-
公开(公告)号：US20090320270A1
公开(公告)日：2009-12-31
申请号：US12525019
申请日：2007-03-15
CPC分类号： G11B5/4833 , Y10T29/49908 , Y10T29/53961
摘要： There are provided a method of assembling a carriage assembly that can uniformly crimp edge portions of spacer holes of spacer portions and keep the spacer portions flat, thereby maintaining the angles of suspensions with high accuracy, and an assembling apparatus that uses such method.The method includes an attaching step of positioning spacer holes 12b of suspensions 12 on through-holes 10a formed in front end portions of a plurality of carriage arms 10 that have been disposed in parallel and attaching the suspensions to the respective carriage arms; and a crimping step of pressing a ball 20 with a diameter that is equal to or larger than an inner diameter of the spacer holes 12b using a pressing member 40 so as to pass the ball successively through the spacer holes 12b and thereby crimp spacer hole 12b edge portions of the spacer portions 12a and attach the suspensions 12 to the carriage arms 10, wherein during the crimping step, the ball 20 is placed in a vicinity of the center axis a at least when the ball 20 is located between the carriage arms 10.
摘要翻译： 提供了一种组装支架组件的方法，其可以均匀地压接间隔件部分的间隔孔的边缘部分并且使间隔部分保持平坦，从而以高精度保持悬架的角度，以及使用这种方法的组装装置。 该方法包括将悬架12的间隔孔12b定位在形成在已经平行布置的多个托架臂10的前端部的通孔10a上并将悬架附接到相应的托架臂上的安装步骤; 以及使用按压部件40按压直径等于或大于间隔孔12b的内径的球20的压接步骤，以使球连续通过间隔孔12b，从而压接间隔孔12b 间隔部分12a的边缘部分并将悬架12附接到托架臂10，其中在压接步骤期间，至少当球20位于托架臂10之间时，将球20放置在中心轴线a附近 。
-
公开(公告)号：US20070180673A1
公开(公告)日：2007-08-09
申请号：US11444292
申请日：2006-05-31
CPC分类号： B23P11/005 , B21D39/032 , B21J5/006 , B21K25/00 , Y10T29/49764 , Y10T29/49771 , Y10T29/49774 , Y10T29/49908
摘要： There is provided a method of assembling a carriage assembly that can crimp suspensions to carriage arms by applying ultrasonic vibration to a crimping tool without causing deformation of the suspensions and the like. The method of assembling a carriage assembly aligns attachment holes provided in front ends of carriage arms and crimping portions provided on suspensions to set the suspensions on the carriage arms and then presses a metal ball through crimping holes provided in the crimping portions while applying ultrasonic vibration to a crimping tool to crimp the suspensions to the carriage arms. The suspensions are crimped to the carriage arms by detecting stress that acts on the crimping tool when the metal ball is pressed in by the crimping tool and controlling the amplitude of the ultrasonic vibration applied to the crimping tool so as to increase and decrease in accordance with the magnitude of the stress.
摘要翻译： 提供了一种组装滑架组件的方法，其可以通过对压接工具施加超声振动而不会引起悬架等的变形而将悬架压紧到滑架臂。 组装滑架组件的方法将设置在滑架臂的前端的设置孔和设置在悬架上的压接部对准，以将悬架设置在滑架臂上，然后通过设置在压接部中的压接孔将金属球压入同时施加超声波振动 压接工具，以将悬架压紧到托架臂上。 通过检测当金属球被压接工具压入时作用在压接工具上的应力，并且控制施加到压接工具的超声波振动的振幅以按照 压力的大小。
-
公开(公告)号：US20090146652A1
公开(公告)日：2009-06-11
申请号：US12292650
申请日：2008-11-24
申请人： Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
发明人： Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
IPC分类号： G01R33/12
CPC分类号： G11B5/455 , G11B5/4555 , G11B5/6005 , H01R13/2421 , H01R2201/20
摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.
