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28 条记录 (耗时 0.02 秒)

    Upstream dust filters by retrofitting parallel path PCB cooling
    11.
    发明授权
    Upstream dust filters by retrofitting parallel path PCB cooling 有权
    上游除尘过滤器通过改装平行路径PCB冷却

    公开(公告)号：US07573708B2

    公开(公告)日：2009-08-11

    申请号：US11823674

    申请日：2007-06-28

    申请人： Thomas E. Stewart ,  Timothy W. Olesiewicz

    发明人： Thomas E. Stewart ,  Timothy W. Olesiewicz

    IPC分类号： G06F1/16

    CPC分类号： H05K7/20563

    摘要： An apparatus for cooling a computer system includes a fan for flowing an air to a first assembly and a second assembly, a first filter for filtering an air to a first assembly, and a second filter for filtering an air to a second assembly. The first filter is disposed at a side of the first assembly and the second filter is disposed on an opening of a wall which separates the first assembly and the second assembly.

    摘要翻译： 一种用于冷却计算机系统的装置包括用于将空气流到第一组件和第二组件的风扇，用于将空气过滤到第一组件的第一过滤器和用于将空气过滤到第二组件的第二过滤器。 第一过滤器设置在第一组件的一侧，第二过滤器设置在分隔第一组件和第二组件的壁的开口上。

    Self-installing heat sink
    12.
    发明授权
    Self-installing heat sink 有权
    自安装散热器

    公开(公告)号：US07187552B1

    公开(公告)日：2007-03-06

    申请号：US11072977

    申请日：2005-03-04

    申请人： Thomas E. Stewart ,  Timothy W. Olesiewicz

    发明人： Thomas E. Stewart ,  Timothy W. Olesiewicz

    IPC分类号： H05K7/20

    CPC分类号： H01L23/367 ,  G06F1/185 ,  G06F1/20 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A circuit board assembly may include a heat sink that couples with a surface a circuit module installed on the circuit board. The heat sink may automatically couple to the surface of the circuit module when the circuit module is installed on the circuit board. The heat sink may include a thermal interface element that contacts the surface of the circuit module. A biasing element may be coupled between the body and the base to urge a body of the heat sink into contact with the circuit module when the circuit module is installed on the circuit board. In some embodiments, a heat sink may automatically couple with the circuit module when a locking member for the circuit module is actuated to a closed position. In some embodiments, a heat sink may automatically couple with a circuit module when an ejector for the circuit module is actuated. In some embodiments, a heat sink may include an ejector and a locking member for a circuit module.

    摘要翻译： 电路板组件可以包括与安装在电路板上的电路模块的表面耦合的散热器。 当电路模块安装在电路板上时，散热器可自动耦合到电路模块的表面。 散热器可以包括接触电路模块表面的热接口元件。 当电路模块安装在电路板上时，偏置元件可以联接在主体和基座之间，以将散热器的主体与电路模块接触。 在一些实施例中，当用于电路模块的锁定构件被致动到关闭位置时，散热器可以自动地与电路模块耦合。 在一些实施例中，当用于电路模块的喷射器被致动时，散热器可以自动地与电路模块耦合。 在一些实施例中，散热器可以包括用于电路模块的喷射器和锁定构件。

    Methods for Fabricating Multi-Terminal Phase Change Devices
    16.
    发明申请
    Methods for Fabricating Multi-Terminal Phase Change Devices 有权
    多端相变装置的制造方法

    公开(公告)号：US20080206922A1

    公开(公告)日：2008-08-28

    申请号：US12116911

    申请日：2008-05-07

    申请人： Antonietta Oliva ,  Louis Charles Kordus ,  Narbeh Derhacobian ,  Vei-Han Chan ,  Thomas E. Stewart

    发明人： Antonietta Oliva ,  Louis Charles Kordus ,  Narbeh Derhacobian ,  Vei-Han Chan ,  Thomas E. Stewart

    IPC分类号： H01L45/00

    CPC分类号： H01L45/1683 ,  H01L45/06 ,  H01L45/1206 ,  H01L45/122 ,  H01L45/1226 ,  H01L45/126

    摘要： Phase change devices, and particularly multi-terminal phase change devices, include first and second active terminals bridged together by a phase-change material whose conductivity can be modified in accordance with a control signal applied to a control electrode. This structure allows an application in which an electrical connection can be created between the two active terminals, with the control of the connection being effected using a separate terminal or terminals. Accordingly, the resistance of the heater element can be increased independently from the resistance of the path between the two active terminals. This allows the use of smaller heater elements thus requiring less current to create the same amount of Joule heating per unit area. The resistance of the heating element does not impact the total resistance of the phase change device. The programming control can be placed outside of the main signal path through the phase change device, reducing the impact of the associated capacitance and resistance of the device.

