公开(公告)号：US11510284B2

公开(公告)日：2022-11-22

申请号：US16583662

申请日：2019-09-26

Applicant: Tokyo Electron Limited

Inventor： Satoshi Morita ,  Masami Akimoto ,  Katsuhiro Morikawa ,  Kouichi Mizunaga ,  Kouzou Kawahara

IPC: H05B3/68 ,  H05B1/02 ,  H01L21/687 ,  H01L21/67

Abstract: A substrate processing apparatus includes a rotary table configured to hold and rotate a substrate; an electronic component provided at the rotary table and configured to be rotated along with the rotary table; a first electrode unit provided at the rotary table and configured to be rotated along with the rotary table, the first electrode unit comprising multiple first electrodes electrically connected to the electronic component via multiple first conductive lines; an electric device configured to perform a power supply to the electronic component and a transmission/reception of signals; a second electrode unit comprising multiple second electrodes electrically connected to the electric device via multiple second conductive lines and arranged at positions respectively corresponding to the multiple first electrodes to be brought into contact with the multiple first electrodes; and an electrode moving device configured to connect/disconnect the first electrode unit to/from the second electrode unit.

公开(公告)号：US20220056590A1

公开(公告)日：2022-02-24

申请号：US17279748

申请日：2019-09-26

Applicant: Tokyo Electron Limited

Inventor： Satoshi Morita ,  Masami Akimoto ,  Katsuhiro Morikawa ,  Kouichi Mizunaga ,  Mitsuaki Iwashita ,  Satoshi Kaneko

IPC: C23C18/16 ,  C23C16/455 ,  H01L21/02

Abstract: A substrate processing apparatus includes a rotation driving mechanism configured to rotate a rotary table configured to hold a substrate; an electric heater provided in the rotary table to be rotated along with the rotary table and configured to heat the substrate; a power receiving electrode provided in the rotary table to be rotated along with the rotary table and electrically connected to the electric heater; a power feeding electrode configured to be contacted with the power receiving electrode and configured to supply a power to the electric heater via the power receiving electrode; an electrode moving mechanism; a power feeder configured to supply the power to the power feeding electrode; a processing cup surrounding the rotary table; at least one processing liquid nozzle configured to supply a processing liquid; a processing liquid supply mechanism configured to supply at least an electroless plating liquid; and a controller.

公开(公告)号：US10707109B2

公开(公告)日：2020-07-07

申请号：US16137728

申请日：2018-09-21

Applicant: Tokyo Electron Limited

Inventor： Satoshi Morita ,  Ryoji Ikebe ,  Yasuaki Noda ,  Norihisa Koga ,  Keisuke Hamamoto ,  Masato Hosaka

IPC: H01L21/67 ,  H01L21/68 ,  B65G21/10 ,  H01L23/544 ,  G06T7/00 ,  H01L21/687

Abstract: A substrate processing apparatus includes carry in/out station, transfer station, processing station, and image capturing unit. The carry in/out station includes first conveyance device that takes out and conveys substrate from cassette. The transfer station is disposed adjacent to the carry in/out station, and includes substrate placement unit on which the substrate conveyed by the first conveyance device is placed. The processing station is disposed adjacent to the transfer station, and includes second conveyance device that takes out and conveys the substrate from the substrate placement unit, and a plurality of processing units that processes the substrate conveyed by the second conveyance device. The image capturing unit is disposed in the transfer station, and captures an image of the peripheral edge portion of one of the upper and lower surfaces of the substrate and the end surface of the substrate.

