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    TRANSFER METHOD AND TRANSFER SYSTEM
    11.
    发明申请
    TRANSFER METHOD AND TRANSFER SYSTEM 审中-公开

    公开(公告)号：US20200381281A1

    公开(公告)日：2020-12-03

    申请号：US16883965

    申请日：2020-05-26

    Applicant: Tokyo Electron Limited

    Inventor： Masakazu YAMAMOTO ,  Tadashi ENOMOTO

    IPC: H01L21/673 ,  H01L21/67 ,  H01L21/677

    Abstract: A transfer method transfers a substrate between a transfer unit configured to hold and transfer the substrate and a substrate stage serving as a transfer destination or a transfer source of the substrate. The transfer method includes: acquiring positional information of the transfer unit and positional information of the substrate stage; determining whether or not there is a risk for the substrate to contact with the substrate stage, based on the acquired positional information of the transfer unit and positional information of the substrate stage; and when determined that there is a risk for the substrate to contact with the substrate stage, notifying the risk according to the determination at the determining.

    INFORMATION PROCESSING SYSTEM, POWER ADJUSTMENT METHOD, AND HEAT TREATMENT APPARATUS
    13.
    发明公开
    INFORMATION PROCESSING SYSTEM, POWER ADJUSTMENT METHOD, AND HEAT TREATMENT APPARATUS 审中-公开

    公开(公告)号：US20240063034A1

    公开(公告)日：2024-02-22

    申请号：US18229471

    申请日：2023-08-02

    Applicant: Tokyo Electron Limited

    Inventor： Masakazu YAMAMOTO ,  Tadashi ENOMOTO ,  Hiroyuki KARASAWA

    IPC: H01L21/67

    CPC classification number: H01L21/67109 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/6719

    Abstract: An information processing system includes a heat treatment apparatus that forms a film on a processing target substrate by using a heating unit that heats the processing target substrate inside a processing container, and an information processing apparatus that controls power supplied to the heating part, the information processing system comprising a prediction unit configured to predict an influence of a cumulative film adhering inside the processing container, on a temperature of the processing target substrate by using a simulation model of the heat treatment apparatus and an adjuster configured to adjust the power supplied to the heating part based on the predicted influence of the cumulative film adhering inside the processing container, on the temperature of the processing target substrate.

    INFORMATION PROCESSING APPARATUS, TRANSFER POSITION TEACHING METHOD AND SUBSTRATE PROCESSING APPARATUS
    16.
    发明申请
    INFORMATION PROCESSING APPARATUS, TRANSFER POSITION TEACHING METHOD AND SUBSTRATE PROCESSING APPARATUS 有权

    公开(公告)号：US20220383536A1

    公开(公告)日：2022-12-01

    申请号：US17824730

    申请日：2022-05-25

    Applicant: Tokyo Electron Limited

    Inventor： Tadashi ENOMOTO ,  Nao AKASHI ,  Yutai MATSUHASHI

    IPC: G06T7/70 ,  G06T7/00 ,  H01L21/68 ,  H01L21/677

    Abstract: An information processing apparatus of a substrate processing apparatus including a transport device includes an image data acquisition unit that acquires image data of a disposing position of a processing target substrate, a first image processing unit that digitizes a positional relationship among the transport source object, the transport device, and the substrate, a second image processing unit that digitizes a positional relationship among the transport destination object, the transport device, and the substrate, a first transfer teaching unit that outputs first correction data of the moving operation of the transport device of receiving the substrate from the transport source object, and a second transfer teaching unit that outputs second correction data of the moving operation of the transport device of disposing the substrate in the transport destination object.

    VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD
    17.
    发明申请
    VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD 有权
    真空加工设备和真空加工方法

    公开(公告)号：US20150203965A1

    公开(公告)日：2015-07-23

    申请号：US14591245

    申请日：2015-01-07

    Applicant: Tokyo Electron Limited

    Inventor： Tadashi ENOMOTO ,  Kiichi TAKAHASHI ,  Keiichi TANAKA

    IPC: C23C16/455 ,  C23C16/44 ,  H01L21/02 ,  C23C16/458

    CPC classification number: H01L21/0228 ,  C23C16/4412 ,  C23C16/45551 ,  C23C16/4584 ,  H01L21/67748 ,  H01L21/68742 ,  H01L21/68764 ,  H01L21/68771

    Abstract: A vacuum processing apparatus is configured to include a process chamber, a turntable provided in the process chamber, and a substrate receiving area provided in one surface of the turntable and including a regulation part formed therearound to regulate a position of a substrate. A transfer mechanism is provided outside the process chamber, and a lifting member is configured to support the substrate and to move up and down in order to transfer the substrate between the transfer mechanism and the turntable. An exhaust mechanism is configured to selectively evacuate a gap between the substrate receiving area and the substrate before the lifting member places the substrate on the substrate receiving area.

    Abstract translation: 真空处理装置被配置为包括处理室，设置在处理室中的转台和设置在转台的一个表面中的基板接收区域，并且包括在其周围形成的调节部分以调节基板的位置。 传送机构设置在处理室外部，并且提升构件被构造成支撑基板并且上下移动，以便在传送机构和转台之间传送基板。 排气机构构造成在提升构件将基板放置在基板接收区域之前选择性地排空基板接收区域和基板之间的间隙。

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