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    Continuous fiber reinforced polyarylene sulfide
    12.
    发明授权
    Continuous fiber reinforced polyarylene sulfide 有权
    连续纤维增强聚芳硫醚

    公开(公告)号：US09394430B2

    公开(公告)日：2016-07-19

    申请号：US13800130

    申请日：2013-03-13

    Applicant: Ticona LLC

    Inventor： Rong Luo ,  Aaron Johnson ,  Tim Tibor ,  Xinyu Zhao ,  David Eastep

    IPC: C08K7/06 ,  B32B5/12 ,  B32B5/26 ,  B32B5/28 ,  C08J5/24

    CPC classification number: C08K7/06 ,  B32B5/12 ,  B32B5/26 ,  B32B5/28 ,  B32B2250/20 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/106 ,  B32B2307/54 ,  B32B2307/542 ,  B32B2307/546 ,  B32B2605/00 ,  C08J5/24 ,  C08J2381/04 ,  Y10T428/1352 ,  Y10T428/249942 ,  Y10T428/249945 ,  Y10T428/249946 ,  Y10T428/249947

    Abstract: A continuous fiber composite is described and methods for forming the continuous fiber composite. The continuous fiber composite includes a plurality of unidirectionally aligned continuous fibers embedded within a polyarylene sulfide polymer. The continuous fiber composite includes a very high loading of continuous fibers, for instance greater than about 40% by weight of the continuous fiber composite. The continuous fiber composite is formed by reacting a starting polyarylene sulfide with a reactively functionalized disulfide compound in a melt processing unit. Reaction between the starting polyarylene sulfide and the reactively functionalized disulfide compound leads to formation of a reactively functionalized polyarylene sulfide. Upon embedding of the continuous fibers into the reactively functionalized polyarylene sulfide, the reactivity of the polyarylene sulfide can enhance adhesion between the polyarylene sulfide polymer and the fibers.

    Abstract translation: 描述连续纤维复合材料和形成连续纤维复合材料的方法。 连续纤维复合材料包括嵌入聚芳硫醚聚合物内的多个单向排列的连续纤维。 连续纤维复合材料包括连续纤维的非常高的载量，例如大于连续纤维复合材料的约40重量％。 连续纤维复合材料通过在熔融加工单元中使起始聚芳硫醚与反应性官能化的二硫化物化合物反应形成。 起始聚芳硫醚和反应性官能化二硫化物化合物之间的反应导致形成反应官能化的聚芳硫醚。 在将连续纤维嵌入反应性官能化聚芳硫醚中时，聚芳硫醚的反应性可以增强聚芳硫醚聚合物与纤维之间的粘合性。

    High strength thermotropic liquid crystalline polymer
    13.
    发明授权
    High strength thermotropic liquid crystalline polymer 有权
    高强度热致液晶聚合物

    公开(公告)号：US09206300B2

    公开(公告)日：2015-12-08

    申请号：US14297011

    申请日：2014-06-05

    Applicant: Ticona LLC

    Inventor： Xinyu Zhao ,  Kamlesh Nair ,  Paul Yung ,  Grant Barber ,  Steven Gray ,  Young Shin Kim ,  Ardian Maliqi

    IPC: C08G18/42 ,  C08K7/14 ,  C09K19/38 ,  C08G67/02 ,  C09K19/52

    CPC classification number: C08K7/14 ,  C09K19/3809 ,  C09K2019/521 ,  C08L67/03

    Abstract: A wholly aromatic thermotropic liquid crystalline polymer and compositions including the liquid crystalline polymer are described. The polymer composition can include the liquid crystalline polymer and a fibrous filler, e.g., a chopped glass or milled glass fibrous filler. The compositions are capable of exhibiting excellent mechanical properties. The liquid crystalline polymer provides desirable characteristics with the incorporation of little or no naphthenic acids in the polymer backbone.

    Abstract translation: 描述了全芳族热致液晶聚合物和包含液晶聚合物的组合物。 聚合物组合物可以包括液晶聚合物和纤维填料，例如短切玻璃或研磨玻璃纤维填料。 组合物能够表现出优异的机械性能。 液晶聚合物在聚合物主链中引入很少或没有环烷酸提供了期望的特性。

    Laminate for a Printed Circuit Board
    14.
    发明申请
    Laminate for a Printed Circuit Board 审中-公开
    印刷电路板层压板

    公开(公告)号：US20150274965A1

    公开(公告)日：2015-10-01

    申请号：US14526561

    申请日：2014-10-29

    Applicant: Ticona LLC

    Inventor： Kamlesh P. Nair ,  Paul C. Yung ,  Yi Li ,  Xinyu Zhao

    IPC: C08L67/04

    CPC classification number: C08L67/04 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0236 ,  H05K2203/107 ,  Y10T428/266

    Abstract: A laminate that contains a film on which one or more conductive elements are disposed is provided. The film is formed from a polymer composition that contains an aromatic polyester and an additive that is “laser-activatable” in the sense that it can be activated by a laser direct structuring (“LDS”) process. By selectively controlling the nature of the polymer composition and its respective components, the present inventors have discovered that a film can be readily formed that has good heat resistance, yet is also capable of exhibiting good adhesion to the conductive elements due to the fact that such elements can be integrally formed on the film using an LDS process.