摘要翻译： 滑块测试器包括使测试介质旋转的驱动单元，可拆卸地支撑滑块作为单个主体的固定板，以及与由固定板支撑的滑块电连接的调查装置，并且调查滑块的特性。 在该固定板上设置有可滑动地支承滑块的可动支承部30。 还提供了一种按压机构，其通过可移动支撑部件朝向介质的表面弹性地按压滑块以将滑块设置在介质表面上。 按压机构包括弹性体56，其由与所述可动支撑部接触并弹性地按压所述可动支撑部的板簧构成。
-
公开(公告)号：US07424966B2
公开(公告)日：2008-09-16
申请号：US11062789
申请日：2005-02-23
申请人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Takayoshi Matsumura
发明人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Takayoshi Matsumura
CPC分类号： B23K20/10 , B23K2101/40 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting apparatus including a horn 15 that propagates ultrasonic vibration of an ultrasonic vibrator, the horn 15 being made of a ceramic that has a higher vibration propagation speed than metal. The method includes steps of disposing the substrate 50 on a stage 13, disposing the semiconductor chip 52 on the substrate 50, and placing the semiconductor chip 52 in contact with a convex part 15a provided on the horn 15 and applying ultrasonic vibration to bond the semiconductor chip 52 to the substrate 50.
-
15.发明申请Method of ultrasonic-mounting electronic component and ultrasonic mounting machine 有权超声波安装方法电子元件和超声波安装机公开(公告)号：US20060090833A1
公开(公告)日：2006-05-04
申请号：US11041375
申请日：2005-01-25
申请人： Takayoshi Matsumura , Hidehiko Kira , Kenji Kobae , Norio Kainuma
发明人： Takayoshi Matsumura , Hidehiko Kira , Kenji Kobae , Norio Kainuma
CPC分类号： B23K20/106 , B23K20/10 , B23K2101/42 , H01L21/67144 , H01L24/75 , H01L24/81 , H01L2224/75 , H01L2224/75355 , H01L2224/81205 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/014
摘要： The ultrasonic mounting method is capable of uniformly bonding bumps of an electronic component to a circuit board and improving reliability of ultrasonic-mounting the electronic component. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. The ultrasonic vibrations are applied in a direction parallel to a surface of the electronic component, and loads are vertically applied to the surface of the electronic component in conjunction with vibration cycles of the ultrasonic vibrations.
摘要翻译： 超声波安装方法能够将电子部件的凸块均匀地接合到电路板，并且提高超声波安装电子部件的可靠性。 该方法包括对电子部件施加超声波振动以将电子部件倒装芯片连接到具有电极的电路板的步骤。 超声波振动沿平行于电子部件的表面的方向施加，并且负载与超声波振动的振动循环一起垂直地施加到电子部件的表面。
-
公开(公告)号：US20090146653A1
公开(公告)日：2009-06-11
申请号：US12292651
申请日：2008-11-24
申请人： Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
发明人： Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
IPC分类号： G01R33/12
CPC分类号： G11B5/455 , G11B5/4555 , G11B5/6005 , H01R13/2421 , H01R2201/20
摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.
-
17.发明授权Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin 有权使用具有两部分硬化树脂的延迟固化型粘合剂进行倒装芯片安装的方法公开(公告)号：US07416921B2
公开(公告)日：2008-08-26
申请号：US11066483
申请日：2005-02-28
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L24/29 , H01L24/75 , H01L24/81 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75753 , H01L2224/81205 , H01L2224/81232 , H01L2224/81801 , H01L2224/83099 , H01L2224/83102 , H01L2224/83192 , H01L2224/83874 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01327 , H01L2924/07802 , H01L2924/19043 , Y10T156/10 , H01L2924/00 , H01L2224/0401
摘要： A method of flip-chip mounting a semiconductor chip can carry out bonding at normal temperature and improves the positional accuracy of bonding. The method of flip-chip bonding a semiconductor chip 52 includes a step of providing a hardening trigger that is not heat to insulating adhesive 51 either before the semiconductor chip 52 is mounted on the substrate 50 or during bonding; and a step of bonding the bumps of the semiconductor chip to the pads of the substrate 50 by pressure welding or metal combining while hardening of the insulating adhesive 51 is progressing due to provision of the hardening trigger.
