-
公开(公告)号：US20240061339A1
公开(公告)日：2024-02-22
申请号：US18501693
申请日：2023-11-03
Applicant: Taiwan Semiconductor Manufacturing Co. Ltd.
Inventor： Hung-Jui Kuo , De-Yuan Lu , Chen-Hua Yu , Ming-Tan Lee
IPC: G03F7/16
CPC classification number: G03F7/168
Abstract: A photoresist apparatus and a method are provided. The photoresist apparatus includes a pre-baking apparatus. The pre-baking apparatus includes: a hot-plate, a first cover over the hot-plate, a second cover over the first cover, a first heating element extending along a topmost surface of the first cover, and a second heating element extending along a topmost surface of the second cover.
-
公开(公告)号：US11823969B2
公开(公告)日：2023-11-21
申请号：US17809924
申请日：2022-06-30
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hung-Jui Kuo , Tai-Min Chang , Hui-Jung Tsai , De-Yuan Lu , Ming-Tan Lee
CPC classification number: H01L23/3121 , H01L21/561 , H01L23/3114 , H01L23/481 , H01L24/03 , H01L2224/0233
Abstract: A package includes a device die, an encapsulant encapsulating the device die therein, a first plurality of through-vias penetrating through the encapsulant, a second plurality of through-vias penetrating through the encapsulant, and redistribution lines over and electrically coupling to the first plurality of through-vias. The first plurality of through-vias include an array. The second plurality of through-vias are outside of the first array, and the second plurality of through-vias are larger than the first plurality of through-vias.
-
公开(公告)号：US20230064162A1
公开(公告)日：2023-03-02
申请号：US17461656
申请日：2021-08-30
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsing-Chieh Lee , Hung-Jui Kuo , Ming-Tan Lee , Ting Yi Lin
Abstract: A semiconductor device and method of manufacturing a semiconductor device is disclosed herein including creating a photoresist mixture that includes a surfactant, and a base solvent; one or more boiling point modifying solvents having a boiling point higher in temperature than the base solvent; and one or more hydrophilicity modifying solvents that are more hydrophilic than the base solvent; depositing the photoresist mixture onto a substrate comprising a plurality of UBMLs using a wet film process; performing a pre-bake process to cure the photoresist; and patterning the photoresist.
-
公开(公告)号：US20230011701A1
公开(公告)日：2023-01-12
申请号：US17371204
申请日：2021-07-09
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hung-Jui Kuo , Ting-Yang Yu , Ming-Tan Lee
Abstract: In an embodiment, an apparatus includes an energy source, a support platform for holding a wafer, an optical path extending from the energy source to the support platform, and a photomask aligned such that a patterned major surface of the photomask is parallel to the force of gravity, where the optical path passes through the photomask, where the patterned major surface of the photomask is perpendicular to a topmost surface of the support platform.
-
公开(公告)号：US11037877B2
公开(公告)日：2021-06-15
申请号：US16354135
申请日：2019-03-14
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Zi-Jheng Liu , Hung-Jui Kuo , Ming-Tan Lee
IPC: H01L23/495 , H01L23/538 , H01L23/31 , H01L23/00 , H01L25/065 , H01L21/48 , H01L21/56 , H01L25/00
Abstract: A package structure includes a first die, a second die, a bridge, an encapsulant and a redistribution layer (RDL) structure. The bridge is arranged side by side with the first die and the second die. The encapsulant laterally encapsulates the first die, the second die and the bridge. The RDL structure is disposed on the first die, the second die, the bridge and the encapsulant. The first die and the second die are electrically connected to each other through the bridge and the RDL structure.
-
Patent Agency Ranking
公开(公告)号：US20210057347A1
公开(公告)日：2021-02-25
申请号：US16547611
申请日：2019-08-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Zi-Jheng Liu , Hung-Jui Kuo , Ming-Tan Lee
IPC: H01L23/538 , H01L23/31 , H01L23/00 , H01L21/48 , H01L21/56 , H01L21/683
Abstract: A semiconductor package includes a semiconductor die and a redistribution structure. The redistribution structure is electrically connected to the semiconductor die. The redistribution structure includes dielectric layers, conductive traces and seal patterns. The conductive traces are embedded in the dielectric layers. At least one conductive trace of the conductive traces includes a via pattern and a routing pattern. The seal patterns are disposed on the conductive traces. One seal pattern of the seal patterns is disposed between a top surface of the routing pattern and a first dielectric layer of the dielectric layers.
-
公开(公告)号：US10312118B2
公开(公告)日：2019-06-04
申请号：US14157271
申请日：2014-01-16
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Pei-Shan Wu , Yi-Ting Hu , Ming-Tan Lee , Yu-Lin Wang , Yuh-Sen Chang , Pin-Yi Shin , Wen-Ming Chen , Wei-Chih Chen , Chih-Yuan Chiu
IPC: H01L21/67 , H01L21/683 , H01L21/50
Abstract: A bonding apparatus includes a wafer stage, a first chip stage, a first chip transporting device, a second stage and a second chip transporting device. The wafer stage is used for holding a wafer. The first chip stage is used for holding at least one first chip. The first chip transporting device is used for transporting the first chip from the first chip stage onto the wafer. The second chip stage is used for holding at least one second chip. The second chip transporting device is used for transporting the second chip from the second chip stage onto the wafer.
-
公开(公告)号：US20240393685A1
公开(公告)日：2024-11-28
申请号：US18790692
申请日：2024-07-31
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsing-Chieh Lee , Hung-Jui Kuo , Ming-Tan Lee , Ting Yi Lin
Abstract: A semiconductor device and method of manufacturing a semiconductor device is disclosed herein including creating a photoresist mixture that includes a surfactant, and a base solvent; one or more boiling point modifying solvents having a boiling point higher in temperature than the base solvent; and one or more hydrophilicity modifying solvents that are more hydrophilic than the base solvent; depositing the photoresist mixture onto a substrate comprising a plurality of UBMLs using a wet film process; and performing a pre-bake process to cure the photoresist mixture.
-
公开(公告)号：US20240319609A1
公开(公告)日：2024-09-26
申请号：US18733146
申请日：2024-06-04
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hung-Jui Kuo , Ting-Yang Yu , Ming-Tan Lee
CPC classification number: G03F7/70191 , G03F1/46 , H01L21/4853 , H01L21/4857 , H01L21/561 , H01L21/568 , H01L24/82 , H01L24/97 , H01L25/105
Abstract: In an embodiment, an apparatus includes an energy source, a support platform for holding a wafer, an optical path extending from the energy source to the support platform, and a photomask aligned such that a patterned major surface of the photomask is parallel to the force of gravity, where the optical path passes through the photomask, where the patterned major surface of the photomask is perpendicular to a topmost surface of the support platform.
-
公开(公告)号：US12032295B2
公开(公告)日：2024-07-09
申请号：US18065391
申请日：2022-12-13
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hung-Jui Kuo , Ting-Yang Yu , Ming-Tan Lee
CPC classification number: G03F7/70191 , G03F1/46 , H01L21/4853 , H01L21/4857 , H01L21/561 , H01L21/568 , H01L24/82 , H01L24/97 , H01L25/105
Abstract: In an embodiment, an apparatus includes an energy source, a support platform for holding a wafer, an optical path extending from the energy source to the support platform, and a photomask aligned such that a patterned major surface of the photomask is parallel to the force of gravity, where the optical path passes through the photomask, where the patterned major surface of the photomask is perpendicular to a topmost surface of the support platform.
-
-
-
-
-
-
-
-
-
Search Results
27
records
(took 0.023 seconds)
