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公开(公告)号:US11658047B2
公开(公告)日:2023-05-23
申请号:US16387792
申请日:2019-04-18
Applicant: Sinfonia Technology Co., Ltd.
Inventor: Atsushi Suzuki , Yasushi Taniyama , Tomoya Mizutani
IPC: H01L21/67 , H01L21/677 , B05B1/30 , B05B1/00
CPC classification number: H01L21/67017 , B05B1/005 , B05B1/3013 , H01L21/67766 , H01L21/67778
Abstract: There is provided an exhaust nozzle unit capable of discharging a gas atmosphere in a substrate storage container having a loading/unloading opening from the container to an outside of the container through a port formed on a bottom surface of the container. The exhausted nozzle includes a nozzle capable of switching the port from a closed state to an open state by pressing a valve of the port; and a housing configured to hold the nozzle so as to be movable up and down between a use posture in which the port is in the open state and a standby posture in which the port is in the closed state.
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公开(公告)号:US11424145B2
公开(公告)日:2022-08-23
申请号:US16845555
申请日:2020-04-10
Applicant: SINFONIA TECHNOLOGY CO., LTD.
Inventor: Toshihiro Kawai , Takashi Shigeta , Munekazu Komiya , Yasushi Taniyama
IPC: H01L21/67 , F24F13/28 , F24F7/06 , B01D53/04 , F24F7/00 , B65G49/07 , H01L21/677 , F24F3/167 , F24F7/08 , H01L21/673 , B01D53/40 , B01D53/42 , C12M1/12 , F24F6/00 , H01L21/687
Abstract: To provide a transfer chamber capable of replacing a chemical filter without affecting an internal atmosphere, and shortening or eliminating stop time of a transfer process of a wafer (W) associated with replacement of the chemical filter.
The transfer chamber transfers the wafer (W) to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL1) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) provided in the midstream of the circulation path (CL1), and a connecting and disconnecting means (8) which switches connection and disconnection of the chemical filter unit (7) to and from the circulation path (CL1).-
公开(公告)号:US10586723B2
公开(公告)日:2020-03-10
申请号:US15750379
申请日:2016-07-12
Applicant: SINFONIA TECHNOLOGY CO., LTD.
Inventor: Toshihiro Kawai , Yasushi Taniyama , Munekazu Komiya , Takashi Shigeta
IPC: H01L21/677 , H01L21/67 , H01L21/673
Abstract: A door opening/closing system includes: a base as part of a wall isolating a conveyance space from an external space; an opening portion provided in the base; a door configured to open/close the opening portion; a first seal member which seals a gap between the base and a container; a second seal member which seals a gap between the base and the door; a sealed space constituted by the base, the first and second seal members, a lid member, and the door when the container state of contact with the opening portion with the first seal member therebetween; a first gas injection unit which injects gas into the sealed space; and a second gas discharge unit which evacuates the sealed space. The door opening/closing system prevents entry of atmospheric air into a front-opening unified pod and an equipment front end module when placed in communication.
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公开(公告)号:US11851289B2
公开(公告)日:2023-12-26
申请号:US17788647
申请日:2020-09-23
Applicant: Sinfonia Technology Co., Ltd.
Inventor: Hiroaki Nakamura , Toshihiro Kawai , Kosuke Sugiura , Gengoro Ogura , Yasushi Taniyama
IPC: H01L21/677 , B65G47/90 , H01L21/67 , H01L21/687
CPC classification number: B65G47/905 , H01L21/677 , H01L21/67259 , H01L21/68707
Abstract: A conveyance system discriminates the front and back of a frame wafer without human intervention. A frame is partially formed asymmetrically with respect to a predetermined center line when viewed in a direction orthogonal to a surface of a wafer. The conveyance system includes a hand configured to hold the frame so that the frame extends in a predetermined virtual plane, a first sensor configured to detect a portion of the frame held on the hand and located in a predetermined first region in the virtual plane, a second sensor configured to detect a portion of the frame held on the hand and located in a second region opposite to the first region across the center line, and a controller configured to determine the front and back of the frame wafer based on a detection result obtained by the first sensor and a detection result obtained by the second sensor.
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公开(公告)号:US11710652B2
公开(公告)日:2023-07-25
申请号:US17761816
申请日:2020-09-23
Applicant: Sinfonia Technology Co., Ltd.
Inventor: Toshihiro Kawai , Hiroaki Nakamura , Gengoro Ogura , Kosuke Sugiura , Yasushi Taniyama
IPC: H01L21/677 , B65G47/248 , H01L21/683
CPC classification number: H01L21/67781 , B65G47/248 , H01L21/67766 , H01L21/67796 , H01L21/6838
Abstract: A transport system for transporting a plurality of objects between a storage container configured to store the plurality of objects and a processing apparatus configured to collectively process the plurality of objects held on a tray, including a mounting part on which the storage container is mounted, a stage on which the plurality of objects are mounted, a tray support part configured to support the tray, a first transport device configured to transport the plurality of objects between the storage container mounted on the mounting part and the stage, and a second transport device configured to transport the plurality of objects between the stage and the tray supported by the tray support part.
