公开(公告)号：US20130266249A1

公开(公告)日：2013-10-10

申请号：US13392975

申请日：2011-09-13

Applicant: Yutaka Ishibashi ,  Makoto Watanabe ,  Tetsuya Takahashi

Inventor： Yutaka Ishibashi ,  Makoto Watanabe ,  Tetsuya Takahashi

IPC: F16C33/46 ,  F16C33/66

CPC classification number: F16C33/467 ,  F16C33/4635 ,  F16C33/4676 ,  F16C33/4694 ,  F16C33/516 ,  F16C33/66 ,  F16C33/6681

Abstract: A pair of rim portions 4a and 4b is formed in the shape of a discontinuous segmental circular ring, which includes cutout portions 8a and 8b, respectively, at one position. The cutout portions of the respective rim portions are concentrically disposed so as to face each other with a predetermined interval therebetween in an axial direction while having the same phase in a circumferential direction. A plurality of pillar portions 6 form pockets 10 where rollers 14 are retained. An expandable elastic connecting portion 12, which connects one end portion 84a of one rim portion in the circumferential direction to the other end portion 82b of the other rim portion in the circumferential direction, is provided at the pair of rim portions. A convex portion 86a, which protrudes toward one end portion, is formed at the other end portion 82a of one rim portion in the circumferential direction, and a concave portion 88a, which is recessed so as to correspond to the convex portion formed at the other end portion, is formed at the one end portion. A convex portion 86b, which protrudes toward the other end portion, is formed at one end portion 84b of the other rim portion in the circumferential direction, and a concave portion 88b, which is recessed so as to correspond to the convex portion formed at the one end portion, is formed at the other end portion.

Abstract translation: 一对边缘部分4a和4b分别形成在一个位置处包括切口部分8a和8b的不连续节段圆环形状。 各个边缘部分的切口部分在轴向方向上以预定的间隔彼此相对地同心地设置，同时在圆周方向上具有相同的相位。 多个支柱部分6形成保持滚子14的凹槽10。 在一对轮辋部分设置有一个在圆周方向上将一个轮辋部分的一个端部部分84a与另一个轮辋部分的圆周方向上的另一个端部部分82b连接的可膨胀弹性连接部分12。 在圆周方向上的一个边缘部分的另一端部82a处形成有朝向一个端部突出的凸部86a，并且凹部88a与形成在另一个的凸部相对应地凹陷 端部形成在一个端部。 在另一个边缘部分的圆周方向的一个端部部分84b处形成有朝向另一个端部突出的凸部86b，并且凹部88b被凹入以对应于形成在 一端部形成在另一端部。

公开(公告)号：US08395904B2

公开(公告)日：2013-03-12

申请号：US12821938

申请日：2010-06-23

Applicant: Takayoshi Matsumura ,  Kenji Kobae ,  Shuichi Takeuchi ,  Tetsuya Takahashi

Inventor： Takayoshi Matsumura ,  Kenji Kobae ,  Shuichi Takeuchi ,  Tetsuya Takahashi

IPC: H05K7/00

CPC classification number: H01L24/11 ,  H01L24/45 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13644 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A multichip module includes a package substrate, a first semiconductor device, a second semiconductor device and a conductive bump. The first semiconductor device is flip-chip bonded to the package substrate. The first semiconductor device includes a first chip pad on a surface thereof. The second semiconductor device is mounted on the first semiconductor device. The second semiconductor device includes a second chip pad facing the first chip pad. The conductive bump connects the first chip pad to the second chip pad. The conductive bump includes a first metallic body that has a first diffusion rate and a second metallic body that has a second diffusion rate lower than the first diffusion rate.

