High-frequency bipolar transistor
    11.
    发明授权
    High-frequency bipolar transistor 有权
    高频双极晶体管

    公开(公告)号:US07719088B2

    公开(公告)日:2010-05-18

    申请号:US11254502

    申请日:2005-10-20

    CPC classification number: H01L29/66272 H01L29/0821 H01L29/41708 H01L29/732

    Abstract: A high-frequency bipolar transistor includes an emitter contact adjoining an emitter connection region, a base contact adjoining a base connection region, and a collector contact adjoining a collector connection region. A first insulation layer is disposed on the base connection region. The collector connection region contains a buried layer, which connects the collector contact to a collector zone. A silicide or salicide region is provided on the buried layer and connects the collector contact to the collector zone in a low-impedance manner. A second insulation layer is disposed on the collector connection region but not on the silicide region.

    Abstract translation: 高频双极晶体管包括邻接发射极连接区域的发射极接触件,邻接基极连接区域的基极接触件和邻接集电极连接区域的集电极接触件。 第一绝缘层设置在基底连接区域上。 集电极连接区域包含埋设层,该埋层将集电极触点连接到集电区。 在掩埋层上提供硅化物或自对准硅化物区域,并以低阻抗方式将集电极触点连接到集电极区域。 第二绝缘层设置在集电极连接区域上,但不在硅化物区域上。

    Method for the production of a bipolar semiconductor component, especially a bipolar transistor, and corresponding bipolar semiconductor component
    12.
    发明授权
    Method for the production of a bipolar semiconductor component, especially a bipolar transistor, and corresponding bipolar semiconductor component 有权
    用于生产双极半导体部件,特别是双极晶体管的方法和相应的双极半导体部件

    公开(公告)号:US07285470B2

    公开(公告)日:2007-10-23

    申请号:US11240297

    申请日:2005-09-30

    Abstract: The invention relates to a method for producing a bipolar semiconductor element, especially a bipolar transistor, and a corresponding bipolar semiconductor component. The inventive method comprises the following steps: a first semiconductor area (32, 34) of a first conductivity type (p) is provided above a semiconductor substrate (1); a connecting area (40) of the first conductivity type (p ) is provided above the semiconductor area (32, 34); a first insulating area (35″) is provided above the connecting area (40); a window (F) is formed within the first insulating area (35″) and the connecting area (40) so as to at least partly expose the semiconductor area (32, 34); a sidewall spacer (80) is provided in the window (F) in order to insulate the connecting area (40); a second semiconductor area (60) of the second conductivity type (n+) is provided so as to cover the sidewall spacer (80) and a portion of the surrounding first insulating area (35″); the surrounding first insulating area (35″) and the sidewall spacer (80) are removed in order to form a gap (LS) between the connecting area (40) and the second semiconductor area (60); and the gap (LS) is sealed by means of a second insulating area (100) while a gaseous atmosphere or a vacuum atmosphere is provided inside the sealed gap (LS).

    Abstract translation: 本发明涉及一种用于制造双极型半导体元件,特别是双极晶体管的方法和相应的双极半导体元件。 本发明的方法包括以下步骤:第一导电类型(p)的第一半导体区域(32,34)设置在半导体衬底(1)的上方; 在半导体区域(32,34)的上方设置第一导电类型(p +)的连接区域(40)。 第一绝缘区域(35“)设置在连接区域40上方; 在第一绝缘区域(35“)和连接区域(40)内形成窗口(F),以便至少部分地暴露半导体区域(32,34); 在窗口(F)中设置侧壁间隔件(80)以使连接区域(40)绝缘; 提供第二导电类型(n +)的第二半导体区域(60),以覆盖侧壁间隔物(80)和周围的第一绝缘区域(35“)的一部分; 为了在连接区域(40)和第二半导体区域(60)之间形成间隙(LS),除去周围的第一绝缘区域(35“)和侧壁间隔物(80) 并且在所述密封间隙(LS)的内部设置有气氛或真空气氛的同时,所述间隙(LS)借助于第二绝缘区域(100)密封。

