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公开(公告)号：US20140054768A1
公开(公告)日：2014-02-27
申请号：US13960228
申请日：2013-08-06
Applicant: TDK CORPORATION
Inventor： Kenichi YOSHIDA , Makoto ORIKASA , Hideyuki SEIKE , Yuhei HORIKAWA , Hisayuki ABE
IPC: H01L23/00
CPC classification number: H01L24/13 , H01L24/03 , H01L24/05 , H01L24/11 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/0347 , H01L2224/0401 , H01L2224/05022 , H01L2224/05572 , H01L2224/05655 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/13005 , H01L2224/13006 , H01L2224/13023 , H01L2224/13111 , H01L2924/00014 , H01L2924/00012 , H01L2924/207 , H01L2224/05552
Abstract: The present invention relates to a terminal structure comprising: a base material 10; an external electrode 20 formed on the base material; an insulating coating layer 30 formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under-bump metal layer 70 filling the opening and covering part of the insulating coating layer; and a dome-shaped bump 85 covering the under-bump metal layer, wherein in a cross section along a lamination direction, a height Hbm at which the bump has a maximum diameter (Lbm) is lower than a maximum height Hu of the under-bump metal layer.
Abstract translation: 本发明涉及一种端子结构，包括：基材10; 形成在基材上的外部电极20; 绝缘涂层30，形成在基材和电极上，并具有露出电极的至少一部分的开口; 填充绝缘涂层的开口和覆盖部分的凸块下金属层70; 以及覆盖凸块下金属层的圆顶状凸起85，其中在沿着层叠方向的截面中，所述凸块具有最大直径（Lbm）的高度Hbm低于所述凸块下凸块的最大高度Hu， 凸块金属层。
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公开(公告)号：US20210360840A1
公开(公告)日：2021-11-18
申请号：US16876882
申请日：2020-05-18
Applicant: TDK CORPORATION
Inventor： Takashi YAMADA , Atsushi SATO , Makoto ORIKASA , Hideharu MORO
IPC: H05K9/00
Abstract: A noise suppression sheet comprises a non-magnetic metal layer, a plurality of metal magnetic layers, and a plurality of insulating layers, and the metal magnetic layer and the insulating layer are alternately laminated on the non-magnetic metal layer. The noise suppression sheet can absorb and suppress noise generated from a circuit or the like in an electronic component by being mounted on the electronic component or the like. In the noise suppression sheet, noise is absorbed by each of the metal magnetic layers. Noise that is transmitted without being absorbed by the metal magnetic layer can be reflected by the non-magnetic metal layer and can be absorbed again by the metal magnetic layer, and hence the noise suppression sheet can suppress noise effectively.
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13.发明申请公开(公告)号：US20210087692A1
公开(公告)日：2021-03-25
申请号：US17111040
申请日：2020-12-03
Applicant: TDK CORPORATION
Inventor： Makoto ORIKASA , Yuhei HORIKAWA , Yoshihiro KANBAYASHI , Hisayuki ABE
IPC: C23C18/16 , C23C18/32 , C23C18/38 , B32B27/08 , B32B27/36 , B32B15/09 , B32B15/20 , B32B3/30 , H01L23/52 , H01L27/15 , B32B27/18 , C23C18/30
Abstract: A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.
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公开(公告)号：US20190032221A1
公开(公告)日：2019-01-31
申请号：US16046422
申请日：2018-07-26
Applicant: TDK CORPORATION , ACHILLES CORPORATION
Inventor： Makoto ORIKASA , Yuhei HORIKAWA , Yoshihiro KANBAYASHI , Hisayuki ABE , Hiroki ASHIZAWA , Miho MORI , Misaki TAMURA
Abstract: A sheet material includes a resin layer containing a binder and polypyrrole particles, an electroless plating film provided on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a transparent base material provided on the side of the other main surface of the resin layer.
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15.发明申请TERMINAL STRUCTURE, AND SEMICONDUCTOR ELEMENT AND MODULE SUBSTRATE COMPRISING THE SAME 有权端子结构和包含其的半导体元件和模块基板公开(公告)号：US20140054770A1
公开(公告)日：2014-02-27
申请号：US13960330
申请日：2013-08-06
Applicant: TDK CORPORATION
Inventor： Kenichi YOSHIDA , Makoto ORIKASA , Hideyuki SEIKE , Yuhei HORIKAWA , Hisayuki ABE
IPC: H01L23/00
CPC classification number: H01L24/13 , H01L24/03 , H01L24/05 , H01L24/11 , H01L2224/03462 , H01L2224/0347 , H01L2224/0401 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05571 , H01L2224/05655 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/13006 , H01L2224/13017 , H01L2224/13022 , H01L2224/13076 , H01L2224/13111 , H01L2924/00014 , H01L2224/05572 , H01L2924/00015 , H01L2924/00012 , H01L2224/05552
Abstract: A preferred terminal structure comprises a base material; an electrode formed on the base material; an insulating covering layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under bump metal layer containing Ni, formed in a region in the opening on the electrode so that an upper surface of the metal layer is at a position lower than an upper surface of the insulating covering layer in a peripheral edge portion of the opening; and a dome-shaped bump containing Sn and Ti, formed in a region in the opening on the under bump metal layer, wherein an end portion of a boundary between the under bump metal layer and the bump is in contact with an inner wall of the opening portion in the insulating covering layer.