Abstract translation: 多芯片模块包括封装基板，第一半导体器件，第二半导体器件和导电凸块。 第一半导体器件被倒装芯片结合到封装衬底。 第一半导体器件包括在其表面上的第一芯片焊盘。 第二半导体器件安装在第一半导体器件上。 第二半导体器件包括面向第一芯片焊盘的第二芯片焊盘。 导电凸块将第一芯片焊盘连接到第二芯片焊盘。 导电凸块包括具有第一扩散速率的第一金属体和具有低于第一扩散速率的第二扩散速率的第二金属体。

公开(公告)号：US08169075B2

公开(公告)日：2012-05-01

申请号：US12402881

申请日：2009-03-12

Applicant: Tetsuya Takahashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

Inventor： Tetsuya Takahashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

IPC: H01L29/40

CPC classification number: B81B3/0078 ,  B81B2201/042 ,  B81B2203/0109 ,  B81B2203/0307 ,  B81C1/00126 ,  H01L24/14 ,  H01L2224/1134 ,  H01L2224/1403 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01L2924/1461 ,  H01L2924/00

Abstract: According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.

Abstract translation: 根据本发明的一个方面，电子部件包括具有第一平坦表面的基板，固定到基板的第一平面表面的第一凸起，固定到基板的第一平面表面的第二凸起，距离基板的预定距离 第一凸块，包括元件的MEMS芯片，耦合到第一凸块和第二凸块的MEMS芯片，与第一平坦表面分开的MEMS芯片，与第一凸块，基板和MEMS芯片结合的粘合区域。

公开(公告)号：US07880227B2

公开(公告)日：2011-02-01

申请号：US12364353

申请日：2009-02-02

Applicant: Tetsuya Takahashi

Inventor： Tetsuya Takahashi

IPC: H01L29/94

CPC classification number: H01L29/7397 ,  H01L29/0696 ,  H01L29/404 ,  H01L29/407

Abstract: A trench IGBT is disclosed which includes a semiconductor substrate having formed therein a set of cell trenches formed centrally and a set of annular guard trenches concentrically surrounding the cell trenches. The cell trenches receive cell trench conductors via cell trench insulators for providing IGBT cells. The guard trenches receive guard trench conductors via guard trench insulators for enabling the IGBT to withstand higher voltages through mitigation of field concentrations. Capacitive coupling conductors overlie the guard trench conductors via a dielectric layer, each for capacitively coupling together two neighboring ones of the guard trench conductors. The capacitive coupling conductors are easily adjustably variable in shape, size and placement relative to the guard trench conductors for causing the individual guard trench conductors to possess potentials for an optimal contour of the depletion layer.

Abstract translation: 公开了一种沟槽IGBT，其包括半导体衬底，该半导体衬底在其中形成有一组中心形成的单元沟道，以及一组围绕电池槽的环形保护沟槽。 单元沟槽通过用于提供IGBT单元的单元沟槽绝缘体接收单元沟道导体。 保护沟槽通过保护沟槽绝缘体接收保护沟槽导体，以使IGBT能够通过减小场浓度来承受更高的电压。 电容耦合导体经由电介质层覆盖保护沟槽导体，每个用于将两个相邻的保护沟槽导体电容耦合在一起。 电容耦合导体相对于保护沟槽导体的形状，尺寸和布置容易地可调节地变化，以使各个保护沟槽导体具有耗尽层的最佳轮廓的电位。

公开(公告)号：US20110003519A1

公开(公告)日：2011-01-06

申请号：US12865635

申请日：2008-01-30

Applicant: Kohei Oka ,  Shozo Sakaue ,  Shunichi Kitayama ,  Yoichi Hisamori ,  Yoshitaka Ono ,  Toshikazu Karita ,  Tetsuya Takahashi

Inventor： Kohei Oka ,  Shozo Sakaue ,  Shunichi Kitayama ,  Yoichi Hisamori ,  Yoshitaka Ono ,  Toshikazu Karita ,  Tetsuya Takahashi

IPC: H01R4/10 ,  H01R43/00

CPC classification number: H01R4/06 ,  H05K3/202 ,  H05K3/326 ,  Y10T29/49117 ,  Y10T29/49151

Abstract: A terminal joining structure includes a terminal having a tubular barrel portion and a flange portion that is integrally formed at the axis-direction end of the barrel portion, a conductor substrate on which is opened a through-hole for inserting the barrel portion, and a ring that fits on the barrel portion on the opposite side of the conductor substrate. On the barrel portion is formed a taper that increases in diameter toward the flange portion. The diameter of the larger-diameter portion of the taper is larger than the inner diameter of the through-hole. The terminal is caulked to cause radially outward expansion of an end part of the barrel portion, which passes through the ring, on the opposite side of the conductor substrate and is fixed to the conductor substrate together with the ring.

