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公开(公告)号：US20190382262A1
公开(公告)日：2019-12-19
申请号：US16551108
申请日：2019-08-26
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Virgil Cotoco Ararao , John Charles Ehmke
Abstract: In described examples, a first device on a first surface of a substrate is coupled to a structure arranged on a second surface of the substrate. In at least one example, a first conductor arranged on the first surface is coupled to circuitry of the first device. An elevated portion of the first conductor is supported by disposing an encapsulate and curing the encapsulate. The first conductor is severed by cutting the encapsulate and the first conductor. A second conductor is coupled to the first conductor. The second conductor is coupled to the structure arranged on the second surface of the substrate.
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公开(公告)号：US20180186629A1
公开(公告)日：2018-07-05
申请号：US15433704
申请日：2017-02-15
Applicant: Texas Instruments Incorporated
Inventor： Virgil Cotoco Ararao , John Charles Ehmke
CPC classification number: B81C1/00873 , B81B7/007 , B81B2203/0315 , B81B2207/098 , B81C2203/0118 , B81C2203/0136 , B81C2203/0172 , H01L23/3135 , H01L23/315 , H01L24/02 , H01L24/05 , H01L24/13 , H01L24/48 , H01L2224/0233 , H01L2224/0235 , H01L2224/02371 , H01L2224/03334 , H01L2224/0401 , H01L2224/05016 , H01L2224/05548 , H01L2224/05558 , H01L2224/056 , H01L2224/06181 , H01L2224/09181 , H01L2224/13022 , H01L2224/13024 , H01L2224/48137 , H01L2224/73253 , H01L2224/8592 , H01L2224/94 , H01L2224/96 , H01L2924/00014 , H01L2224/03 , H01L2224/11
Abstract: In described examples, a first device on a first surface of a substrate is coupled to a structure arranged on a second surface of the substrate. In at least one example, a first conductor arranged on the first surface is coupled to circuitry of the first device. An elevated portion of the first conductor is supported by disposing an encapsulate and curing the encapsulate. The first conductor is severed by cutting the encapsulate and the first conductor. A second conductor is coupled to the first conductor. The second conductor is coupled to the structure arranged on the second surface of the substrate.
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公开(公告)号：US20170050844A1
公开(公告)日：2017-02-23
申请号：US14827683
申请日：2015-08-17
Applicant: Texas Instruments Incorporated
Inventor： John Charles Ehmke , Virgil Cotoco Ararao
CPC classification number: B81B7/0038 , B81B2203/0315 , B81C1/00269 , B81C1/00285 , B81C1/00293 , B81C2201/0108 , B81C2201/013 , B81C2201/0188 , B81C2201/0198 , B81C2201/053 , B81C2203/0109 , B81C2203/0118 , B81C2203/019 , B81C2203/035 , B82Y30/00 , G02B6/4204 , G02B6/4208 , G02B6/4248 , G02B26/001 , G02B26/0833 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L2224/03612 , H01L2224/03614 , H01L2224/039 , H01L2224/04026 , H01L2224/05083 , H01L2224/05109 , H01L2224/05123 , H01L2224/05138 , H01L2224/05163 , H01L2224/05166 , H01L2224/0517 , H01L2224/05562 , H01L2224/27462 , H01L2224/2747 , H01L2224/279 , H01L2224/29006 , H01L2224/29011 , H01L2224/29023 , H01L2224/29109 , H01L2224/29144 , H01L2224/32058 , H01L2224/32227 , H01L2224/83121 , H01L2224/83193 , H01L2224/8381 , H01L2224/83825 , H01L2224/94 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01074 , H01L2924/1461 , H01L2924/164 , H01L2924/00014 , H01L2924/01049 , H01L2224/03 , H01L2924/01042 , H01L2924/01072 , H01L2924/01004 , H01L2224/83 , H01L2224/0345 , H01L2224/0361 , H01L2224/03462
Abstract: A hermetic package comprising a substrate (110) having a surface with a MEMS structure (101) of a first height (101a), the substrate hermetically sealed to a cap (120) forming a cavity over the MEMS structure; the cap attached to the substrate surface by a vertical stack (130) of metal layers adhering to the substrate surface and to the cap, the stack having a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance (140); the stack having a bottom first metal seed film (131a) adhering to the substrate and a bottom second metal seed film (131b) adhering to the bottom first seed film, both seed films of a first width (131c) and a common sidewall (138); further a top first metal seed film (132a) adhering to the cap and a top second metal seed film (132b) adhering to the top first seed film, both seed films with a second width (132c) smaller than the first width and a common sidewall (139); the bottom and top metal seed films tied to a metal layer (135) including gold-indium intermetallic compounds, layer (135) having a second height (133a) greater than the first height and encasing the seed films and common sidewalls.