    Bipolar transistor
    13.
    发明申请
    Bipolar transistor 有权
    双极晶体管

    公开(公告)号:US20060040453A1

    公开(公告)日:2006-02-23

    申请号:US11246420

    申请日:2005-10-07

    Abstract: A bipolar transistor comprising a collector region of a first conduction type, and a subcollector region of the first conduction type at a first side of the collector region. The transistor further includes a base region of the second conduction type provided at a second side of the collector region, and an emitter region of the first conduction type which is provided above the base region on the side remote from the collection region. A carbon-doped semiconductor region is provided on the first side alongside the collector region. The bipolar transistor is characterized in that the carbon-doped semiconductor region has a carbon concentration of 1019-1021 cm−3 and the base region has a smaller cross section than the collector region and the collector region has, in the overlap region with the base region, a region having an increased doping compared with the remaining region. The carbon-doped semiconductor region prevents an outdiffusion from the zone of the collector region into the remaining region of the collector region.

    Abstract translation: 包括第一导电类型的集电极区域和在集电极区域的第一侧的第一导电类型的子集电极区域的双极晶体管。 晶体管还包括设置在集电极区域的第二侧的第二导电类型的基极区域和设置在远离收集区域的一侧的基极区域上方的第一导电类型的发射极区域。 在集电极区域旁边的第一侧设置碳掺杂半导体区域。 双极晶体管的特征在于,碳掺杂半导体区域的碳浓度为10〜20±0.01cm -3,基极 区域具有比集电极区域更小的横截面,并且在与基极区域的重叠区域中具有与剩余区域相比具有增加的掺杂的区域。 碳掺杂半导体区域防止从集电极区域向集电极区域的剩余区域的扩散。

    High-frequency bipolar transistor and method for the production thereof
    14.
    发明申请
    High-frequency bipolar transistor and method for the production thereof 有权
    高频双极晶体管及其制造方法

    公开(公告)号:US20060038258A1

    公开(公告)日:2006-02-23

    申请号:US11254502

    申请日:2005-10-20

    CPC classification number: H01L29/66272 H01L29/0821 H01L29/41708 H01L29/732

    Abstract: A high-frequency bipolar transistor includes an emitter contact adjoining an emitter connection region, a base contact adjoining a base connection region, and a collector contact adjoining a collector connection region. A first insulation layer is disposed on the base connection region. The collector connection region contains a buried layer, which connects the collector contact to a collector zone. A silicide or salicide region is provided on the buried layer and connects the collector contact to the collector zone in a low-impedance manner. A second insulation layer is disposed on the collector connection region but not on the silicide region.

    Abstract translation: 高频双极晶体管包括邻接发射极连接区域的发射极接触件,邻接基极连接区域的基极接触件和邻接集电极连接区域的集电极接触件。 第一绝缘层设置在基底连接区域上。 集电极连接区域包含埋设层,该埋层将集电极触点连接到集电区。 在掩埋层上提供硅化物或自对准硅化物区域,并以低阻抗方式将集电极触点连接到集电极区域。 第二绝缘层设置在集电极连接区域上,但不在硅化物区域上。

    Method for manufacturing a laterally limited, single-crystal region on a
substrate and the employment thereof for the manufacture of an MOS
transistor and a bipolar transistor
    16.
    发明授权
    Method for manufacturing a laterally limited, single-crystal region on a substrate and the employment thereof for the manufacture of an MOS transistor and a bipolar transistor 失效
    用于制造衬底上的横向受限的单晶区域的方法及其用于制造MOS晶体管和双极晶体管的方法

    公开(公告)号:US5498567A

    公开(公告)日:1996-03-12

    申请号:US379861

    申请日:1995-04-03

    Abstract: A method for the manufacture of a laterally limited single crystal region that is suitable for use as an active part of a transistor, including the steps of: a) providing a substrate made of a single crystal semiconductor material; b) forming a first layer on a surface of the substrate, said first layer being selectively etchable with respect to the substrate; c) forming a second layer on the first layer, the second layer being selectively etchable with respect to the first layer; d) providing an opening in the first and second layers so as to expose an area on the surface of the substrate; e) selectively etching the first layer with respect to the substrate and the second layer so as to provide an undercut between the second layer and the surface of the substrate; f) forming a single crystal region on the exposed surface of the substrate by selective epitaxy: g) doping the second layer such that parts of the second layer adjoining the single-crystal region acting as a channel region form a source region and a drain region; h) producing a gate dielectric at a surface of the single-crystal region; and i) forming a gate electrode that is insulated from the source and drain regions on the gate dielectric.