Abstract translation: 端子接合结构包括：端子，其具有管状筒部和在筒部的轴向端部一体形成的凸缘部，导体基板上开有用于插入筒部的通孔， 环，其配合在导体基板的相对侧的筒部上。 在筒形部分上形成了朝向凸缘部分直径增大的锥形。 锥形的较大直径部分的直径大于通孔的内径。 端子被铆接以在导体基板的相对侧上引导通过环的筒部的端部的径向向外膨胀，并与环一起固定到导体基板。

公开(公告)号：US20100326335A1

公开(公告)日：2010-12-30

申请号：US12792057

申请日：2010-06-02

Applicant: Tetsuya Takahashi ,  Koichi Nakamura

Inventor： Tetsuya Takahashi ,  Koichi Nakamura

IPC: B62B5/00 ,  B62B3/02

CPC classification number: B62B3/04 ,  B62B2203/073 ,  B62B2203/10 ,  H05K7/1488

Abstract: The present application is a technique to be used for mounting a heavy article to be mounted from a packed body to a rack or the like. In this application, amounting jig is used for a moving and installation procedure, the mounting jig including a cover member that is detachably secured to a table of an elevating lift having an article to be mounted placed thereon for transportation, the cover member covering an upper surface of the table, an upper surface of the cover member being provided with a low friction treatment.

Abstract translation: 本申请是用于将从包装体安装的重物品安装到搁架等上的技术。 在该应用中，移动和安装程序使用相当的夹具，该安装夹具包括可拆卸地固定到具有待安装物品的升降升降台的托架上以便运输的盖构件，盖构件覆盖上部 表面的表面，盖构件的上表面设置有低摩擦处理。

公开(公告)号：US20100258640A1

公开(公告)日：2010-10-14

申请号：US12756487

申请日：2010-04-08

Applicant: Shuichi Takeuchi ,  Kenji Kobae ,  Takayoshi Matsumura ,  Tetsuya Takahashi

Inventor： Shuichi Takeuchi ,  Kenji Kobae ,  Takayoshi Matsumura ,  Tetsuya Takahashi

IPC: G06K19/077 ,  B29C65/00

CPC classification number: G06K19/07749 ,  G06K19/07724 ,  G06K19/07728 ,  Y10T156/10

Abstract: An RFID tag includes an inlet on which an antenna pattern serving as an antenna for communication and an IC chip electrically connected to the antenna pattern are mounted. The RFID tag also includes an exterior body that encloses the inlet from outside and a hollow space that is formed by the inlet and the exterior body and that is filled with gas or a gel material.

Abstract translation: RFID标签包括其上安装用作通信用天线的天线图案和与天线图案电连接的IC芯片的入口。 RFID标签还包括从外部包围入口的外部主体和由入口和外部主体形成并且填充有气体或凝胶材料的中空空间。

公开(公告)号：US07787207B2

公开(公告)日：2010-08-31

申请号：US12263134

申请日：2008-10-31

Applicant: Tetsuya Takahashi

Inventor： Tetsuya Takahashi

IPC: G11B5/60

CPC classification number: G11B5/607 ,  G11B5/455 ,  G11B5/5534 ,  G11B5/5565 ,  G11B5/6029

Abstract: It is related to a head control method. The head control method controls a protruding flying height of a head in which an energization amount applied to a heater element in the head to thermally expands the head. The head control method includes a resistance-value measuring step of measuring a resistance value of the storage element, an energization-amount calculating step of calculating an energization amount applied to the heater element such that the resistance value measured in the resistance-value measuring step reaches a reference resistance value, and a heater control step of performing control to apply the energization amount calculated in the energization-amount calculating step to the heater element.

