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公开(公告)号：US07981728B2
公开(公告)日：2011-07-19
申请号：US12382293
申请日：2009-03-12
申请人： Soon-Jin Cho
发明人： Soon-Jin Cho
IPC分类号： H01L21/00
CPC分类号： H05K3/4007 , H01L2224/16225 , H05K1/0206 , H05K3/06 , H05K3/4644 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/09563 , H05K2201/09781 , H05K2203/1536 , Y10T29/49124 , Y10T29/49147 , Y10T29/49165
摘要： A coreless substrate having a plurality of function pads, etched from a metal sheet and having a protruded shape; an insulating layer, the insulating layer being formed on one side of the function pads, a circuit corresponding to a pattern being formed on the insulating layer, a via hole being formed on the insulating layer to electrically connect the function pads and the circuit; and a solder resist, being formed on the insulating layer to protect the surface of the insulating layer. The coreless substrate has a signal delivery characteristic that is improved by eliminating the inner via hole.
摘要翻译： 一种无芯基板，具有从金属板蚀刻并具有突出形状的多个功能垫; 绝缘层，所述绝缘层形成在所述功能焊盘的一侧上，对应于在所述绝缘层上形成的图案的电路，形成在所述绝缘层上以电连接所述功能焊盘和所述电路的通孔; 和阻焊层，形成在绝缘层上以保护绝缘层的表面。 无芯基板具有通过消除内通孔而改善的信号传递特性。
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公开(公告)号：US08074352B2
公开(公告)日：2011-12-13
申请号：US12213365
申请日：2008-06-18
申请人： Dong-Jin Park , Seung-Hyun Jung , Seung-Chul Kim , Soon-Jin Cho
发明人： Dong-Jin Park , Seung-Hyun Jung , Seung-Chul Kim , Soon-Jin Cho
CPC分类号： H05K3/107 , H05K3/0035 , H05K3/0038 , H05K3/045 , H05K3/421 , H05K3/427 , H05K2201/0394 , H05K2201/09563 , H05K2203/0577 , H05K2203/0723 , H05K2203/1152 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method of manufacturing a printed circuit board is disclosed. The method may include: sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the second cover layer, the first cover layer, and the copper clad laminate; stacking a seed layer over the intaglio groove and the second cover layer; removing a portion of the seed layer stacked over the second cover layer, by stripping the second cover layer; forming a plating layer, by plating an inside of the intaglio groove; stripping the first cover layer; and removing the copper foil exposed by the stripping of the first cover layer.
摘要翻译： 公开了一种制造印刷电路板的方法。 该方法可以包括：在铜箔上顺序层叠耐酸性第一覆盖层和耐碱性第二覆盖层，对于包含层叠在绝缘层一侧的铜箔的覆铜层压板， 通过去除第二覆盖层，第一覆盖层和覆铜层压板的部分来形成凹版凹槽; 将种子层堆叠在凹版凹槽和第二覆盖层上; 通过剥离所述第二覆盖层去除层叠在所述第二覆盖层上的所述种子层的一部分; 通过电镀凹版凹槽的内部形成镀层; 剥离第一覆盖层; 以及去除通过剥离第一覆盖层而暴露的铜箔。
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公开(公告)号：US20070084630A1
公开(公告)日：2007-04-19
申请号：US11542175
申请日：2006-10-04
申请人： Soon-Jin Cho
发明人： Soon-Jin Cho
CPC分类号： H05K3/4007 , H01L2224/16225 , H05K1/0206 , H05K3/06 , H05K3/4644 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/09563 , H05K2201/09781 , H05K2203/1536 , Y10T29/49124 , Y10T29/49147 , Y10T29/49165
摘要： The present invention discloses a method for manufacturing a coreless substrate. The method comprises the steps of (a) forming an insulating layer on one side of a metal sheet; (b) forming a via hole on the insulating layer for electrical connection between the metal sheet and the other side; and (c) forming a plurality of protruded function pads by etching the metal sheet. The coreless substrate and manufacturing method thereof in accordance with the present invention have the signal delivery characteristic that is improved by eliminating the inner via hole.
摘要翻译： 本发明公开了一种无芯基板的制造方法。 该方法包括以下步骤：（a）在金属片的一侧上形成绝缘层; （b）在绝缘层上形成用于金属片和另一侧之间的电连接的通孔; 和（c）通过蚀刻金属板形成多个突出的功能垫。 根据本发明的无芯基板及其制造方法具有通过消除内通孔而提高的信号传递特性。
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公开(公告)号：US20090133253A1
公开(公告)日：2009-05-28
申请号：US12213365
申请日：2008-06-18
申请人： Dong-Jin Park , Seung-Hyun Jung , Seung-Chul Kim , Soon-Jin Cho
发明人： Dong-Jin Park , Seung-Hyun Jung , Seung-Chul Kim , Soon-Jin Cho
CPC分类号： H05K3/107 , H05K3/0035 , H05K3/0038 , H05K3/045 , H05K3/421 , H05K3/427 , H05K2201/0394 , H05K2201/09563 , H05K2203/0577 , H05K2203/0723 , H05K2203/1152 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method of manufacturing a printed circuit board is disclosed. The method may include: sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the second cover layer, the first cover layer, and the copper clad laminate; stacking a seed layer over the intaglio groove and the second cover layer; removing a portion of the seed layer stacked over the second cover layer, by stripping the second cover layer; forming a plating layer, by plating an inside of the intaglio groove; stripping the first cover layer; and removing the copper foil exposed by the stripping of the first cover layer.
摘要翻译： 公开了一种制造印刷电路板的方法。 该方法可以包括：在铜箔上顺序层叠耐酸性第一覆盖层和耐碱性第二覆盖层，对于包含层叠在绝缘层一侧的铜箔的覆铜层压板， 通过去除第二覆盖层，第一覆盖层和覆铜层压板的部分来形成凹版凹槽; 将种子层堆叠在凹版凹槽和第二覆盖层上; 通过剥离所述第二覆盖层去除层叠在所述第二覆盖层上的所述种子层的一部分; 通过电镀凹版凹槽的内部形成镀层; 剥离第一覆盖层; 以及去除通过剥离第一覆盖层而暴露的铜箔。
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公开(公告)号：US07517730B2
公开(公告)日：2009-04-14
申请号：US11542175
申请日：2006-10-04
申请人： Soon-Jin Cho
发明人： Soon-Jin Cho
IPC分类号： H01L21/00
CPC分类号： H05K3/4007 , H01L2224/16225 , H05K1/0206 , H05K3/06 , H05K3/4644 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/09563 , H05K2201/09781 , H05K2203/1536 , Y10T29/49124 , Y10T29/49147 , Y10T29/49165
摘要： The present invention discloses a method for manufacturing a coreless substrate. The method comprises the steps of (a) forming an insulating layer on one side of a metal sheet; (b) forming a via hole on the insulating layer for electrical connection between the metal sheet and the other side; and (c) forming a plurality of protruded function pads by etching the metal sheet. The coreless substrate and manufacturing method thereof in accordance with the present invention have the signal delivery characteristic that is improved by eliminating the inner via hole.
摘要翻译： 本发明公开了一种无芯基板的制造方法。 该方法包括以下步骤：（a）在金属片的一侧上形成绝缘层; （b）在绝缘层上形成用于金属片和另一侧之间的电连接的通孔; 和（c）通过蚀刻金属板形成多个突出的功能垫。 根据本发明的无芯基板及其制造方法具有通过消除内通孔而提高的信号传递特性。
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