公开(公告)号：US11571782B2

公开(公告)日：2023-02-07

申请号：US16672099

申请日：2019-11-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Lung Lai ,  Cheng-Ping Chen ,  Shih-Chung Chen ,  Sheng-Tai Peng ,  Rong-Long Hung

IPC: B24B37/16 ,  B24B49/12 ,  B24B37/013

Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.

公开(公告)号：US20200164482A1

公开(公告)日：2020-05-28

申请号：US16559472

申请日：2019-09-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Chung Chen ,  Yi-Shao Lin ,  Sheng-Tai Peng ,  Ya-Jen Sheuh ,  Hung-Lin Chen ,  Ren-Dou Lee

IPC: B24B37/20 ,  B24B37/013 ,  C09G1/02 ,  B24B37/04

Abstract: Described herein are multi-layered windows for use in chemical-mechanical planarization (CMP) systems and CMP processes. The multi-layered windows of the present disclosure include a transparent structural layer and a hydrophilic surfactant applied to at least a portion of at least one surface of the transparent structural layer. Such multi-layered windows may be in the polishing pad, the platen, or both.

公开(公告)号：US10661408B2

公开(公告)日：2020-05-26

申请号：US15882511

申请日：2018-01-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Feng Han ,  Cheng-Yi Huang ,  Fang-Chi Chien ,  Chen-shih Chung ,  Sheng-Tai Peng

IPC: B24B37/04 ,  B24B37/24 ,  B24B57/02 ,  H01L21/321 ,  B24B37/10 ,  B24B37/013 ,  B24B37/12 ,  B24B37/20 ,  H01L21/768

Abstract: A stopper includes a head portion sized and configured to be coupled to an upper platen of a chemical-mechanical planarization system and a stopper leg sized and configured to direct a flow of liquid slurry applied to an upper planar surface of the upper platen substantially away from a lower surface of the upper platen.

公开(公告)号：US20190061094A1

公开(公告)日：2019-02-28

申请号：US15882511

申请日：2018-01-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kanyu Han ,  Juster Huang ,  Fang-Chi Chien ,  Stone Chen ,  Sheng-Tai Peng

IPC: B24B37/04 ,  B24B37/24 ,  B24B57/02 ,  H01L21/321

CPC classification number: B24B37/042 ,  B24B37/013 ,  B24B37/105 ,  B24B37/12 ,  B24B37/205 ,  B24B37/245 ,  B24B57/02 ,  H01L21/3212 ,  H01L21/7684

Abstract: A stopper includes a head portion sized and configured to be coupled to an upper platen of a chemical-mechanical planarization system and a stopper leg sized and configured to direct a flow of liquid slurry applied to an upper planar surface of the upper platen substantially away from a lower surface of the upper platen.