Abstract translation: 它与头部控制方法有关。 头部控制方法控制头部的突出飞行高度，其中施加到头部中的加热器元件的通电量使头部热膨胀。 头控制方法包括测量存储元件的电阻值的电阻值测量步骤，通电量计算步骤，计算施加到加热器元件的通电量，使得在电阻值测量步骤中测量的电阻值 达到参考电阻值;以及加热器控制步骤，执行将在通电量计算步骤中计算的通电量施加到加热器元件的控制。

公开(公告)号：US20100063001A1

公开(公告)日：2010-03-11

申请号：US12477492

申请日：2009-06-03

Applicant: James F. Jolly ,  Krzysztof Klimaszewski ,  Yuuji Nakanishi ,  Hirotaka Matsubara ,  Tetsuya Takahashi ,  Kyouichi Nishio

Inventor： James F. Jolly ,  Krzysztof Klimaszewski ,  Yuuji Nakanishi ,  Hirotaka Matsubara ,  Tetsuya Takahashi ,  Kyouichi Nishio

IPC: A61K31/737 ,  C12P19/26 ,  C08B37/08 ,  A61P19/02

CPC classification number: C12P19/04 ,  A61K31/726 ,  A61K31/737 ,  C08B37/0069 ,  C08L5/08 ,  C12P19/26

Abstract: Described is chondroitin sulfate obtained from microbial sources, and related compositions and methods.

Abstract translation: 描述了从微生物来源获得的硫酸软骨素，以及相关的组合物和方法。

公开(公告)号：US20090301908A1

公开(公告)日：2009-12-10

申请号：US12479321

申请日：2009-06-05

Applicant: Tetsuya Takahashi ,  Makoto Fukuda ,  Hayato Kubo ,  Norio Nakamura

Inventor： Tetsuya Takahashi ,  Makoto Fukuda ,  Hayato Kubo ,  Norio Nakamura

IPC: B65D71/00 ,  B65D85/00

CPC classification number: B65D19/20 ,  B65D5/5035 ,  B65D81/107 ,  B65D2519/00019 ,  B65D2519/00054 ,  B65D2519/00159 ,  B65D2519/00194 ,  B65D2519/00273 ,  B65D2519/00288 ,  B65D2519/00323 ,  B65D2519/00333 ,  B65D2519/00497 ,  B65D2519/00562 ,  B65D2519/00621 ,  B65D2519/00661 ,  B65D2519/00726 ,  B65D2519/00805 ,  B65D2585/6837 ,  H05K7/1488

Abstract: There is provided a package of which package objective article is transferred to an up-and-down lift easily even if the package objective article is heavy.A package includes a base portion. The base portion includes a top face opening type of an outer box and a top face opening type of an inner box housed in the outer box. A beam is provided under the outer box. Four columns are arranged on four corners in the inner box. Two columns are arranged in the inner box. The base portion has a top board. The top board is supported by the columns, and is set in the inner box. A buffer member is set on the upper face of the top board. The buffer member acts as an article mounting portion. And, an upper face of the buffer member acts as an article mounting face. The article mounting face is positioned higher than a table face of an up-and-down lift.

Abstract translation: 即使包装物品很重，也可以容易地将包装物品的物品容易地转移到上下升降机中。 包装包括基部。 基部包括外箱的顶面开口型和容纳在外箱中的内箱的顶面开口型。 在外箱下设有一个梁。 四列安排在内箱的四个角落。 内箱内装有两列。 基部具有顶板。 顶板由列支持，并设置在内箱中。 缓冲构件设置在顶板的上表面上。 缓冲部件用作物品安装部分。 并且，缓冲部件的上表面用作物品安装面。 物品安装面的位置高于上下升降机的台面。