    Abstract translation: 一种用于制造适合用作晶体管的有源部分的横向受限单晶区域的方法,包括以下步骤:a)提供由单晶半导体材料制成的衬底; b)在所述衬底的表面上形成第一层,所述第一层相对于所述衬底可选择性地蚀刻; c)在所述第一层上形成第二层,所述第二层可相对于所述第一层选择性地蚀刻; d)在所述第一层和所述第二层中设置开口以暴露所述基底表面上的区域; e)相对于所述基底和所述第二层选择性地蚀刻所述第一层,以便在所述第二层和所述基底的表面之间提供底切; f)通过选择性外延在衬底的暴露表面上形成单晶区域:g)掺杂第二层,使得与用作沟道区的单晶区相邻的第二层的部分形成源区和漏区 ; h)在单晶区域的表面产生栅电介质; 以及i)形成与栅极电介质上的源极和漏极区域绝缘的栅电极。

    Method for manufacturing a laterally limited, single-crystal region on a
substrate and the employment thereof for the manufacture of an MOS
transistor and a bipolar transistor
    17.
    发明授权
    Method for manufacturing a laterally limited, single-crystal region on a substrate and the employment thereof for the manufacture of an MOS transistor and a bipolar transistor 失效
    用于制造衬底上的横向受限的单晶区域的方法及其用于制造MOS晶体管和双极晶体管的方法

    公开(公告)号:US5422303A

    公开(公告)日:1995-06-06

    申请号:US185514

    申请日:1994-01-24

    Abstract: A method for the manufacture of a laterally limited single crystal region that is suitable for use as an active part of a transistor, including the steps of: a) providing a substrate made of a single crystal semiconductor material; b) forming a first layer on a surface of the substrate, said first layer being selectively etchable with respect to the substrate; c) forming a second layer on the first layer, the second layer being selectively etchable with respect to the first layer; d) providing an opening in the first and second layers so as to expose an area on the surface of the substrate; e) covering surfaces and sidewalls of the second layer with a third layer f) selectively etching the first layer with respect to the substrate and the second layer and the third layer so as to provide an undercut between the second layer and the surface of the substrate; g) forming a single crystal region on the exposed surface of the substrate by selective epitaxy without nucleation occurring at the surface of the third layer; h) forming a collector in the substrate under the single-crystal region; i) forming a base in the single-crystal region; j) doping and configuring the second layer such that it forms a base terminal; and k) forming an emitter above the base.

    Abstract translation: 一种用于制造适合用作晶体管的有源部分的横向受限单晶区域的方法,包括以下步骤:a)提供由单晶半导体材料制成的衬底; b)在所述衬底的表面上形成第一层,所述第一层相对于所述衬底可选择性地蚀刻; c)在所述第一层上形成第二层,所述第二层可相对于所述第一层选择性地蚀刻; d)在所述第一层和所述第二层中设置开口以暴露所述基底表面上的区域; e)用第三层覆盖第二层的表面和侧壁f)相对于衬底和第二层和第三层选择性地蚀刻第一层,以便在第二层和衬底的表面之间提供底切 ; g)通过选择性外延在第三层的表面上没有成核而在衬底的暴露表面上形成单晶区; h)在单晶区域下在衬底中形成集电体; i)在单晶区域形成碱; j)掺杂和配置第二层,使得它形成基极; 和k)在基底上形成发射体。

    HIGH-FREQUENCY BIPOLAR TRANSISTOR AND METHOD FOR THE PRODUCTION THEREOF
    18.
    发明申请
    HIGH-FREQUENCY BIPOLAR TRANSISTOR AND METHOD FOR THE PRODUCTION THEREOF 有权
    高频双极晶体管及其生产方法

    公开(公告)号:US20100155896A1

    公开(公告)日:2010-06-24

    申请号:US12716692

    申请日:2010-03-03

    CPC classification number: H01L29/66272 H01L29/0821 H01L29/41708 H01L29/732

    Abstract: A high-frequency bipolar transistor includes an emitter contact adjoining an emitter connection region, a base contact adjoining a base connection region, and a collector contact adjoining a collector connection region. A first insulation layer is disposed on the base connection region. The collector connection region contains a buried layer, which connects the collector contact to a collector zone. A silicide or salicide region is provided on the buried layer and connects the collector contact to the collector zone in a low-impedance manner. A second insulation layer is disposed on the collector connection region but not on the silicide region.