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公开(公告)号:US20220037184A1
公开(公告)日:2022-02-03
申请号:US17297509
申请日:2019-11-25
Applicant: Sinfonia Technology Co., Ltd.
Inventor: Yasushi Taniyama , Toshihiro Kawai
IPC: H01L21/677 , H01L21/687 , B65G1/04
Abstract: A wafer stocker capable of further improving an environment around wafers is provided. The wafer stocker includes a housing, a loading device provided on a front surface of the housing, a wafer cassette shelf arranged in the housing, a wafer transfer robot configured to move the wafers from a transfer container mounted on the loading device to a wafer cassette in the wafer cassette shelf, a wafer cassette delivery device configured to move the wafer cassette in the wafer cassette shelf to a stage having a different height, and a fan filter unit configured to generate a laminar flow in a wafer transfer space and in a wafer cassette transfer space.
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17.
公开(公告)号:US20180315632A1
公开(公告)日:2018-11-01
申请号:US15961395
申请日:2018-04-24
Applicant: SINFONIA TECHNOLOGY CO., LTD.
Inventor: Yasushi Taniyama , Toshimitsu Morihana
IPC: H01L21/673 , H01L21/677
Abstract: A purging nozzle unit of a gas supply device according to the present invention including: a housing that is capable of passing a predetermined gas so as to replace the internal atmosphere of a FOUP with the predetermined gas; a nozzle coming into intimate contact with the proximity of a port that is provided on one face of the FOUP, the nozzle being pressed to thereby open the port; an operation adjustment space configured to increase or decrease so as to operate the nozzle between a use posture in which the predetermined gas can be supplied into the target container via the port and a standby posture in which the predetermined gas cannot be supplied into the target container via the port; and a gas introducing part configured to export or import compression air relative to the operation adjustment space to thereby control an operation of the nozzle.
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公开(公告)号:US20180047602A1
公开(公告)日:2018-02-15
申请号:US15554152
申请日:2016-02-05
Applicant: SINFONIA TECHNOLOGY CO., LTD.
Inventor: Toshihiro Kawai , Takashi Shigeta , Munekazu Komiya , Yasushi Taniyama
IPC: H01L21/677 , H01L21/67 , H01L21/673
Abstract: The transfer chamber transfers a wafer (W) as a transferred object to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) as a chemical filter provided in the midstream of the circulation path (CL), a humidity detector (HG2) as a humidity detection means which detects internal humidity, a gas supply means (NS) which supplies gas to the inside of the transfer chamber (1), and a moisture supply means (HS) which supplies moisture content to the inside of the transfer chamber (1). The moisture supply means (HS) is made to operate in accordance with a humidity detection value by the humidity detection means.
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公开(公告)号:US20180040493A1
公开(公告)日:2018-02-08
申请号:US15554135
申请日:2016-02-05
Applicant: SINFONIA TECHNOLOGY CO., LTD.
Inventor: Toshihiro Kawai , Takashi Shigeta , Munekazu Komiya , Yasushi Taniyama
Abstract: To provide a transfer chamber capable of replacing a chemical filter without affecting an internal atmosphere, and shortening or eliminating stop time of a transfer process of a wafer (W) associated with replacement of the chemical filter. The transfer chamber transfers the wafer (W) to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL1) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) provided in the midstream of the circulation path (CL1), and a connecting and disconnecting means (8) which switches connection and disconnection of the chemical filter unit (7) to and from the circulation path (CL1).
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公开(公告)号:US09704727B2
公开(公告)日:2017-07-11
申请号:US14569293
申请日:2014-12-12
Applicant: SINFONIA TECHNOLOGY CO., LTD.
Inventor: Mikio Segawa , Yasushi Taniyama , Mitsuo Natsume , Atsushi Suzuki , Toshihiro Kawai , Kunihiko Sato
IPC: H01L21/677 , H01L21/67
CPC classification number: H01L21/67017 , H01L21/67115 , H01L21/67766 , H01L21/67772 , H01L21/67778
Abstract: An EFEM includes a housing 3 that constitutes a wafer transport chamber 9 that is substantially closed by connecting load ports 4 to an opening 31a provided on a wall 31, and connecting a processing apparatus 6; a wafer transport apparatus 2, and transports a wafer between the processing apparatus 6 and the FOUPs 7 mounted on the load ports 4; a gas delivery port 11; a gas suction port 12; a gas feedback path 10; and a FFU 13 that includes a filter 13b that is provided in the gas delivery port 11, and eliminates particles contained in the delivered gas, wherein the gas in the wafer transport chamber 9 is circulated by generating a downward gasflow in the wafer transport chamber 9 and feeding back the gas through the gas feedback path 10.
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