Abstract translation: 优选的端子结构包括基材; 形成在基材上的电极; 绝缘覆盖层，形成在所述基底材料上和所述电极上，并且具有暴露所述电极的至少一部分的开口; 在所述电极的开口部的区域形成含有Ni的下凸块金属层，使得所述金属层的上表面位于比所述开口的周缘部的所述绝缘覆盖层的上表面低的位置; 以及形成在下凸块金属层的开口部的区域中的包含Sn和Ti的圆顶状的凸部，其中，下凸块状金属层与凸块之间的边界的端部与内凸块 绝缘覆盖层的开口部。
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Patent Agency Ranking
公开(公告)号：US20140054767A1
公开(公告)日：2014-02-27
申请号：US13960173
申请日：2013-08-06
Applicant: TDK CORPORATION
Inventor： Kenichi YOSHIDA , Makoto ORIKASA , Hideyuki SEIKE , Yuhei HORIKAWA , Hisayuki ABE
IPC: H01L23/00
CPC classification number: H01L24/13 , H01L24/03 , H01L24/05 , H01L24/11 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/0347 , H01L2224/0401 , H01L2224/05022 , H01L2224/05572 , H01L2224/05655 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/13005 , H01L2224/13006 , H01L2224/13023 , H01L2224/13111 , H01L2924/00014 , H01L2224/05552
Abstract: The present invention relates to a terminal structure comprising; a base material 10; an external electrode 20 formed on the base material; an insulating coating layer 30 formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under-bump metal layer 70 filling the opening and covering part of the insulating coating layer; and a dome-shaped bump 85 covering the under-bump metal layer, wherein in a cross section along a lamination direction, the under-bump metal layer has a convex shape toward the bump, and the thickness Tu0 of the under-bump metal layer at a center of the opening is equal to or greater than the thickness Tu1 of the under-bump metal layer at an end portion of the opening.
Abstract translation: 本发明涉及一种终端结构，包括： 基材10; 形成在基材上的外部电极20; 绝缘涂层30，形成在基材和电极上，并具有露出电极的至少一部分的开口; 填充绝缘涂层的开口和覆盖部分的凸块下金属层70; 以及覆盖凸块下金属层的圆顶状凸起85，其中沿着层叠方向的截面中，凸块下金属层朝向凸块呈凸形，凸块下金属层的厚度Tu0 在开口的中心处等于或大于开口端部处的凸块下金属层的厚度Tu1。
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公开(公告)号：US20130126208A1
公开(公告)日：2013-05-23
申请号：US13678033
申请日：2012-11-15
Applicant: TDK CORPORATION
Inventor： Kenichi YOSHIDA , Yuhei HORIKAWA , Makoto ORIKASA , Hideyuki SEIKE
IPC: H01B1/02
CPC classification number: H01B1/02 , H01L2224/85444
Abstract: A coating is provided to a conductor, and has a layered structure of a palladium layer. The palladium layer is amorphous and contains phosphorus in a concentration ranging from 7.3% by mass to 11.0% by mass.
Abstract translation: 向导体提供涂层，并且具有钯层的层状结构。 钯层为无定形，含有浓度为7.3质量％〜11.0质量％的磷。
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公开(公告)号：US20220059938A1
公开(公告)日：2022-02-24
申请号：US17403575
申请日：2021-08-16
Applicant: TDK Corporation
Inventor： Masaki MATSUSHIMA , Makoto ORIKASA , Ryota UCHIYAMA , Junpei HAYAMA
Abstract: Disclosed herein is a coil component that includes a substrate, a coil pattern formed on one surface of the substrate, and a magnetic layer comprising a composite material obtained by dispersing magnetic particles in resin and formed on the one surface of the substrate so as to cover the coil pattern. The coil pattern has a flat shape in which a thickness thereof is smaller than a radial width. Each of the magnetic particles has a flat shape in which a thickness thereof in a direction perpendicular to the one surface of the substrate is smaller than a diameter in a direction parallel to the one surface of the substrate. Some of the magnetic particles exist within a height range of the coil pattern with respect to the one surface of the substrate.
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19.发明申请公开(公告)号：US20200381266A1
公开(公告)日：2020-12-03
申请号：US16997092
申请日：2020-08-19
Applicant: TDK CORPORATION
Inventor： Takashi DAITOKU , Susumu TANIGUCHI , Akiko SEKI , Atsushi SATO , Yuhei HORIKAWA , Makoto ORIKASA , Hisayuki ABE
Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.
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公开(公告)号：US20200321499A1
公开(公告)日：2020-10-08
申请号：US16794445
申请日：2020-02-19
Applicant: TDK CORPORATION
Inventor： Takasi SATOU , Susumu TANIGUCHI , Hideyuki KOBAYASHI , Makoto ORIKASA
Abstract: A bonding structure is a bonding structure which bonds a light emitting element and a substrate and includes a first electrode formed on the light emitting element, a second electrode formed on the substrate, and a bonding layer which bonds the first electrode and the second electrode, and the bonding layer contains a first bonding metal component and a second bonding metal component different from the first bonding metal component.
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