Abstract:
A transfer chamber is provided between a processing unit for performing a predetermined process on a target substrate to be processed in a depressurized environment and an atmospheric maintaining unit for maintaining the target substrate in an atmospheric environment to transfer the target substrate therebetween. The transfer chamber includes a chamber main body for accommodating the target substrate, a gas exhaust unit for exhausting the chamber main body to set the chamber main body to the depressurized environment, and a gas supply unit for supplying a predetermined gas to the chamber main body to set the chamber main body in the atmospheric environment. Further, in the transfer chamber, an ionization unit is provided outside the chamber main body, for ionizing the predetermined gas and an ionized gas supply unit is provided to supply the ionized gas generated by the ionization unit to the chamber main body.
Abstract:
An inspection apparatus for inspecting an inspection target device is presented. The inspection apparatus comprises a placing table that supports the inspection target object while facing the back surface of the imaging device, and the placing table includes: a ceiling plate made of a light transmitting material and having a placing surface on which the inspection target object is placed, an irradiation part that is disposed at a position facing the inspection target object with the ceiling plate interposed therebetween and that irradiates light toward the inspection target object placed on the placing surface; and a temperature controller configured to adjusts a temperature of the inspection target device of the inspection target object placed on the placing surface.
Abstract:
An inspection apparatus for inspecting an inspection target device formed on an inspection target object. The inspection apparatus comprises a placing table configured to support the inspection target object. The placing table includes a transparent placing surface and an irradiation part disposed below the placing surface. The irradiation part includes a light guiding plate having a facing surface facing the inspection target object, and a light source part disposed in a region laterally outside from the light guiding plate and configured to emit light toward a lateral edge surface of the light guiding plate. The light guiding plate emits light from the facing surface toward the placing surface. The placing table further includes an optical member that transmits light directed from the facing surface toward the inspection target object. The optical member is divided into a plurality of regions, with light transmittance configured to be variable for each region.
Abstract:
An inspection apparatus includes a stage on which a substrate having an inspection target is placed, a probe card, a light irradiator, and a controller. The probe card has probes that supply a current to the inspection target. The light irradiator irradiates light to heat the substrate. The controller controls the light irradiator to excecute uniformly heating the inspection target by the light from the light irradiator, and heating an outer peripheral portion of the inspection target by the light from the light irradiator.
Abstract:
A stage on which an inspection object having an electronic device is placed, the electronic device being pressed against a contact terminal of a probe card of an inspection apparatus by applying a load, includes: a first cooling plate including a first coolant flow path formed in the first cooling plate; a heating source mounted on the first cooling plate and configured to heat the inspection object; a transmission member installed on the heating source and transmits light output from the heating source; and a second cooling plate installed on the transmission member, including a placement surface configured to vacuum-suction the inspection object and a second coolant flow path, made of ceramic, and subjected to a mirror polishing process on the placement surface.
Abstract:
An internal member of a plasma processing vessel includes a base material and a film formed by thermal spraying of ceramic on a surface of the base material. The film is formed of ceramic which includes at least one kind of element selected from the group consisting of B, Mg, Al, Si, Ca, Cr, Y, Zr, Ta, Ce and Nd. In addition, at least a portion of the film is sealed by a resin.
Abstract:
There is provided an LED chuck comprising: a top plate on which an object to be inspected is mounted; an LED array substrate disposed to face the object to be inspected, and provided with a plurality of LEDs for heating the object to be inspected that is mounted on the top plate; a cooling plate disposed on a back side of the LED array substrate; an LED control substrate disposed on a back side of the cooling plate and controlling the plurality of LEDs; and a base plate disposed to surround the LED control substrate. A surface of the cooling plate facing the LED control substrate and a surface of the base plate facing the LED control substrate are formed of a magnetic material.
Abstract:
An inspection apparatus includes: an acquisition part configured to acquire first coordinate information indicating a position of an inspection object on a stage and a plurality of pieces of second coordinate information indicating positions of a plurality of temperature sensors on the stage when performing an inspection of the inspection object; a calculation part configured to calculate a Mahalanobis distance between a position specified by an average vector of the first coordinate information and the positions of the plurality of temperature sensors; a selection part configured to select at least one temperature sensor including a temperature sensor having a smallest Mahalanobis distance, among the plurality of temperature sensors; and a controller configured to control a temperature of the inspection object using temperature data measured by the selected at least one temperature sensor.
Abstract:
This inspection apparatus is for inspecting an inspection subject device. The inspection subject device is formed on an object to be inspected, and is a reverse-side irradiation-type imaging device into which light enters from the reverse side opposite to the side where a wiring layer is provided. This inspection apparatus has: a placement table having a transparent surface on which the object to be inspected is placed; a light irradiation mechanism that is provided in the placement table and that irradiates the to-be-inspected object placed on the placement table with light through the placement surface; and an acquisition unit that acquires in-plane distribution of illuminance of light from the placement table.
Abstract:
A dummy wafer includes a planar heater and a pair of plate-shaped members formed of an aluminum alloy, aluminum, or silicon carbide, wherein the planar heater is sandwiched by the plate-shaped members.