公开(公告)号：US20200066431A1

公开(公告)日：2020-02-27

申请号：US16538465

申请日：2019-08-12

Applicant: TDK CORPORATION

Inventor： Yuto SHIGA ,  Hajime KATO ,  Kazuya TOBITA ,  Youichi KAZUTA ,  Noriaki HAMACHI ,  Makoto YOSHINO

IPC: H01F17/00 ,  H01F27/29 ,  H01F41/10 ,  H01F41/04 ,  H01F27/30

Abstract: An electronic component includes an element provided with a recess, a mounting conductor disposed in the recess, and an internal conductor disposed inside the element and connected to the mounting conductor. A first region includes a first surface. A second region includes a third surface connecting a second surface and the first surface. The second surface and the third surface overlap with the first surface as viewed in a direction in which the first surface and the second surface face each other. The internal conductor is connected to the second region away from a connection portion between the first surface and the third surface.

公开(公告)号：US20190280667A1

公开(公告)日：2019-09-12

申请号：US16334991

申请日：2017-08-21

Applicant: TDK CORPORATION

Inventor： Akihiko OIDE ,  Naoki UCHIDA ,  Yoji TOZAWA ,  Makoto YOSHINO ,  Seiichi NAKAGAWA ,  Shinichi SATO ,  Hiroshi ONO ,  Takashi ENDO

IPC: H03H7/01 ,  H03H1/00

Abstract: A multilayer LC filter array includes an element body of a rectangular parallelepiped shape, a first filter including a first inductor and a first capacitor that are disposed in the element body, a second filter including a second inductor and a second capacitor that are disposed in the element body, a first input terminal electrode and a first output terminal electrode that are connected to the first inductor, a second input terminal electrode and a second output terminal electrode that are connected to the second inductor, and a ground terminal electrode that is connected to the first capacitor and the second capacitor. The element body includes first and second principal surfaces opposing each other. The ground terminal electrode is disposed at a center of the first principal surface. The first input terminal electrode, the first output terminal electrode, the second input terminal electrode, and the second output terminal electrode are disposed at respective different corner portions of the element body when viewed from a direction orthogonal to the first principal surface.

公开(公告)号：US20180337001A1

公开(公告)日：2018-11-22

申请号：US15821998

申请日：2017-11-24

Applicant: TDK CORPORATION

Inventor： Yoji TOZAWA ,  Masashi SHIMOYASU ,  Makoto YOSHINO ,  Takuo ABE ,  Akihiko OIDE ,  Tsutomu ONO ,  Shinichi SATO ,  Makoto MORITA ,  Shinichi SATO ,  Hidekazu SATO ,  Masashi KITAZAKI ,  Naoki UCHIDA ,  Masahiro KATO

IPC: H01G4/232 ,  H01G4/252 ,  H01G13/00 ,  H05K1/03 ,  H01B1/22 ,  H01G4/30 ,  H01F17/00 ,  H03H7/42

CPC classification number: H01G4/2325 ,  H01B1/22 ,  H01F17/0013 ,  H01F2017/0093 ,  H01G4/12 ,  H01G4/252 ,  H01G4/30 ,  H01G13/006 ,  H03H7/427 ,  H03H2001/0085 ,  H05K1/0306

Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.

公开(公告)号：US20240128006A1

公开(公告)日：2024-04-18

申请号：US18484833

申请日：2023-10-11

Applicant: TDK CORPORATION

Inventor： Yuya OSHIMA ,  Hiroshi ONO ,  Ryosuke HORIE ,  Daiki YAMADA ,  Yuki AKASAKA ,  Shuichi WATANABE ,  Satoshi TAKASU ,  Makoto YOSHINO ,  Takahiro YATA

IPC: H01F17/00

CPC classification number: H01F17/0013

Abstract: A laminated coil component includes: an element body having a first surface and a second surface facing each other in a first direction; a coil unit formed by laminating a plurality of coil conductors in a second direction orthogonal to the first direction inside the element body; a first lead-out conductor; and a second lead-out conductor. A first coil conductor adjacent to the first lead-out conductor in the second direction includes a first side portion extending along the first surface, on a first surface side. A second coil conductor adjacent to the second lead-out conductor in the second direction includes a second side portion extending along the second surface, on a second surface side. The first side portion has a larger line width than other side portions of the first coil conductor and the second side portion.

公开(公告)号：US20230317351A1

公开(公告)日：2023-10-05

申请号：US18188534

申请日：2023-03-23

Applicant: TDK CORPORATION

Inventor： Masashi SHIMOYASU ,  Yoji TOZAWA ,  Akihiko OIDE ,  Daiki KATO ,  Midori KISHIMOTO ,  Satoshi TAKASU ,  Yo SAITO ,  Rui TAKAHASHI ,  Kenta SASAKI ,  Makoto YOSHINO ,  Kazuhiro EBINA

IPC: H01F27/28 ,  H01F27/29

CPC classification number: H01F27/2804 ,  H01F27/292 ,  H01F2027/2809

Abstract: An electronic component has an element body; and an external electrode having a main body portion covering at least the second surface and a first wrapping-around portion wrapping around the third surface in the element body. The wrapping-around portion of the external electrode has a first part having a first distance, a second part having a second distance, a third part having a third distance, a fourth part having a fourth distance, and a fifth part having a fifth distance in the second direction in order from one side to the other side in the first direction. The second distance is longer than the first distance and the third distance. The fourth distance is longer than the third distance and the fifth distance.