    Abstract translation: 高频双极晶体管包括邻接发射极连接区域的发射极接触件,邻接基极连接区域的基极接触件和邻接集电极连接区域的集电极接触件。 第一绝缘层设置在基底连接区域上。 集电极连接区域包含埋设层,该埋层将集电极触点连接到集电区。 在掩埋层上提供硅化物或自对准硅化物区域,并以低阻抗方式将集电极触点连接到集电极区域。 第二绝缘层设置在集电极连接区域上,但不在硅化物区域上。

    Method for producing a transistor structure
    19.
    发明授权
    Method for producing a transistor structure 有权
    晶体管结构的制造方法

    公开(公告)号:US07371650B2

    公开(公告)日:2008-05-13

    申请号:US10532894

    申请日:2003-10-24

    CPC classification number: H01L29/66272 H01L21/8222 H01L27/0825 H01L29/0821

    Abstract: A method for fabricating a transistor structure with a first and a second bipolar transistor having different collector widths is presented. The method includes providing a semiconductor substrate, introducing a first buried layer of the first bipolar transistor and a second buried layer of the second bipolar transistor into the semiconductor substrate, and producing at least a first collector region having a first collector width on the first buried layer and a second collector region having a second collector width on the second buried layer. A first collector zone having a first thickness is produced on the second buried layer for production of the second collector width. A second collector zone having a second thickness is produced on the first collector zone. At least one insulation region is produced that isolates at least the collector regions from one another.

    Abstract translation: 提出了一种制造具有不同集电极宽度的第一和第二双极晶体管的晶体管结构的方法。 该方法包括提供半导体衬底,将第一双极晶体管的第一掩埋层和第二双极晶体管的第二掩埋层引入到半导体衬底中,并且至少在第一掩埋层上产生具有第一集电极宽度的第一集电极区域 层和在第二掩埋层上具有第二集电极宽度的第二集电极区。 在第二掩埋层上产生具有第一厚度的第一收集器区,用于产生第二收集器宽度。 在第一收集器区域上产生具有第二厚度的第二收集器区域。 产生至少一个绝缘区域,其至少隔离收集器区域彼此。

    Bipolar transistor
    20.
    发明授权
    Bipolar transistor 有权
    双极晶体管

    公开(公告)号:US07135757B2

    公开(公告)日:2006-11-14

    申请号:US10912344

    申请日:2004-08-04

    CPC classification number: H01L29/66287 H01L29/7322

    Abstract: A bipolar transistor includes a first layer with a collector. A second layer has a base cutout for a base. A third layer includes a lead for the base. The third layer is formed with an emitter cutout for an emitter. An undercut is formed in the second layer adjoining the base cutout. The base is at least partially located in the undercut. In order to obtain a low transition resistance between the lead and the base, an intermediate layer is provided between the first and the second layer. The intermediate layer is selectively etchable with respect to the second layer. At least in the region of the undercut between the lead and the base, a base connection zone is provided that can be adjusted independent of other production conditions. The intermediate layer is removed in a contact region with the base.

    Abstract translation: 双极晶体管包括具有集电极的第一层。 第二层具有用于基座的基部切口。 第三层包括用于底座的引线。 第三层形成有用于发射极的发射极切口。 在与基座切口相邻的第二层中形成底切。 基部至少部分位于底切中。 为了在引线和基底之间获得低的过渡电阻,在第一和第二层之间设置中间层。 中间层相对于第二层可选择性地蚀刻。 至少在引线和基座之间的底切区域中,提供可以独立于其他生产条件进行调节的基础连接区域。 在与基底的接触区域中去除中间层。

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