Abstract translation: 一种密封包装，其包括具有具有第一高度（101a）的MEMS结构（101）的表面的基底（110），所述基底被气密地密封到在所述MEMS结构上形成空腔的帽（120） 所述盖通过粘附到所述基板表面和所述盖的金属层的垂直堆叠（130）附接到所述基板表面，所述堆叠具有围绕所述MEMS结构的连续轮廓，同时与所述MEMS结构隔开距离（140）; 所述堆叠具有附着到所述基板的底部第一金属种子膜（131a）和粘附到所述底部第一种子膜的底部第二金属种子膜（131b），具有第一宽度（131c）和公共侧壁（138）的两种种子膜 ）; 另外，粘附到盖的顶部第一金属种子膜（132a）和粘附到顶部第一种子膜的顶部第二金属种子膜（132b），具有小于第一宽度的第二宽度（132c）的两种种子膜和共同的 侧壁（139）; 连接到包括金 - 铟金属间化合物的金属层（135）的底部和顶部金属种子膜，具有大于第一高度的第二高度（133a）的层（135）并且包围种子膜和共同侧壁。
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公开(公告)号：US20210371272A1
公开(公告)日：2021-12-02
申请号：US17399832
申请日：2021-08-11
Applicant: Texas Instruments Incorporated
Inventor： John Charles Ehmke , Ivan Kmecko
Abstract: In described examples, a first metal layer is configured along a periphery of a cavity to be formed between a first substrate and a second substrate. A second metal layer is adjacent the first metal layer. The second metal layer includes a cantilever. The cantilever is configured to deform by bonding the first substrate to the second substrate. The deformed cantilevered is configured to impede contaminants against contacting an element within the cavity.
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公开(公告)号：US11167983B2
公开(公告)日：2021-11-09
申请号：US16450138
申请日：2019-06-24
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： John Charles Ehmke
Abstract: A method includes attaching an optically transparent wafer to a first surface of an interposer wafer. The interposer wafer has a second surface opposite the first surface, and the second surface has a first channel therein. The method further includes attaching the interposer wafer to a first surface of a semiconductor wafer, and etching a second channel through the optically transparent wafer and through the interposer wafer. The method then includes applying wax into the second channel, and sawing through the optically transparent wafer and through at least a portion of the interposer wafer to form a third channel having a width that is wider than a width of the second channel. The wax is then removed to expose a portion of the first surface of the semiconductor wafer.
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Patent Agency Ranking
公开(公告)号：US10750645B2
公开(公告)日：2020-08-18
申请号：US16218468
申请日：2018-12-12
Applicant: Texas Instruments Incorporated
Inventor： John Charles Ehmke , Scott Patrick Overmann , Sean Christopher O'Brien
IPC: G02F1/1333 , G02B27/01 , H05K7/20 , B60K35/00
Abstract: In described examples, an image-generating panel is arranged for modulating a projection beam to include a modulated optical image. A cooling device is arranged to transfer heat received from the image-generating panel to a heat sink. The cooling device is arranged to receive the projection beam on a first side and to transmit the projection beam from a second side. The heat received from the image-generating panel can include heat generated by the image-generating panel in response to incidental sunlight.
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公开(公告)号：US10427932B2
公开(公告)日：2019-10-01
申请号：US15879212
申请日：2018-01-24
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： John Charles Ehmke , Virgil Cotoco Ararao
Abstract: In described examples, a hermetic package of a microelectromechanical system (MEMS) structure includes a substrate having a surface with a MEMS structure of a first height. The substrate is hermetically sealed to a cap forming a cavity over the MEMS structure. The cap is attached to the substrate surface by a vertical stack of metal layers adhering to the substrate surface and to the cap. The stack has a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance. The stack has: a first bottom metal seed film adhering to the substrate and a second bottom metal seed film adhering to the first bottom metal seed film; and a first top metal seed film adhering to the cap and a second top metal seed film adhering to the first top metal seed film.
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公开(公告)号：US10392246B2
公开(公告)日：2019-08-27
申请号：US15433704
申请日：2017-02-15
Applicant: Texas Instruments Incorporated
Inventor： Virgil Cotoco Ararao , John Charles Ehmke
Abstract: In described examples, a first device on a first surface of a substrate is coupled to a structure arranged on a second surface of the substrate. In at least one example, a first conductor arranged on the first surface is coupled to circuitry of the first device. An elevated portion of the first conductor is supported by disposing an encapsulate and curing the encapsulate. The first conductor is severed by cutting the encapsulate and the first conductor. A second conductor is coupled to the first conductor. The second conductor is coupled to the structure arranged on the second surface of the substrate.