    摘要翻译： 相变装置，特别是多端子相变装置，包括通过相变材料桥接在一起的第一和第二有源端子，其导电性可以根据施加到控制电极的控制信号进行修改。 这种结构允许在两个有效端子之间可以产生电连接的应用，连接的控制使用单独的终端或终端实现。 因此，可以独立于两个有源端子之间的路径的电阻来增加加热器元件的电阻。 这允许使用较小的加热器元件，因此需要较少的电流以在每单位面积上产生相同量的焦耳加热。 加热元件的电阻不影响相变装置的总电阻。 编程控制可以通过相变装置放置在主信号路径之外，减少相关电容和器件电阻的影响。

    High-load even pressure heatsink loading for low-profile blade computer applications
    17.
    发明申请
    High-load even pressure heatsink loading for low-profile blade computer applications 有权
    高负载平均压力散热器负载，适用于薄型刀片式计算机应用

    公开(公告)号：US20080165501A1

    公开(公告)日：2008-07-10

    申请号：US11651762

    申请日：2007-01-10

    申请人： Thomas E. Stewart ,  Daniel Hruska

    发明人： Thomas E. Stewart ,  Daniel Hruska

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4006 ,  H01L23/3672 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus for dissipating heat in a computer system includes a heat sink, at least one fastener which secures the heat sink to at least one first support member, and at least one cup. The first support member has a top side and a bottom side. The at least one cup includes a cylindrical cavity, an upper protruding lip, and a lower base having a hole through which the at least one fastener passes. A method for dissipating heat in a computer system includes, mounting a heat emitting component onto a printed circuit board, pressing a heat sink into thermal contact with a heat emitting component, inserting a cup into an aperture of the heat sink, and supporting a heat sink.

    摘要翻译： 用于在计算机系统中散热的装置包括散热器，至少一个将散热器固定到至少一个第一支撑构件的紧固件和至少一个杯。 第一支撑构件具有顶侧和底侧。 所述至少一个杯包括圆柱形空腔，上突出唇缘和具有孔的下底座，所述至少一个紧固件穿过所述孔。 一种用于在计算机系统中散热的方法包括：将散热部件安装到印刷电路板上，将散热片与发热部件热接触，将杯子插入散热片的孔中，并支撑热量 水槽。

    High-load even pressure heatsink loading for low-profile blade computer applications
    18.
    发明授权
    High-load even pressure heatsink loading for low-profile blade computer applications 有权
    高负载平均压力散热器负载，适用于薄型刀片式计算机应用

    公开(公告)号：US07474530B2

    公开(公告)日：2009-01-06

    申请号：US11651762

    申请日：2007-01-10

    申请人： Thomas E. Stewart ,  Daniel Hruska

    发明人： Thomas E. Stewart ,  Daniel Hruska

    IPC分类号： H05K7/20 ,  H01L23/427

    CPC分类号： H01L23/4006 ,  H01L23/3672 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus for dissipating heat in a computer system includes a heat sink, at least one fastener which secures the heat sink to at least one first support member, and at least one cup. The first support member has a top side and a bottom side. The at least one cup includes a cylindrical cavity, an upper protruding lip, and a lower base having a hole through which the at least one fastener passes. A method for dissipating heat in a computer system includes, mounting a heat emitting component onto a printed circuit board, pressing a heat sink into thermal contact with a heat emitting component, inserting a cup into an aperture of the heat sink, and supporting a heat sink.

    摘要翻译： 用于在计算机系统中散热的装置包括散热器，至少一个将散热器固定到至少一个第一支撑构件的紧固件和至少一个杯。 第一支撑构件具有顶侧和底侧。 所述至少一个杯包括圆柱形空腔，上突出唇缘和具有孔的下底座，所述至少一个紧固件穿过所述孔。 一种用于在计算机系统中散热的方法包括：将散热部件安装到印刷电路板上，将散热片与发热部件热接触，将杯子插入散热片的孔中，并支撑热量 水槽。

    System for mounting and cooling circuit boards
    19.
    发明授权
    System for mounting and cooling circuit boards 有权
    电路板安装和冷却系统

    公开(公告)号：US07256992B1

    公开(公告)日：2007-08-14

    申请号：US10930468

    申请日：2004-08-31

    申请人： Thomas E. Stewart ,  Timothy W. Olesiewicz

    发明人： Thomas E. Stewart ,  Timothy W. Olesiewicz

    IPC分类号： G06F1/20

    CPC分类号： G06F1/20 ,  H05K7/20563 ,  H05K7/20672

    摘要： A computer system may include one or more modules coupled to a backplane in a housing. A module support structure may allow cooling air to flow upwardly across the modules. In one embodiment, a power section of the module may be located downstream of a data section of the module. In another embodiment, offset brackets may hold a circuit board of a module at an offset relative to a pair of guides in a module support structure. In another embodiment, a heat sink may be coupled between heat producing components on a pair of adjacent modules. In another embodiment, a converter apparatus may support a plurality of modules in a different number of slots in a system. In another embodiment, a heat sink on a module may include a pair of heat pipes arranged such that the heat pipes diverge from one another toward the condenser ends of the heat pipes.

    摘要翻译： 计算机系统可以包括耦合到壳体中的背板的一个或多个模块。 模块支撑结构可以允许冷却空气向上流过模块。 在一个实施例中，模块的功率部分可以位于模块的数据部分的下游。 在另一个实施例中，偏移支架可以将模块的电路板相对于模块支撑结构中的一对引导件保持偏移。 在另一个实施例中，散热器可以耦合在一对相邻模块上的发热部件之间。 在另一个实施例中，转换器装置可以支持系统中不同数量的时隙中的多个模块。 在另一个实施例中，模块上的散热器可以包括一对热管，其布置成使得热管彼此分开朝向热管的冷凝器端。