公开(公告)号：US20180151343A1

公开(公告)日：2018-05-31

申请号：US15824274

申请日：2017-11-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Yoshiki OKAMOTO ,  Hayato HOSAKA ,  Teruhiko KODAMA ,  Akihiro KUBO ,  Ryuto OZASA ,  Yuji ARIUCHI ,  Shinsuke KIMURA

IPC: H01L21/02 ,  H01L21/687 ,  H01L21/67 ,  G03F7/20

CPC classification number: H01L21/02016 ,  G03F7/70691 ,  H01L21/0209 ,  H01L21/67046 ,  H01L21/67219 ,  H01L21/67225 ,  H01L21/67288 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/6875 ,  H01L21/68764 ,  H01L21/68792

Abstract: A substrate processing apparatus includes: a first holding part configured to hold a substrate; a second holding part configured to hold the substrate; a sliding member configured to rotate about a vertical axis so that the sliding member slides on a back surface of the substrate; a revolution mechanism configured to revolve the sliding member under rotation about a vertical revolution axis; and a relative movement mechanism configured to horizontally move a relative position between the substrate and a revolution trajectory of the sliding member so that when the substrate is held by the first holding part, the sliding member slides on a central portion of the back surface of the substrate, and when the substrate is held by the second holding part, the sliding member slides on the peripheral portion of the back surface of the substrate under rotation.

公开(公告)号：US20170090305A1

公开(公告)日：2017-03-30

申请号：US15378491

申请日：2016-12-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Ryoichi UEMURA ,  Yasushi TAKIGUCHI

IPC: G03F7/20 ,  B08B3/02 ,  G01B11/02 ,  H01L21/67

CPC classification number: G03F7/70925 ,  B08B3/024 ,  G01B11/02 ,  G03F7/422 ,  H01L21/67051

Abstract: A substrate cleaning method includes: a first step in which a cleaning liquid is ejected from a nozzle N2 to a central portion of a wafer W; a second step in which a dry gas is ejected from a nozzle N3 to the central portion of the wafer W to form a dry area; a third step in which the cleaning liquid is ejected from the nozzle N2 while the nozzle N2 is moved from a central side of the wafer W to a peripheral side thereof; a fourth step in which a width of an intermediate area generated between a wet area and the dry area is acquired; and a fifth step in which, when the width of the intermediate area exceeds a predetermined threshold value, a process parameter is changed such that the width of the intermediate area becomes the threshold value or less.

公开(公告)号：US20170045821A1

公开(公告)日：2017-02-16

申请号：US15338638

申请日：2016-10-31

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kousuke YOSHIHARA ,  Hideharu KYOUDA ,  Koshi MUTA ,  Taro YAMAMOTO ,  Yasushi TAKIGUCHI

IPC: G03F7/30 ,  B05C5/02 ,  B05C11/08 ,  B05D1/00

CPC classification number: G03F7/30 ,  B05C5/02 ,  B05C5/0287 ,  B05C11/08 ,  B05D1/005 ,  B05D1/26 ,  G03F7/3021 ,  H01L21/6715

Abstract: A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.

Abstract translation: 显影装置包括：水平保持基板的基板支架; 显影剂喷嘴，其将显影剂供应到所述基板上以形成液体熔池; 旋转流产生机构，其包括旋转构件，所述旋转构件在所述旋转构件与所述液体熔池接触的同时围绕垂直于所述基板的轴旋转，从而在形成在所述基板上的所述显影剂的液体池中产生转向流; 以及用于沿着基板的表面移动转向流产生机构的移动机构。 可以通过在衬底的期望区域中形成转向流并搅拌显影剂来改善图案的线宽均匀性。

公开(公告)号：US20150194301A1

公开(公告)日：2015-07-09

申请号：US14570151

申请日：2014-12-15

Applicant: TOKYO ELECTRON LIMITED

Inventor： Ryoichi UEMURA ,  Yasushi TAKIGUCHI

IPC: H01L21/02 ,  G01B11/02 ,  B08B3/08 ,  H01L21/67 ,  B08B3/02

CPC classification number: G03F7/70925 ,  B08B3/024 ,  G01B11/02 ,  G03F7/422 ,  H01L21/67051

Abstract: A substrate cleaning method includes: a first step in which a cleaning liquid is ejected from a nozzle N2 to a central portion of a wafer W; a second step in which a dry gas is ejected from a nozzle N3 to the central portion of the wafer W to form a dry area; a third step in which the cleaning liquid is ejected from the nozzle N2 while the nozzle N2 is moved from a central side of the wafer W to a peripheral side thereof; a fourth step in which a width of an intermediate area generated between a wet area and the dry area is acquired; and a fifth step in which, when the width of the intermediate area exceeds a predetermined threshold value, a process parameter is changed such that the width of the intermediate area becomes the threshold value or less.

Abstract translation: 基板清洗方法包括：第一步骤，其中清洗液体从喷嘴N2喷射到晶片W的中心部分; 第二步骤，其中干燥气体从喷嘴N3喷射到晶片W的中心部分以形成干燥区域; 第三步骤，其中喷嘴N2从晶片W的中心侧移动到其周边，从喷嘴N2喷出清洗液; 第四步骤，其中获得在湿区域和干燥区域之间产生的中间区域的宽度; 以及第五步骤，当中间区域的宽度超过预定阈值时，改变处理参数，使得中间区域的宽度变为阈值以下。

公开(公告)号：US20150036110A1

公开(公告)日：2015-02-05

申请号：US14450704

申请日：2014-08-04

Applicant: Tokyo Electron Limited

Inventor： Kousuke YOSHIHARA ,  Hideharu KYOUDA ,  Koshi MUTA ,  Taro YAMAMOTO ,  Yasushi TAKIGUCHI

IPC: G03F7/30

CPC classification number: G03F7/30 ,  B05C5/02 ,  B05C5/0287 ,  B05C11/08 ,  B05D1/005 ,  B05D1/26 ,  G03F7/3021 ,  H01L21/6715

Abstract: A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.

Abstract translation: 显影装置包括：水平保持基板的基板支架; 显影剂喷嘴，其将显影剂供应到所述基板上以形成液体熔池; 旋转流产生机构，其包括旋转构件，所述旋转构件在所述旋转构件与所述液体熔池接触的同时围绕垂直于所述基板的轴旋转，从而在形成在所述基板上的所述显影剂的液体池中产生转向流; 以及用于沿着基板的表面移动转向流产生机构的移动机构。 可以通过在衬底的期望区域中形成转向流并搅拌显影剂来改善图案的线宽均匀性。