    Abstract translation: 提供包含其上设置有一个或多个导电元件的膜的层压体。 该膜由含有芳族聚酯和“激光可激活”的添加剂的聚合物组合物形成，其可以通过激光直接结构化（“LDS”）工艺激活。 通过选择性地控制聚合物组合物及其各自组分的性质，本发明人已经发现，可以容易地形成具有良好耐热性的膜，但是由于这样的事实，也能够显示出对导电元件的良好粘合性 元件可以使用LDS工艺一体地形成在膜上。

    Housing for a portable electronic device
    15.
    发明授权
    Housing for a portable electronic device 有权
    便携式电子设备的外壳

    公开(公告)号：US09119307B2

    公开(公告)日：2015-08-25

    申请号：US13621865

    申请日：2012-09-18

    Applicant: Ticona LLC

    Inventor： Rong Luo ,  Xinyu Zhao ,  Ke Feng

    IPC: C08K3/34 ,  H05K5/03 ,  C08K5/372 ,  C08G75/02 ,  C08K7/02

    CPC classification number: H05K5/03 ,  C08G75/029 ,  C08K5/372 ,  C08K7/02 ,  C08L81/02

    Abstract: An injection molded housing for a portable electronic device is provided. The housing contains a thermoplastic composition that includes a polyarylene sulfide melt processed in the presence of a disulfide compound and a filler. Without intending to be limited by theory, it is believed that the disulfide can undergo a chain scission reaction with the starting polyarylene sulfide to lower its melt viscosity, which can lead to decreased attrition of the filler and thus improved mechanical properties. Due to this ability to reduce viscosity during melt processing, the present inventors have discovered that relatively high molecular weight polyarylene sulfides can be fed to the extruder with little difficulty.

    Abstract translation: 提供了一种用于便携式电子设备的注塑外壳。 壳体包含热塑性组合物，其包含在二硫化物化合物和填料的存在下加工的聚芳硫醚熔体。 不期望受理论的限制，相信二硫化物可以与起始聚芳硫醚发生断链反应以降低其熔体粘度，这可导致填料的磨损减少，从而改善机械性能。 由于这种在熔融加工过程中降低粘度的能力，本发明人已经发现，相对高分子量的聚亚芳基硫化物可以很少地进料到挤出机中。

    Low Naphthenic Liquid Crystalline Polymer Composition for Use in Molded Parts with a Small Dimensional Tolerance
    19.
    发明申请
    Low Naphthenic Liquid Crystalline Polymer Composition for Use in Molded Parts with a Small Dimensional Tolerance 有权
    用于具有小尺寸公差的成型零件中的低环烷液晶聚合物组合物

    公开(公告)号：US20130122274A1

    公开(公告)日：2013-05-16

    申请号：US13675082

    申请日：2012-11-13

    Applicant: Ticona LLC

    Inventor： Young Shin Kim ,  Xinyu Zhao

    IPC: C09K19/38

    CPC classification number: C08L67/02 ,  C08G63/605 ,  C08G63/916 ,  C08K5/092 ,  C08K5/13 ,  C08K2003/2227 ,  C09K19/3809 ,  C08L67/03 ,  C08K3/22

    Abstract: A thermoplastic composition that comprises a low-naphthenic, thermotropic liquid crystalline polymer blended with a combination of flow modifiers is provided. More particularly, one of the flow modifiers is a hydroxy-functional compound that contains or more hydroxyl functional groups. Without intending to be limited by theory, it is believed that the hydroxyl functional groups can react with the polymer chain to shorten its length and thus reduce melt viscosity. Aromatic dicarboxylic acids are also employed as a flow modifier in the thermoplastic composition. Again, without intending to be limited by theory, it is believed that such acids can combine smaller chains of the polymer together after they have been cut by hydroxy-functional compounds. This helps maintain the mechanical properties of the composition even after its melt viscosity has been reduced.

    Abstract translation: 提供了包含与流动改性剂组合混合的低环烷烃，热致变液晶聚合物的热塑性组合物。 更具体地，流动改性剂之一是含有一个或多个羟基官能团的羟基官能化合物。 不期望受理论的限制，相信羟基官能团可与聚合物链反应以缩短其长度，从而降低熔融粘度。 芳族二羧酸也用作热塑性组合物中的流动改性剂。 同样，不期望受理论限制，据信这些酸可以在被羟基官能化合物切割后将聚合物的较小链结合在一起。 这有助于保持组合物的机械性能，即使其熔融粘度降低。

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