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公开(公告)号：US20180148319A1
公开(公告)日：2018-05-31
申请号：US15879212
申请日：2018-01-24
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： John Charles Ehmke , Virgil Cotoco Ararao
IPC: B81B7/00
CPC classification number: B81B7/0038 , B81B2203/0315 , B81C1/00269 , B81C1/00285 , B81C1/00293 , B81C2201/0108 , B81C2201/013 , B81C2201/0188 , B81C2201/0198 , B81C2201/053 , B81C2203/0109 , B81C2203/0118 , B81C2203/019 , B81C2203/035 , B82Y30/00 , G02B6/4204 , G02B6/4208 , G02B6/4248 , G02B26/001 , G02B26/0833 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L2224/03612 , H01L2224/03614 , H01L2224/039 , H01L2224/04026 , H01L2224/05083 , H01L2224/05109 , H01L2224/05123 , H01L2224/05138 , H01L2224/05163 , H01L2224/05166 , H01L2224/0517 , H01L2224/05562 , H01L2224/27462 , H01L2224/2747 , H01L2224/279 , H01L2224/29006 , H01L2224/29011 , H01L2224/29023 , H01L2224/29109 , H01L2224/29144 , H01L2224/32058 , H01L2224/32227 , H01L2224/83121 , H01L2224/83193 , H01L2224/8381 , H01L2224/83825 , H01L2224/94 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01074 , H01L2924/1461 , H01L2924/164 , H01L2924/00014 , H01L2924/01049 , H01L2224/03 , H01L2924/01042 , H01L2924/01072 , H01L2924/01004 , H01L2224/83 , H01L2224/0345 , H01L2224/0361 , H01L2224/03462
Abstract: In described examples, a hermetic package of a microelectromechanical system (MEMS) structure includes a substrate having a surface with a MEMS structure of a first height. The substrate is hermetically sealed to a cap forming a cavity over the MEMS structure. The cap is attached to the substrate surface by a vertical stack of metal layers adhering to the substrate surface and to the cap. The stack has a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance. The stack has: a first bottom metal seed film adhering to the substrate and a second bottom metal seed film adhering to the first bottom metal seed film; and a first top metal seed film adhering to the cap and a second top metal seed film adhering to the first top metal seed film.
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公开(公告)号：US20170152136A1
公开(公告)日：2017-06-01
申请号：US15429636
申请日：2017-02-10
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： John Charles Ehmke , Virgil Cotoco Ararao
CPC classification number: B81B7/0038 , B81B2203/0315 , B81C1/00269 , B81C1/00285 , B81C1/00293 , B81C2201/0108 , B81C2201/013 , B81C2201/0188 , B81C2201/0198 , B81C2201/053 , B81C2203/0109 , B81C2203/0118 , B81C2203/019 , B81C2203/035 , B82Y30/00 , G02B6/4204 , G02B6/4208 , G02B6/4248 , G02B26/001 , G02B26/0833 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L2224/03612 , H01L2224/03614 , H01L2224/039 , H01L2224/04026 , H01L2224/05083 , H01L2224/05109 , H01L2224/05123 , H01L2224/05138 , H01L2224/05163 , H01L2224/05166 , H01L2224/0517 , H01L2224/05562 , H01L2224/27462 , H01L2224/2747 , H01L2224/279 , H01L2224/29006 , H01L2224/29011 , H01L2224/29023 , H01L2224/29109 , H01L2224/29144 , H01L2224/32058 , H01L2224/32227 , H01L2224/83121 , H01L2224/83193 , H01L2224/8381 , H01L2224/83825 , H01L2224/94 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01074 , H01L2924/1461 , H01L2924/164 , H01L2924/00014 , H01L2924/01049 , H01L2224/03 , H01L2924/01042 , H01L2924/01072 , H01L2924/01004 , H01L2224/83 , H01L2224/0345 , H01L2224/0361 , H01L2224/03462
Abstract: In described examples, a hermetic package of a microelectromechanical system (MEMS) structure includes a substrate having a surface with a MEMS structure of a first height. The substrate is hermetically sealed to a cap forming a cavity over the MEMS structure. The cap is attached to the substrate surface by a vertical stack of metal layers adhering to the substrate surface and to the cap. The stack has a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance. The stack has: a first bottom metal seed film adhering to the substrate and a second bottom metal seed film adhering to the first bottom metal seed film; and a first top metal seed film adhering to the cap and a second top metal seed film adhering to the first top metal seed film.
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