公开(公告)号：US20170287703A1

公开(公告)日：2017-10-05

申请号：US15454154

申请日：2017-03-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/02 ,  G03B17/08 ,  G03B13/32 ,  H01L21/67 ,  B08B3/08

CPC classification number: H01L21/02087 ,  B08B3/08 ,  G03B13/32 ,  G03B17/08 ,  H01L21/6704 ,  H01L21/6708 ,  H01L21/67253 ,  H01L21/67259 ,  H01L22/12 ,  H01L22/20

Abstract: Imaging can be performed well even when an imaging device is disposed at a position facing a peripheral portion of a substrate. A substrate processing apparatus 16 which performs a processing of removing a film on a peripheral portion of a substrate W includes a rotating/holding unit 210 configured to hold and rotate the substrate; a first processing liquid supply unit 250A configured to supply a first processing liquid for removing the film onto the peripheral portion of the substrate while the substrate is being rotated in a first rotational direction R1 by the rotating/holding unit; and an imaging unit 270 provided at a position in front of an arrival region 902 of the first processing liquid on the substrate with respect to the first rotational direction R1, and configured to image the peripheral portion of the substrate.

公开(公告)号：US12300524B2

公开(公告)日：2025-05-13

申请号：US17242709

申请日：2021-04-28

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/68

Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.

公开(公告)号：US11551945B2

公开(公告)日：2023-01-10

申请号：US16583550

申请日：2019-09-26

Applicant: Tokyo Electron Limited

Inventor： Katsuhiro Morikawa ,  Masami Akimoto ,  Satoshi Morita ,  Kouichi Mizunaga

IPC: H01L21/67 ,  H01L21/304 ,  B08B3/04 ,  H01L21/02

Abstract: A substrate processing apparatus includes a rotation driving device configured to rotate a rotary table holding a substrate; a processing liquid nozzle configured to supply a processing liquid onto a top surface of the substrate; an electric heater provided at a top plate and configured to heat the substrate through the top plate; an electronic component configured to perform a power feed to the electric heater and transmission/reception of a control signal for the electric heater; and a periphery cover body connected to a peripheral portion of the top plate to be rotated along with the top plate. An accommodation space in which the electronic component is accommodated is formed under the top plate. The accommodation space is surrounded by a surrounding structure including the top plate and the periphery cover body. A gap between the peripheral portion of the top plate and the periphery cover body is sealed.

公开(公告)号：US11208725B2

公开(公告)日：2021-12-28

申请号：US16583628

申请日：2019-09-26

Applicant: Tokyo Electron Limited

Inventor： Kouichi Mizunaga ,  Masami Akimoto ,  Satoshi Morita ,  Katsuhiro Morikawa

IPC: C23C18/16 ,  H01L21/683 ,  H01L21/67 ,  B05C13/02

Abstract: A substrate processing apparatus includes a rotary table comprising a base plate having a front surface where at least one suction hole is provided and an attraction plate having a front surface contacted with a non-processing surface of a substrate to attract the substrate, a rear surface contacted with the front surface of the base plate, and at least one through hole through which the front surface and the rear surface are connected; a rotation driving device configured to rotate the rotary table around a rotation axis; and a suction device configured to act a suction force on the suction hole, to contact the base plate with the attraction plate by acting the suction force between the base plate and the attraction plate, and to firmly contact the attraction plate with the substrate by acting the suction force between the attraction plate and the substrate through the through hole.

公开(公告)号：US11018035B2

公开(公告)日：2021-05-25

申请号：US16154936

申请日：2018-10-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/66 ,  H01L21/67 ,  H01L21/68

Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.

公开(公告)号：US10217628B2

公开(公告)日：2019-02-26

申请号：US15454154

申请日：2017-03-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: B08B3/08 ,  H01L21/02 ,  H01L21/67 ,  G03B13/32 ,  G03B17/08

Abstract: Imaging can be performed well even when an imaging device is disposed at a position facing a peripheral portion of a substrate. A substrate processing apparatus 16 which performs a processing of removing a film on a peripheral portion of a substrate W includes a rotating/holding unit 210 configured to hold and rotate the substrate; a first processing liquid supply unit 250A configured to supply a first processing liquid for removing the film onto the peripheral portion of the substrate while the substrate is being rotated in a first rotational direction R1 by the rotating/holding unit; and an imaging unit 270 provided at a position in front of an arrival region 902 of the first processing liquid on the substrate with respect to the first rotational direction R1, and configured to image the peripheral portion of the substrate.

公开(公告)号：US20190043742A1

公开(公告)日：2019-02-07

申请号：US16154936

申请日：2018-10-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/68

Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.