公开(公告)号：US5926374A

公开(公告)日：1999-07-20

申请号：US61869

申请日：1998-04-17

申请人： Shigeo Onoda ,  Tomomi Morii ,  Kiyotaka Nishino

发明人： Shigeo Onoda ,  Tomomi Morii ,  Kiyotaka Nishino

IPC分类号： B42D15/10 ,  G06K19/077 ,  H05K5/02 ,  H05K1/14 ,  B65D85/86

CPC分类号： H05K5/0269

摘要： There is provided an IC card where a pair of, upper and lower metal panels are respectively fixed to the frame; edge portions of the metal panel are provided with bend portions; grooves each of which comprises a pair of uneven vertical walls having a plurality of depressions and projections extending in the direction of the width of the frame are provided on the top and bottom surfaces of the frame; the distance between the projections on both the uneven vertical walls in the direction of the width of the frame is set so as to be smaller than the thickness of the bend portions by a given amount; and the metal panel is fixed to the frame with the bend portions press-fitted into the grooves along the projections. The IC card is advantageous in the manufacturing cost and is capable of stably providing a fixing force sufficient to withstand a long-term use, with regard to the fixation of upper and lower panel members to a frame.

摘要翻译： 提供了一个IC卡，其中一对上，下金属板分别固定在框架上; 金属面板的边缘部分设有弯曲部分; 在框架的顶表面和底表面上设置有包括一对不平坦的垂直壁，其具有在框架的宽度方向上延伸的多个凹陷和突起; 将两个不平坦的垂直壁上的凸起在框架的宽度方向上的距离设定为小于弯曲部分的厚度一定量; 并且金属板固定到框架上，其中弯曲部分沿着凸起压配合到凹槽中。 IC卡在制造成本方面是有利的，并且能够稳定地提供足以承受长期使用的固定力，关于将上板和下板构件固定到框架上。

公开(公告)号：US5578868A

公开(公告)日：1996-11-26

申请号：US449431

申请日：1995-05-24

申请人： Jun Obuchi ,  Hiroshi Miura ,  Tomomi Morii ,  Shigeo Onoda

发明人： Jun Obuchi ,  Hiroshi Miura ,  Tomomi Morii ,  Shigeo Onoda

IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L23/538 ,  H01L23/02

CPC分类号： H01L23/5388 ,  G06K19/077 ,  H01L2924/0002

摘要： An IC memory card has a connector that cannot warp during the manufacturing process even if the connector is long, such as a connector at one longer side of the IC memory card with an increased number of poles. The IC memory card has grooves in the surfaces of a flange portion of the connector body opposing a surface with which the connection with an external unit is established, the grooves being adjacent the connector body and extending lengthwise along all of the longer side of the IC memory card for preventing warping.

摘要翻译： IC存储卡具有在制造过程中即使连接器较长也不会翘曲的连接器，例如具有增加的极数的IC存储卡的一个较长侧的连接器。 IC存储卡在连接器主体的凸缘部分的与形成与外部单元的连接的表面相对的表面中具有凹槽，凹槽与连接器主体相邻并且沿IC的所有长边沿纵向延伸 用于防止翘曲的存储卡。

公开(公告)号：US4905124A

公开(公告)日：1990-02-27

申请号：US174955

申请日：1988-03-29

申请人： Toshinobu Banjo ,  Shigeo Onoda ,  Makoto Omori

发明人： Toshinobu Banjo ,  Shigeo Onoda ,  Makoto Omori

IPC分类号： B42D15/10 ,  G06K19/077 ,  G11C5/00 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36

CPC分类号： H05K1/117 ,  G06K19/07743 ,  H05K1/141 ,  H05K2201/049 ,  H05K3/368

摘要： An IC card having a circuit board provided with wiring formed on at least one of two surfaces of the circuit board, a terminal base fixed to one surface of a front portion of the circuit board and having a multiplicity of electrode terminals disposed on its upper surface, a plurality of electronic parts mounted on the two surfaces of the circuit board, and a package in which the circuit board on which the electronic parts are mounted is incorporated while exposing the electrode terminals to the outside of the package.

