Deposition apparatus for manufacturing thin film
    16.
    发明授权
    Deposition apparatus for manufacturing thin film 有权
    用于制造薄膜的沉积装置

    公开(公告)号:US06530341B1

    公开(公告)日:2003-03-11

    申请号:US09257027

    申请日:1999-02-25

    IPC分类号: H05H100

    摘要: A deposition apparatus of the present invention is arranged so that a surface area of a radio-frequency power applying cathode electrode disposed in a glow discharge space, in a space in contact with discharge is greater than a surface area of the whole of a ground electrode (anode electrode) including a beltlike member in the discharge space. This structure can maintain the potential (self-bias) of the cathode electrode disposed in the glow discharge space automatically at a positive potential with respect to the ground (anode) electrode including the beltlike member. As a result, the bias is applied in the direction of irradiation of ions with positive charge to a deposit film on the beltlike member, so that the ions existing in the plasma discharge are accelerated more efficiently toward the beltlike member, thereby effectively giving energy to the surface of deposit film by ion bombardment. Accordingly, since the structural relaxation of film is promoted even at relatively high deposition rates, a microcrystal semiconductor film can be formed at the relatively high deposition rates with good efficiency, with high uniformity, and with good reproducibility.

    摘要翻译: 本发明的沉积装置被布置成使得设置在辉光放电空间中的与放电接触的空间中的射频施加电极的表面积大于接地电极整体的表面积 (阳极电极),其在放电空间中包括带状构件。该结构可以将设置在辉光放电空间中的阴极的电位(自偏压)自动保持在相对于包括 结果,将带正电荷的离子的照射方向施加到带状构件上的沉积膜上,使得存在于等离子体放电中的离子更有效地朝向带状构件加速,从而有效地 通过离子轰击给沉积膜表面赋予能量。 因此,即使在相对高的沉积速率下也能促进膜的结构弛豫,可以以较高的沉积速率以高的均匀性和高的再现性形成微晶半导体膜。

    Apparatus and method for forming a deposited film on a substrate
    17.
    发明授权
    Apparatus and method for forming a deposited film on a substrate 有权
    在基板上形成沉积膜的装置和方法

    公开(公告)号:US06436797B1

    公开(公告)日:2002-08-20

    申请号:US09578906

    申请日:2000-05-26

    IPC分类号: H01L2120

    摘要: A film-forming apparatus for forming a non-single crystalline silicon series semiconductor film on a substrate in a film-forming space provided in a vacuum chamber using a very high frequency power supplied through a high frequency power supply means comprising a bar-like shaped electrode, wherein said bar-like shaped electrode is arranged such that the longitudinal direction thereof intersects a direction for said substrate to be moved, and a length of said film-forming space relative to the direction for said substrate to be moved is in a range of from {fraction (1/16)} to ½ of a wavelength of said very high frequency power supplied in said film-forming space. A film-forming method for forming a non-single crystalline silicon series semiconductor film on a substrate using said film-forming apparatus.

    摘要翻译: 一种用于在设置在真空室中的成膜空间中的基板上形成非单晶硅系半导体膜的成膜装置,其使用通过高频电源装置提供的非常高频率的功率,所述高频电源包括棒形 电极,其中所述棒状电极被布置成使得其纵向方向与所述基板移动的方向相交,并且所述成膜空间相对于要移动的所述基板的方向的长度在一定范围内 从{分数(1/16)}到在所述成膜空间中提供的所述非常高频率的波长的1/2。 一种使用所述成膜装置在基片上形成非单晶硅系半导体膜的成膜方法。

    Photovoltaic device
    19.
    发明授权
    Photovoltaic device 失效
    光伏装置

    公开(公告)号:US5769963A

    公开(公告)日:1998-06-23

    申请号:US697783

    申请日:1996-08-30

    摘要: A photovoltaic device comprises a semiconductor region having at least one set of semiconductor layers comprised of a first semiconductor layer having a first conductivity type, an intrinsic or substantially intrinsic second semiconductor layer, and a third semiconductor layer having a conductivity type opposite to that of the first conductivity type, the layers being formed in this order, and first and second electrodes provided such that the electrodes interpose the semiconductor region; wherein the density of a dopant impurity determining the conductivity type of the first semiconductor layer in a set of semiconductor layers which is in contact with the first electrode is varied so as to be lower on the side of the first electrode, or the grain size of crystals in the first semiconductor layer is varied so as to be smaller on the side of the first electrode. This provides a photovoltaic device that does not exhibit great lowering of characteristics even when short circuits locally occur in the semiconductor layers during long-term service.

    摘要翻译: 一种光电器件包括具有至少一组半导体层的半导体区域,该组半导体层由具有第一导电类型的第一半导体层,本征的或基本上本征的第二半导体层组成,以及具有与第 第一导电类型,这些层依次形成,第一和第二电极设置成使得电极插入半导体区域; 其中确定与第一电极接触的一组半导体层中的第一半导体层的导电类型的掺杂剂杂质的密度在第一电极的侧面变化,或者在第一电极的一侧的晶粒尺寸 第一半导体层中的晶体在第一电极侧变化较小。 这提供了即使在长期服务期间在半导体层中局部出现短路的情况下也不会出现特性的降低的光电器件。

    Continuous forming method for functional deposited films and deposition
apparatus
    20.
    发明授权
    Continuous forming method for functional deposited films and deposition apparatus 失效
    功能沉积膜和沉积设备的连续成型方法

    公开(公告)号:US5968274A

    公开(公告)日:1999-10-19

    申请号:US754066

    申请日:1996-11-20

    IPC分类号: C23C14/56 C23C16/54 H01L31/20

    摘要: The present invention aims to provide a continuous forming method and apparatus for functional deposited films having excellent characteristics while preventing any mutual mixture of gases between film forming chambers having different pressures, wherein semiconductor layers of desired conductivity type are deposited on a strip-like substrate within a plurality of film forming chambers, by plasma CVD, while the strip-like substrate is moved continuously in a longitudinal direction thereof through the plurality of film forming chambers connected via gas gates having means for introducing a scavenging gas into a slit-like separation passage, characterized in that at least one of the gas gates connecting the i-type layer film forming chamber for forming the semiconductor junction and the n- or p-type layer film forming chamber having higher pressure than the i-type layer film forming chamber has the scavenging gas introducing position disposed on the n- or p-type layer film forming chamber side off from the center of the separation chamber of the gas gate.

    摘要翻译: 本发明的目的在于提供具有优异特性的功能性沉积膜的连续成型方法和装置,同时防止在具有不同压力的成膜室之间任何相互混合的气体,其中期望的导电类型的半导体层沉积在带状衬底上 多个成膜室,通过等离子体CVD,同时带状基板沿其长度方向连续移动通过多个通过气门连接的成膜室,其具有用于将清除气体引入狭缝状分离通道 其特征在于,连接形成半导体结的i型层成膜室和i型层成膜室的n型或p型层成膜室中的至少一个气门具有比i型层成膜室高的压力 所述清除气体导入位置设置在形成有n型或p型层的膜上 r侧从气门的分离室的中心离开。