摘要翻译： 半导体芯片的倒装芯片的安装方法可以在常温下进行接合，提高接合的位置精度。 半导体芯片52的倒装芯片接合的方法包括在将半导体芯片52安装在基板50上之前或在接合期间提供不加热以绝缘粘合剂51的硬化触发的步骤; 以及通过压力焊接或金属组合将半导体芯片的凸点接合到基板50的焊盘的步骤，同时绝缘粘合剂51的硬化由于设置硬化触发而正在进行。
-
18.发明申请Method of flip-chip mounting a semiconductor chip and mounting apparatus using the same 有权半导体芯片的倒装芯片的安装方法及使用其的安装装置公开(公告)号：US20060099809A1
公开(公告)日：2006-05-11
申请号：US11066483
申请日：2005-02-28
IPC分类号： H01L21/44
CPC分类号： H01L21/563 , H01L24/29 , H01L24/75 , H01L24/81 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75753 , H01L2224/81205 , H01L2224/81232 , H01L2224/81801 , H01L2224/83099 , H01L2224/83102 , H01L2224/83192 , H01L2224/83874 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01327 , H01L2924/07802 , H01L2924/19043 , Y10T156/10 , H01L2924/00 , H01L2224/0401
摘要： A method of flip-chip mounting a semiconductor chip can carry out bonding at normal temperature and improves the positional accuracy of bonding. The method of flip-chip bonding a semiconductor chip 52 includes a step of providing a hardening trigger that is not heat to insulating adhesive 51 either before the semiconductor chip 52 is mounted on the substrate 50 or during bonding; and a step of bonding the bumps of the semiconductor chip to the pads of the substrate 50 by pressure welding or metal combining while hardening of the insulating adhesive 51 is progressing due to provision of the hardening trigger.
摘要翻译： 半导体芯片的倒装芯片的安装方法可以在常温下进行接合，提高接合的位置精度。 半导体芯片52的倒装芯片接合的方法包括在将半导体芯片52安装在基板50上之前或在接合期间提供不加热以绝缘粘合剂51的硬化触发的步骤; 以及通过压力焊接或金属组合将半导体芯片的凸点接合到基板50的焊盘的步骤，同时绝缘粘合剂51的硬化由于设置硬化触发而正在进行。
-
公开(公告)号：US20090243006A1
公开(公告)日：2009-10-01
申请号：US12402881
申请日：2009-03-12
申请人： Tetsuya TAKAHASHI , Kenji Kobae , Shuichi Takeuchi , Yoshiyuki Satoh , Hidehiko Kira , Takayoshi Matsumura
发明人： Tetsuya TAKAHASHI , Kenji Kobae , Shuichi Takeuchi , Yoshiyuki Satoh , Hidehiko Kira , Takayoshi Matsumura
CPC分类号： B81B3/0078 , B81B2201/042 , B81B2203/0109 , B81B2203/0307 , B81C1/00126 , H01L24/14 , H01L2224/1134 , H01L2224/1403 , H01L2224/73204 , H01L2924/07811 , H01L2924/1461 , H01L2924/00
摘要： According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.
摘要翻译： 根据本发明的一个方面，电子部件包括具有第一平坦表面的基板，固定到基板的第一平面表面的第一凸起，固定到基板的第一平面表面的第二凸起，距离基板的预定距离 第一凸块，包括元件的MEMS芯片，耦合到第一凸块和第二凸块的MEMS芯片，与第一平坦表面分开的MEMS芯片，与第一凸块，基板和MEMS芯片结合的粘合区域。
-
公开(公告)号：US07514788B2
公开(公告)日：2009-04-07
申请号：US11979165
申请日：2007-10-31
申请人： Kenji Kobae , Hidehiko Kira , Norio Kainuma , Takayoshi Matsumura
发明人： Kenji Kobae , Hidehiko Kira , Norio Kainuma , Takayoshi Matsumura
IPC分类号： H01L21/302
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/17 , H01L24/75 , H01L2224/0401 , H01L2224/0603 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/131 , H01L2224/13144 , H01L2224/1403 , H01L2224/16 , H01L2224/75 , H01L2224/759 , H01L2224/81136 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/00015 , H01L2224/13099 , H01L2924/00
摘要： The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic component on a circuit board is characterized in that bumps of the electronic component are respectively flip-chip-bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic component, and that a center of each of the bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction of the ultrasonic vibrations.
摘要翻译： 将电子部件安装在电路板上的结构能够将具有非常短的分离的凸块的电子部件可靠地倒置接合到电路板而没有位移。 将电子部件安装在电路板上的结构的特征在于，通过对电子部件施加超声波振动，电子部件的凸起分别与电路基板的电极倒装接合， 先前相对于每个电极的宽度方向上的中心在与超声波振动的方向平行的方向上相对移位。
-
-
-
-
-
-
-
-
-
搜索结果
60 条记录 (耗时 0.018 秒)