摘要翻译： 一种IC卡，其具有电路板，该电路板设置有形成在所述电路板的两个表面中的至少一个表面上的布线，固定在所述电路板的前部的一个表面上并具有多个电极端子的端子基座， ，安装在电路板的两个表面上的多个电子部件和其中安装有电子部件的电路板的封装，同时将电极端子暴露于封装的外部。

公开(公告)号：US4864116A

公开(公告)日：1989-09-05

申请号：US166362

申请日：1988-03-10

申请人： Toshinobu Banjo ,  Tetsuya Ueda ,  Shigeo Onoda ,  Yasushi Kasatani

发明人： Toshinobu Banjo ,  Tetsuya Ueda ,  Shigeo Onoda ,  Yasushi Kasatani

IPC分类号： G06K7/00 ,  G06K7/015 ,  G06K7/06 ,  G06K19/07 ,  H01R13/64 ,  H01R13/642

CPC分类号： G06K7/0047 ,  H01R12/721 ,  H01R12/7005 ,  H01R13/64 ,  H01R2107/00 ,  H01R24/62

摘要： A mechanism for connecting an IC card and an external device to each other, having: a plurality of electrode terminals formed on a package of the IC card incorporating a semiconductor device and used to connect the semiconductor device to the external device; at least one engagement recess and/or engagement projection formed on the package of the IC card; and a connector provided in the external device. This connector is provided with an insertion hole, a plurality of electrode-contacting pieces disposed in the insertion hole and capable of contacting the plurality of electrode terminals of the IC card when the IC card is inserted into the connector, and at least one engagement projection and/or engagement recess formed inside the insertion hole and capable of engaging the engagement recess and/or engagement projection formed on the package to enable a particular type of the IC card to be inserted into the connector.

摘要翻译： 一种用于将IC卡和外部设备彼此连接的机构，具有：多个电极端子，形成在包含半导体器件的IC卡的封装上，用于将半导体器件连接到外部设备; 形成在所述IC卡的封装上的至少一个接合凹部和/或接合突起; 以及设置在外部设备中的连接器。 该连接器设置有插入孔，多个电极接触片设置在插入孔中，并且当IC卡插入到连接器中时能够接触IC卡的多个电极端子，并且至少一个接合突起 和/或接合凹槽，其形成在插入孔内部并且能够接合形成在包装上的接合凹部和/或接合突起，以使特定类型的IC卡能够插入到连接器中。

公开(公告)号：US5173841A

公开(公告)日：1992-12-22

申请号：US674167

申请日：1991-03-25

申请人： Takeshi Uenaka ,  Jun Ohbuchi ,  Hajime Maeda ,  Toru Tachikawa ,  Shigeo Onoda

发明人： Takeshi Uenaka ,  Jun Ohbuchi ,  Hajime Maeda ,  Toru Tachikawa ,  Shigeo Onoda

IPC分类号： B42D15/10 ,  B42D15/00 ,  G06K19/077 ,  H05K5/02 ,  H05K7/14

CPC分类号： H05K7/1417 ,  H05K5/0256 ,  Y10S439/946

摘要： A semiconductor device card and a method of manufacturing the card. A frame includes an integral spacer which fills a dead space on a circuit board to eliminate the need for positioning a separate spacer in the dead space on the circuit board and fixing the spacer in place with a bonding sheet or the like. In a semiconductor device card in which a spacer for filling a dead space on the circuit board is bonded to a corresponding panel, a recess is formed on the surface of the spacer bonded to the obverse or reverse panel to reduce undulations occurring in the panel surface.

摘要翻译： 半导体器件卡和制造该卡的方法。 框架包括一个整体间隔件，其填充电路板上的死空间，以消除将电路板上的死空间中的单独间隔件定位并且用隔离片等固定隔离件的需要。 在将用于填充电路板上的死空间的间隔物接合到相应面板的半导体器件卡中，在与正面或反面板接合的间隔物的表面上形成凹部，以减少在面板表面中发生的起伏 。

公开(公告)号：US5053613A

公开(公告)日：1991-10-01

申请号：US529434

申请日：1990-05-29

申请人： Shigeo Onoda

发明人： Shigeo Onoda

IPC分类号： G06K19/077

CPC分类号： G06K19/07735 ,  G06K19/077

摘要： An IC card has a card body with a plurality of slits extending through the thickness card body and a pair of metallic panels secured to the card body. The metallic panels have engaging portions which extend into the slits when the metallic panels are secured to the card body so that the engaging portions of both panels engage each other within respective slits to fasten both metallic panels to the card body. The electrical potentials of both metallic panels are equalized through these engaging portions.

摘要翻译： IC卡具有一个具有延伸穿过厚度卡片主体的多个狭缝的卡体和一对固定在卡体上的金属板。 当金属板固定到卡体上时，金属板具有延伸到狭缝中的接合部分，使得两个板的接合部分在相应的狭缝内彼此接合以将两个金属板紧固到卡体。 两个金属板的电位通过这些接合部分均衡。

公开(公告)号：US5047894A

公开(公告)日：1991-09-10

申请号：US514933

申请日：1990-04-26

申请人： Shigeo Onoda ,  Hajime Maeda

发明人： Shigeo Onoda ,  Hajime Maeda

IPC分类号： G06K19/077

CPC分类号： G06K19/07743

摘要： An IC card having a shutter, in which the right and left sides of the shutter are bent to form L-shaped flanges enclosing the sides of an electrode terminal board, the shutter sliding over the electrode terminal board.

