公开(公告)号：US06817878B2

公开(公告)日：2004-11-16

申请号：US10032329

申请日：2001-12-31

Applicant: Christopher D. Combs ,  George Arrigotti ,  Ralyomand F. Aspandiar ,  Tom E. Pearson

Inventor： Christopher D. Combs ,  George Arrigotti ,  Ralyomand F. Aspandiar ,  Tom E. Pearson

IPC: H01R1362

CPC classification number: H01R12/725 ,  H01R12/88

Abstract: A zero mounting force solder-free connector/component and method.

Abstract translation: 零安装力无焊接连接器/部件和方法。

公开(公告)号：US06791189B2

公开(公告)日：2004-09-14

申请号：US10313238

申请日：2002-12-05

Applicant: Tom E. Pearson ,  Christopher D. Combs ,  Arjang Fartash ,  Raiyomand Aspandiar

Inventor： Tom E. Pearson ,  Christopher D. Combs ,  Arjang Fartash ,  Raiyomand Aspandiar

IPC: H01L2348

CPC classification number: H05K3/305 ,  H01L2924/15151 ,  H05K3/3415 ,  H05K2201/09072 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned onto an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. Being formed from an epoxy material, the retainer is configured to be coupled with a component, which is then positioned onto a printed circuit board. During a subsequent solder reflow stage, an ambient temperature surrounding the printed circuit board increases, and the epoxy material is configured to enter a semi-liquid state, flowing onto, and adhering with, the printed circuit board. Upon reaching a typical solder reflow temperature, the liquefied epoxy material is configured to cure or harden, adhesively coupling the component with the printed circuit board. Thereby, the component is inhibited from separating from the printed circuit board when the printed circuit board is subsequently inverted, populated, and reflowed.

Abstract translation: 一种在随后位于双面印刷电路板的相对侧上的其它部件的回流焊接及其制造和使用双面印刷电路板的相对侧的其它部件的回焊期间将组装部件保持在双面印刷电路板的一侧上的装置。 由环氧树脂材料形成，保持器被构造成与部件联接，然后将其定位在印刷电路板上。 在随后的回流焊步骤期间，印刷电路板周围的环境温度升高，并且环氧树脂材料被配置为进入半液态，流到印刷电路板上并与印刷电路板粘附。 在达到典型的回流焊温度时，液化环氧树脂材料被配置成固化或硬化，将组件与印刷电路板粘合地连接。 因此，当印刷电路板随后被倒置，填充和回流时，该部件被禁止与印刷电路板分离。

公开(公告)号：US06734371B2

公开(公告)日：2004-05-11

申请号：US09964812

申请日：2001-09-28

Applicant: George Arrigotti ,  Tom E. Pearson ,  Raiyomand F. Aspandiar ,  Christopher D. Combs

Inventor： George Arrigotti ,  Tom E. Pearson ,  Raiyomand F. Aspandiar ,  Christopher D. Combs

IPC: H05K116

CPC classification number: H05K3/308 ,  H01L23/4093 ,  H01L2224/16

Abstract: An anchoring mechanism and method are provided for securing a component to a printed circuit board. The anchoring mechanism may include a loop, a first leg extending from the loop, and a second leg extending from the loop. The first leg may mount through a first hole of the printed circuit board and include a compressible section to compress when inserted into the first hole and to expand after passing through the first hole. The compressible section of the first leg may support solder between the anchoring mechanism and the first hole. Likewise, the second leg may mount through a second hole of the printed circuit board and include a compressible section to compress when inserted into the second hole and to expand after passing through the second hole. The compressible section of the second leg may support solder between the anchoring mechanism and the second hole.

公开(公告)号：US06691407B2

公开(公告)日：2004-02-17

申请号：US10020859

申请日：2001-12-13

Applicant: Tom E. Pearson ,  Christopher D. Combs ,  Arjang Fartash ,  Raiyomand Aspandiar

Inventor： Tom E. Pearson ,  Christopher D. Combs ,  Arjang Fartash ,  Raiyomand Aspandiar

IPC: H05K332

CPC classification number: H05K3/305 ,  H01L2924/15151 ,  H05K3/3415 ,  H05K2201/09072 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A method to retain an assembled component on one side of a double-sided printed circuit board. In one embodiment, an adhesive body, in a solid state, is coupled with a component by disposing a coupling member extending from said component within a channel formed in said adhesive body such that the coupling member is engaged with at least one engaging member, said at least one engaging member each extending into said channel from an internal surface defining said channel. The component is then assembled onto a printed circuit board and adhered onto the printed circuit board via the adhesive body when the adhesive body is in semi-liquid state.

Abstract translation: 一种在双面印刷电路板的一侧上保持组装的部件的方法。 在一个实施例中，固体状态的粘合剂体通过将形成在所述粘合体中的通道中的所述部件延伸的连接部件与部件联接，使得所述连接部件与至少一个接合部件接合，所述接合部件 每个至少一个接合构件从限定所述通道的内表面延伸到所述通道中。 然后当粘合体处于半液态时，将组件组装到印刷电路板上并通过粘合体粘附到印刷电路板上。

公开(公告)号：US06791035B2

公开(公告)日：2004-09-14

申请号：US10080438

申请日：2002-02-21

Applicant: Thomas E. Pearson ,  George L. Arrigotti ,  Raiyomand F. Aspandiar ,  Christopher D. Combs

Inventor： Thomas E. Pearson ,  George L. Arrigotti ,  Raiyomand F. Aspandiar ,  Christopher D. Combs

IPC: H05K111

CPC classification number: H05K3/3436 ,  H01L2224/16225 ,  H01R12/52 ,  H05K2201/10378 ,  H05K2203/0228 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An interposer to couple a microelectronic device package to a motherboard is formed from a PCB substrate. Multiple via holes are drilled through a copper-clad PCB substrate and then coated inside with copper. The copper surface coating is etched to form multiple traces. In one embodiment, the substrate is cut through each row of via holes and between each row of via holes to produce multiple individual beam-and-trace interposers. Two or more such interposers may be affixed together to form a beam-and-trace interposer array. Alternatively, the substrate is not cut into strips, and each via hole is filled completely with a conductive material to form an array of solid conductive columns through the substrate.

Abstract translation: 将微电子器件封装耦合到母板的插入器由PCB基板形成。 通过铜包覆PCB基板钻出多个通孔，然后用铜涂层。 铜表面涂层被蚀刻以形成多个迹线。 在一个实施例中，通过每排通孔和每排通孔之间切割基板以产生多个单独的光束和迹线插入物。 可以将两个或更多个这样的插入件固定在一起以形成光束和迹线插入器阵列。 或者，基板不被切割成条，并且每个通孔都被导电材料完全填充，以通过基板形成固体导电柱的阵列。

公开(公告)号：US06523801B2

公开(公告)日：2003-02-25

申请号：US09826560

申请日：2001-04-04

Applicant: Christopher D. Combs ,  Jay D. Hall

Inventor： Christopher D. Combs ,  Jay D. Hall

IPC: F16M1300

CPC classification number: H05K13/0069 ,  H05K3/3415

Abstract: A compliant member configured to support a substrate during automated placement of components and a tray configured to support the compliant member and removably attach to a support member.