313 ,  H05K1/0296 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/09 ,  H05K1/115 ,  H05K3/18 ,  H05K3/181 ,  H05K3/182 ,  H05K3/387 ,  H05K3/422 ,  H05K3/429 ,  H05K3/4632 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0242 ,  H05K2201/0376 ,  H05K2203/0716

Abstract: A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.