公开(公告)号：US4838804A

公开(公告)日：1989-06-13

申请号：US173149

申请日：1988-03-25

申请人： Toshinobu Banjo ,  Tetsuya Ueda ,  Shigeo Onoda ,  Yasushi Kasatani

发明人： Toshinobu Banjo ,  Tetsuya Ueda ,  Shigeo Onoda ,  Yasushi Kasatani

IPC分类号： G06K7/00 ,  H01R12/50 ,  H01R13/62 ,  H01R13/71

CPC分类号： G06K7/0047 ,  H01R12/722 ,  H01R23/70 ,  H01R13/71 ,  Y10S439/955

摘要： A connection mechanism for connecting an IC card and an external device to each other, having: a plurality of electrode terminals formed on the IC card package in which a semiconductor device is incorporated, the electrode terminals being adapted to connect the semiconductor device to the external device; a pair of engagement recesses formed on the package of the IC card; and a connector provided in the external device, the connector having a card receiving portion into which the IC card is inserted, a plurality of electrode-contacting pieces disposed inside the card receiving portion and capable of contacting the plurality of electrode terminals of the IC card when the IC card is inserted into the card receiving portion to a predetermined position, and a pair of retaining members disposed on the card receiving portion and capable of advancing toward or retreating from the engagement recesses of the IC card and resiliently engaging the engagement recesses so as to retain the IC card at the predetermined position when the IC card is inserted to the predetermined position.

公开(公告)号：US6031278A

公开(公告)日：2000-02-29

申请号：US954732

申请日：1997-10-20

申请人： Shigeo Onoda ,  Katsunori Ochi ,  Jun Ohbuchi

发明人： Shigeo Onoda ,  Katsunori Ochi ,  Jun Ohbuchi

IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L23/538 ,  H01L25/065 ,  H05K5/02 ,  H01L23/02

CPC分类号： H05K5/0269 ,  H01L23/5388 ,  H01L25/0652 ,  H01L2924/0002

摘要： An IC card, and manufacturing method thereof, are provided in which a pair of upper and lower metal panels are fixed to the top and bottom surfaces of a resin frame. Projections projecting upward or downward and having a given height are formed at a given distance from the outside edges of the frame. Cut-outs capable of fitting on the projections are provided on the metal panels, and the metal panels are assembled on the top and bottom surfaces of the frame with the cut-outs fitted on the corresponding projections. A portion of each projection is then deformed by pressing on the metal panels from above or below under a predetermined condition so that the metal panels are riveted to the frame.

摘要翻译： 提供一种IC卡及其制造方法，其中一对上金属板和下金属板固定在树脂框架的顶表面和底表面上。 从框架的外边缘以给定距离形成向上或向下突出并且具有给定高度的突出部。 在金属板上设有能够装配在突起上的切口，并且将金属板组装在框架的顶表面和底表面上，并将切口安装在相应的突出部上。 然后通过在预定条件下从上方或下方按压金属板而使每个突起的一部分变形，使得金属板铆接到框架上。

公开(公告)号：US5912806A

公开(公告)日：1999-06-15

申请号：US772520

申请日：1996-12-24

申请人： Shigeo Onoda ,  Katsunori Ochi ,  Jun Ohbuchi ,  Makoto Omori

发明人： Shigeo Onoda ,  Katsunori Ochi ,  Jun Ohbuchi ,  Makoto Omori

IPC分类号： B42D15/10 ,  G06K19/077 ,  H05K5/02 ,  H05K1/14

CPC分类号： H05K5/0269 ,  G06K19/077 ,  Y10S439/946

摘要： An IC card (1) has a shape of a substantially flat rectangular parallelepiped. The IC card (1) has electronic devices (2) including integrated circuits, a substrate (3) and a frame (5) for supporting the electronic devices (2), a first panel (6c) covering the upper surface of the frame (5), and a second panel (6d) covering the lower surface of the frame (5). Hereupon, the first panel (6c) is directly mounted to the frame (5) in such a manner that each of the left and right end portions (15) of the first panel (6c) is bent twice in accordance with the outer surface of the frame (5) and further each of edges of the left and right end portions (15) is fastened to the lower surface of the frame (5).

摘要翻译： IC卡（1）具有基本平坦的长方体形状。 IC卡（1）具有包括集成电路的电子设备（2），用于支撑电子设备（2）的基板（3）和框架（5），覆盖框架的上表面的第一面板（6c） 5）和覆盖框架（5）的下表面的第二面板（6d）。 因此，第一面板（6c）以这样的方式直接安装到框架（5），使得第一面板（6c）的左端部和右端部部分（15）根据 框架（5）以及左端部和右端部部分（15）的每个边缘被紧固到框架（5）的下表面。