公开(公告)号：US20220310316A1

公开(公告)日：2022-09-29

申请号：US17705969

申请日：2022-03-28

Applicant: TDK CORPORATION

Inventor： Yuya OSHIMA ,  Kenji KOMORITA ,  Masayuki SUZUKI ,  Yuudai KATOU ,  Takeru SASAKI ,  Shigeshi OSAWA ,  Takehiro ISHII ,  Kouichi KAKUDA ,  Yukio TAKAHASHI ,  Tsubasa OZAWA ,  Makoto YOSHINO

IPC: H01F27/29 ,  H01F17/00

Abstract: In the multi-layer coil component, the hole portion is provided in the vicinity of the side surface of the element body, and the distance from the tip position of the external electrode to the hole portion is shorter than the distance from the tip position of the external electrode to the coil. Therefore, when a crack is generated starting from the tip position of the external electrode on the mounting surface, the crack progress toward the hole portion located at a distance closer than the coil. Therefore, in the multi-layer coil component, splitting of the coil due to the crack can be prevented.

公开(公告)号：US20200234877A1

公开(公告)日：2020-07-23

申请号：US16843228

申请日：2020-04-08

Applicant: TDK CORPORATION

Inventor： Yuya OSHIMA ,  Makoto YOSHINO ,  Yoji TOZAWA ,  Junichi OTSUKA ,  Kazuo IWAI ,  Yohei TADAKI ,  Shinichi KONDO ,  Kazuhiro EBINA ,  Mamoru KAWAUCHI

IPC: H01F41/04 ,  H01F27/28 ,  H01F17/00

Abstract: A method of manufacturing a laminated coil component is a method of manufacturing a laminated coil component provided with a laminate obtained by laminating a coil conductor forming a spiral coil and an insulator layer. The method of manufacturing a laminated coil component includes a step of providing a conductor pattern configured to become a coil conductor on a green sheet configured to become an insulator layer, and a step of laminating a plurality of green sheets provided with the conductor pattern. The conductor pattern includes a pair of first side surfaces opposed to each other in an orthogonal direction orthogonal to a laminating direction of the green sheet. At the step of laminating a plurality of green sheets, a depression is formed on at least one of the pair of first side surfaces.

公开(公告)号：US20200098507A1

公开(公告)日：2020-03-26

申请号：US16576193

申请日：2019-09-19

Applicant: TDK CORPORATION

Inventor： Yuto SHIGA ,  Hajime KATO ,  Kazuya TOBITA ,  Youichi KAZUTA ,  Noriaki HAMACHI ,  Makoto YOSHINO

IPC: H01F27/28 ,  H01F27/32 ,  H01F41/04

Abstract: A multilayer coil component includes an element body including a plurality of laminated insulator layers, and a coil disposed in the element body. The coil includes a first coil conductor having a first inner diameter, a second coil conductor having a second inner diameter smaller than the first inner diameter, and a connection conductor connecting the first coil conductor and the second coil conductor. The second coil conductor is adjacent to the first coil conductor in a direction in which the plurality of insulator layers are laminated. The connection conductor has a shape along the first coil conductor and the second coil conductor.

公开(公告)号：US20180114624A1

公开(公告)日：2018-04-26

申请号：US15787170

申请日：2017-10-18

Applicant: TDK CORPORATION

Inventor： Takuo ABE ,  Makoto YOSHINO

IPC: H01F17/00 ,  H03H7/42

CPC classification number: H01F17/0013 ,  H01F2017/0093 ,  H03H7/09 ,  H03H7/427 ,  H03H2001/0078 ,  H03H2001/0085

Abstract: A multilayer common mode filter includes a first coil, a second coil and a third coil. The first coil includes a first coil conductor and a second coil conductor having spiral shapes and is configured by electrically connecting the first coil conductor and the second coil conductor. The second coil includes a third coil conductor and a fourth coil conductor having spiral shapes and is configured by electrically connecting the third coil conductor and the fourth coil conductor. The third coil includes a fifth coil conductor and a sixth coil conductor having spiral shapes and is configured by electrically connecting the fifth coil conductor and the sixth coil conductor. The first to sixth coil conductors are disposed in order of the first coil conductor, the third coil conductor, the fifth coil conductor, the second coil conductor, the fourth coil conductor, and the sixth coil conductor in a first direction.

公开(公告)号：US20240120142A1

公开(公告)日：2024-04-11

申请号：US18480760

申请日：2023-10-04

Applicant: TDK CORPORATION

Inventor： Yoji TOZAWA ,  Masashi SHIMOYASU ,  Akihiko OIDE ,  Daiki KATO ,  Makoto YOSHINO ,  Takashi ENDO ,  Takuya KODAMA ,  Akira AKASAKA ,  Ken ITOH

IPC: H01F27/02 ,  H01F27/29

CPC classification number: H01F27/022 ,  H01F27/29

Abstract: The electronic component includes an element body, an internal conductor, a cover layer, and a conductor layer. The internal conductor is disposed in the element body. The cover layer is disposed on an outer surface of the element body and has an electrical insulation property. The conductor layer is disposed on the cover layer and is electrically connected to the internal conductor. The conductor layer includes a portion. The portion protrudes toward the element body through the cover layer and is physically and electrically connected to the internal conductor. The conductor layer is electrically connected to the internal conductor.